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Article
Publication date: 26 July 2022

Chia-Yang Chang, Kuen-Hung Tsai and Billy Sung

This paper examines the effect of market knowledge on market success of product innovativeness and the moderating role of absorptive capacity. We separated market knowledge into…

Abstract

Purpose

This paper examines the effect of market knowledge on market success of product innovativeness and the moderating role of absorptive capacity. We separated market knowledge into market diversity and market significance components and examined their effects on radical product innovation performance.

Design/methodology/approach

This paper adopted the secondary database study. Excluding cases with missing values of main variables, a total of 1,219 Taiwanese manufacturing firms from the Third Taiwan Technology Innovation Survey (TTIS3) database were used to test the hypotheses. A moderated hierarchical regression approach was utilized to analyze the data.

Findings

The results revealed that the relationship between market diversity and radical product innovation performance is a predominantly positive concave downward curve. In contrast, the relationship between market significance and radical product innovation performance is a predominantly negative concave downward curve. Furthermore, the results also indicated that absorptive capacity has different moderating effects on the relationships between market diversity/significance and radical product innovation performance. Absorptive capacity enhances the negative effect of market significance but suppresses the positive effect of market diversity on radical product innovation performance.

Originality/value

This paper is the first research which contributes to examining the relationship between market knowledge and radical product innovation sale performance.

Details

European Journal of Innovation Management, vol. 27 no. 2
Type: Research Article
ISSN: 1460-1060

Keywords

Article
Publication date: 18 March 2024

Yu-Xiang Wang, Chia-Hung Hung, Hans Pommerenke, Sung-Heng Wu and Tsai-Yun Liu

This paper aims to present the fabrication of 6061 aluminum alloy (AA6061) using a promising laser additive manufacturing process, called the laser-foil-printing (LFP) process…

Abstract

Purpose

This paper aims to present the fabrication of 6061 aluminum alloy (AA6061) using a promising laser additive manufacturing process, called the laser-foil-printing (LFP) process. The process window of AA6061 in LFP was established to optimize process parameters for the fabrication of high strength, dense and crack-free parts even though AA6061 is challenging for laser additive manufacturing processes due to hot-cracking issues.

Design/methodology/approach

The multilayers AA6061 parts were fabricated by LFP to characterize for cracks and porosity. Mechanical properties of the LFP-fabricated AA6061 parts were tested using Vicker’s microhardness and tensile testes. The electron backscattered diffraction (EBSD) technique was used to reveal the grain structure and preferred orientation of AA6061 parts.

Findings

The crack-free AA6061 parts with a high relative density of 99.8% were successfully fabricated using the optimal process parameters in LFP. The LFP-fabricated parts exhibited exceptional tensile strength and comparable ductility compared to AA6061 samples fabricated by conventional laser powder bed fusion (LPBF) processes. The EBSD result shows the formation of cracks was correlated with the cooling rate of the melt pool as cracks tended to develop within finer grain structures, which were formed in a shorter solidification time and higher cooling rate.

Originality/value

This study presents the pioneering achievement of fabricating crack-free AA6061 parts using LFP without the necessity of preheating the substrate or mixing nanoparticles into the melt pool during the laser melting. The study includes a comprehensive examination of both the mechanical properties and grain structures, with comparisons made to parts produced through the traditional LPBF method.

Details

Rapid Prototyping Journal, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 1355-2546

Keywords

Article
Publication date: 19 September 2023

Andromeda Dwi Laksono, Chih-Ming Chen and Yee-Wen Yen

The purpose of this study was to examine the influence of adding a small amount of Ti to a Cu-based alloy, specifically the commercial Hyper Titanium Copper alloy (C1990 HP)…

Abstract

Purpose

The purpose of this study was to examine the influence of adding a small amount of Ti to a Cu-based alloy, specifically the commercial Hyper Titanium Copper alloy (C1990 HP), which contains Cu-3.28 wt.% Ti, on its interfacial reaction with Sn-9.0 wt.% Zn (SnZn) solder, using the liquid/solid reaction couple technique.

Design/methodology/approach

The SnZn/C1990 HP couples were subjected to a reaction temperature of 240–270°C for a duration of 0.5–5 h. The resulting reaction couple was characterized using a scanning electron microscope, energy dispersive spectrometer, electron probe microanalyzer and X-ray diffractometer.

Findings

It was observed that the scallop-shaped CuZn5 and planar Cu5Zn8 phases were formed in almost all SnZn/C1990 HP couples. With increased reaction duration and temperature, the Cu-rich intermetallic compound (IMC)-Cu5Zn8 phase became a dominant IMC formed at the interface. The total thickness of the IMCs was increased with the increase in the reaction duration and temperature. The IMC growth obeyed the parabolic law, and the IMC growth mechanism was diffusion controlled. The activation energy of the SnZn/C1990 HP couple was 64.71 kJ/mol.

Originality/value

This article presents an analysis of the IMC thickness in each sample using ImageJ software, followed by kinetic analysis using Origin software at various reaction temperatures of SnZn/C1990 HP in liquid/solid couples. The study also includes detailed reports on the morphology, interface composition and X-ray diffraction analysis, as well as the activation energy. The findings can serve as a valuable reference for electronic packaging companies that utilize C1990 HP substrates.

Details

Soldering & Surface Mount Technology, vol. 36 no. 1
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 13 September 2023

Bifu Xiong, Siliang He, Jinguo Ge, Quantong Li, Chuan Hu, Haidong Yan and Yu-An Shen

This paper aims to examine the effects of bonding temperature, bonding time, bonding pressure and the presence of a Pt catalyst on the bonding strength of Cu/SB/P-Cu/SB/Cu joints…

Abstract

Purpose

This paper aims to examine the effects of bonding temperature, bonding time, bonding pressure and the presence of a Pt catalyst on the bonding strength of Cu/SB/P-Cu/SB/Cu joints by transient liquid phase bonding (TLPB).

Design/methodology/approach

TLPB is promising to assemble die-attaching packaging for power devices. In this study, porous Cu (P-Cu) foil with a distinctive porous structure and Sn-58Bi solder (SB) serve as the bonding materials for TLPB under a formic acid atmosphere (FA). The high surface area of P-Cu enables efficient diffusion of the liquid phase of SB, stimulating the wetting, spreading and formation of intermetallic compounds (IMCs).

Findings

The higher bonding temperature decreased strength due to the coarsening of IMCs. The longer bonding time reduced the bonding strength owing to the coarsened Bi and thickened IMC. Applying optimal bonding pressure improved bonding strength, whereas excessive pressure caused damage. The presence of a Pt catalyst enhanced bonding efficiency and strength by facilitating reduction–oxidation reactions and oxide film removal.

Originality/value

Overall, this study demonstrates the feasibility of low-temperature TLPB for Cu/SB/P-Cu/SB/Cu joints and provides insights into optimizing bonding strength for the interconnecting materials in the applications of power devices.

Details

Soldering & Surface Mount Technology, vol. 36 no. 1
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 8 January 2024

Margaret L. Sheng and Saide Saide

This study aims to build an integrated model for information technology (IT)/information system (IS) team exploration and exploitation innovation in the business-to-business (B2B…

Abstract

Purpose

This study aims to build an integrated model for information technology (IT)/information system (IS) team exploration and exploitation innovation in the business-to-business (B2B) enterprise context by empirically investigating the mediating role of tacit-explicit knowledge co-creation and exploring the behavior approach of servant leaders for IT/IS team exploration-exploitation innovation.

Design/methodology/approach

The authors' analysis was supported by 182 enterprise-IT/IS teams (403 participants) in Taiwan. The authors used a questionnaire and Structural Equation Model (SEM)-SmartPLS to validate the development model. This study examines IT/IS exploration-exploitation innovation using a combination of quantitative survey research and qualitative case studies.

Findings

The specific roles of direct and mediating effects for two innovations of IT/IS team exploration and exploitation were investigated. The findings show a direct effect of knowledge creation (tacit and explicit) on IT/IS team exploration-exploitation innovation. Servant leader behavior positively influences tacit-explicit knowledge co-creation practices, IT/IS team exploration and exploitation. Moreover, knowledge creation (tacit and explicit) successfully mediates the correlation between servant leaders and IT/IS team innovations (for exploration and exploitation).

Practical implications

Managers, IT/IS consultants and enterprises at the executive level are suggested to encourage knowledge co-creation practices, both tacit and explicit to support their IT/IS team innovation. The greater the degree of explicit knowledge (i.e. socialization and internalization) and tacit knowledge creation (i.e. externalization and combination), the greater will be the opportunities for meeting the enterprise-IT/IS team exploration and exploitation innovation goals. The project manager may follow servant leadership behavior to promote effective knowledge co-creation process on the IT/IS team.

Originality/value

This effort contributes to greater and new understanding of how ambidexterity capability, tacit-explicit knowledge co-creation (mediators) and servant leaders for IT/IS team exploration-exploitation innovation in the B2B enterprise context and new foundations for future studies on a cross-enterprise IT/IS team. This research is also the first empirical effort to understand how a servant perspective leadership contributes through the knowledge co-creation process for IT/IS exploration-exploitation innovation.

Article
Publication date: 28 March 2024

Chieh-Yu Lin, Cathay Kuo-Tai Kang and Yi-Hui Ho

This study aims to analyze the determinants influencing Chinese manufacturing companies in implementing lean manufacturing (LM).

Abstract

Purpose

This study aims to analyze the determinants influencing Chinese manufacturing companies in implementing lean manufacturing (LM).

Design/methodology/approach

The determinants to be explored in this study consist of technological, organizational and environmental (TOE) dimensions. A questionnaire survey was conducted on Chinese manufacturing companies, and 208 samples were analyzed.

Findings

The findings show that the relative advantage of LM and organizational support have significantly positive effects on Chinese manufacturing firms’ adoption of LM. The complexity of LM, quality of human resources, organizational readiness, customer pressure, international situation, governmental support and environmental uncertainty do not have significant effects.

Originality/value

This paper contributes to the literature by using the TOE model to explore the factors influencing LM adoption in the Chinese manufacturing industry.

Details

International Journal of Lean Six Sigma, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 2040-4166

Keywords

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