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The chapter pays specific attention to the organizing and reorganizing process of the embedding of new technology. The aim is to increase the understanding of how a focal technology is incrementally aligned into a customer’s different business settings. Embedding becomes subject to intense organizing efforts. It becomes a struggle with activating different features of the focal technology by forging and modifying the resource interfaces between the focal technology and customer resources.

The organizing efforts are about seeking, in an explorative mood, for resource interfaces between the focal technology and the customer resources. This organizing process enables the identification of new adaptation opportunities for technology embedding processes, whereby the focal technology obtains certain feature and values.

A systematically developed knowledge of resource interfaces is a key for activating different features of the focal technology and thereby facilitating its embedding into the customer’s various business settings. This is described in a single case study in the chapter. This case and the analysis show how a supplier and a customer struggle with developing resource interface knowledge to activate the different features of the focal technology, thereby facilitating its embedding process. The first part of the chapter establishes a theoretical framework, followed in the second part by the case study and analysis. The concluding discussion emphasizes the importance of understanding and managing various interfaces as part of the organizing processes.

The purpose of this paper is to study brand embedded licensing (technology licensing and brand licensing combined) and its theoretical difference from standard licensing (technology licensing only). The following research questions are asked: What makes embedded licensing theoretically different from standard licensing, and what determines a licensor's decision to select brand embedded licensing over standard licensing?

This paper compares brand embedded licensing to standard licensing and argues that brand embedded licensing is a quasi‐hierarchical organizational structure, while standard licensing is a market‐based structure. Brand embeddedness in licensing serves as a credible commitment from the licensor and induces the licensee to invest sufficiently in complementary assets. Drawing on the transaction cost perspective, the determinants of embedded licensing are examined.

Embedded licensing is determined by both the licensee's characteristics and the licensor's brand characteristics. The licensor is more likely to utilize embedded licensing or the licensee is more willing to demand embedded licensing when: the licensee's specific complementary investment is high; the licensee's complementary capacity is high; the market entry is at a late stage; the licensor uses separate branding; the extent of product differentiation is high; and the stage of brand globalization is advanced. A strong intellectual property rights regime and a fast pace of technology change enhance the effects of these six determining factors on the licensor's selection of embedded licensing.

This paper challenges the classical view that licensing is a market‐based relationship by revealing that embedded licensing is a quasi‐hierarchical organizational structure.

This paper aims to share the current state of embedded librarianship in learning management systems as reported by academic librarians. The paper highlights the best practices, as well as continuing questions, in the field of embedded librarianship.

The authors collected participant feedback in two active, participatory panel discussions at national conferences. The open forums were centered on three guiding themes of embedded librarianship: building connections with faculty and students; utilizing technology tools; and providing information literacy and assessment. Participants answered directed questions, and their responses were recorded and analyzed for this paper.

Librarians report an increasing demand for library services in learning management systems. Collaboration and partnerships across campus are required for successful embedded librarian projects. Technology tools continue to evolve and change, and most librarians can anticipate using multiple learning management systems over time. There is an ongoing need for professional development in online library instruction and assessment.

This paper provides a snapshot of the current state of embedded librarianship in learning management systems. It offers insights about what academic librarians value, what they have learned and what concerns they still have about library instruction in online environments.

The purpose of this study is to design and fabricate a simple passive sensor circuitry embedded into a printed circuit board (PCB) and then to examine its properties.

A passive sensor transponder integrated circuit (IC) working in the high frequency (HF) 13.56 MHz frequency band was selected for this study. A loop antenna was designed to make the reported sensor circuitry readable. Next, the sensor circuitry was fabricated and embedded into a PCB with the proposed technologies. Finally, properties of the embedded structures were examined as well-functional parameters of the sensor circuitries.

The described investigation results confirmed that the proposed technologies using an epoxy resin or standard materials used for PCB’s production allowed to successfully produce sensors embedded into PCBs. This technology did not have a negative significant impact either on quality of solder joints of the assembled transponder IC or on functional properties of the embedded sensor. Apart from the identification data, the reported sensor can provide information about a selected property of its environment, e.g. temperature when its internal temperature sensitive element is used or other factors with the use of external sensitive elements, such as humidity.

It is planned to carry on the reported investigations to examine other types of sensor circuitries capable of indicating e.g. humidity level and to evaluate influence of the proposed technology on their functional properties.

The reported sensor circuitries can be successfully used in electronic industry in internet of things systems not only to identify monitored electronic devices, but also to control selected parameters of external environment. This creates opportunity to detect device malfunction by detecting local temperature growth or to analyze its environment, which might allow to predict failure of controlled products using radio waves. This advantage seems to be extremely beneficial for applications, such as space, aviation or military, in which embedded sensor systems may lead to enhancing reliability of electronic devices by reacting on occurred failures in a more efficient way.

This study demonstrates valuable information for engineers conducting research on sensor components embedded into PCBs. The reported technologies are quite simple and cost-effective because of the use of standard materials known for PCB’s production or an epoxy resin which could be treated as an additional encapsulant material enhancing mechanical properties of the embedded sensor transponder IC.

Information Technology (IT) has ushered in not only large societal opportunities but also large uncertain ‐ ties and risks. Future developments, like ubiquitous networked embedded systems, are technologies society may face. Such technologies offer larger opportunities and uncertainties because of their ability to widely distribute power through their small, inexpensive, and ubiquitous characteristics. Many interpretations of how these technologies may develop have been postulated, ranging from the conservative Precautionary Principle, to uncontrolled development leading to “singularity.” With so much uncertainty and so many predictions about the benefits and consequences of these technologies, it is important to raise ethical questions, determine potential scenarios, and try to identify appropriate decision points and stakeholders. Rather than going along an unknown path, perhaps lessons could be learned from recently deployed technologies, such as nuclear technology, that were controversial but offered similarly large potential benefits and risks. The experience of nuclear technology development, with its various successes and failures, is recalled and compared with potential scenarios in the development of networked embedded systems

This paper deals with the organizing of interactive product development. Developing products in interaction between firms may provide benefits in terms of specialization, increased innovation, and possibilities to perform development activities in parallel. However, the differentiation of product development among a number of firms also implies that various dependencies need to be dealt with across firm boundaries. How dependencies may be dealt with across firms is related to how product development is organized. The purpose of the paper is to explore dependencies and how interactive product development may be organized with regard to these dependencies.

The analytical framework is based on the industrial network approach, and deals with the development of products in terms of adaptation and combination of heterogeneous resources. There are dependencies between resources, that is, they are embedded, implying that no resource can be developed in isolation. The characteristics of and dependencies related to four main categories of resources (products, production facilities, business units and business relationships) provide a basis for analyzing the organizing of interactive product development.

Three in-depth case studies are used to explore the organizing of interactive product development with regard to dependencies. The first two cases are based on the development of the electrical system and the seats for Volvo’s large car platform (P2), performed in interaction with Delphi and Lear respectively. The third case is based on the interaction between Scania and Dayco/DFC Tech for the development of various pipes and hoses for a new truck model.

The analysis is focused on what different dependencies the firms considered and dealt with, and how product development was organized with regard to these dependencies. It is concluded that there is a complex and dynamic pattern of dependencies that reaches far beyond the developed product as well as beyond individual business units. To deal with these dependencies, development may be organized in teams where several business units are represented. This enables interaction between different business units’ resource collections, which is important for resource adaptation as well as for innovation. The delimiting and relating functions of the team boundary are elaborated upon and it is argued that also teams may be regarded as actors. It is also concluded that a modular product structure may entail a modular organization with regard to the teams, though, interaction between business units and teams is needed. A strong connection between the technical structure and the organizational structure is identified and it is concluded that policies regarding the technical structure (e.g. concerning “carry-over”) cannot be separated from the management of the organizational structure (e.g. the supplier structure). The organizing of product development is in itself a complex and dynamic task that needs to be subject to interaction between business units.

The purpose of this paper is to investigate the thermal behaviour of thin- and thick-film resistor with different dimensions and contacts embedded into printed circuit board (PCB) and compare them to the similar constructions of discrete chip resistors assembled to standard PCBs.

In investigations the thin- and thick-film embedded resistors with the bar form in different dimensions and configurations of contacts as well as rectangular chip resistors in package 0603 and 0402 were used. In tests were carried out the measurements of dissipated power in temperature of resistor about 40°C, 70°C and 155°C. The power dissipation was calculated as a multiplying of electrical current flowing through the resistor with voltage across the resistor. The dissipation of heat generated by electrical current flowing through resistors was examined by means of the FLIR A320 thermographic camera with lens Closeup×2 and the power source.

The results show that, in case of chip resistors, the intensity of heat radiation strongly depends on dimensions of copper contact lands and also depends on the dimensions of the resistor. In case of embedded resistors, with comparable dimensions to chip resistors, they have lower ability to power dissipation, as well as the copper contact lands dimensions have lower influence. The thermal radiation through resin material is not as effective as it is in case of resistors assembled on PCB. However, the embedded thick-film resistors, especially made of paste Minico M2010, have already the similar parameters to 0402 chip resistors.

Research shows that embedded resistors can be used interchangeably with SMD resistors it allows to open up space on the surface of PCB, but it should be taken into account the lower energy dissipation capabilities. It is suggested that further studies are necessary for accurately determining the thermal effects and investigate the structures of embedded passive components that allow for better heat management.

Thermal stability of embedded resistors during operation is a critical factor of success of embedded resistor technology. The way of power dissipation and heat resistance are one of the important operating parameters of these components. The results provide information about the power and the energy dissipation of embedded thin- and thick-film resistors compared to the standard surface mount technology.

Increasing packaging density and the requirement for high performance electronic devices are driving high density interconnect (HDI) printed wiring board (PWB) technology towards utilization of the inner space of a PWB for component placement. Aspocomp has been manufacturing HDI PWBs at Salo for more than 5 years. The main focus has been on higher packaging density and on accommodating the needs of future chip packages. In volume production, cost and performance have to be balanced. As a result, manufacturing and material yields, process automation, the cost of materials and added value technologies like embedded passives are key considerations in meeting the high volume requirements of the marketplace. This paper describes how these parameters have evolved over time and how it has been possible to achieve the stringent tolerances required in the manufacturing processes.