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This paper aims to present a control strategy that eliminates the longitudinal and lateral drifting movements of the coaxial ducted fan unmanned helicopter (UH) during autonomous take-off and landing and reduce the coupling characteristics between channels of the coaxial UH for its special model structure.

Unidirectional auxiliary surfaces (UAS) for terminal sliding mode controller (TSMC) are designed for the flight control system of the coaxial UH, and a hierarchical flight control strategy is proposed to improve the decoupling ability of the coaxial UH.

It is demonstrated that the proposed height control strategy can solve the longitudinal and lateral movements during autonomous take-off and landing phase. The proposed hierarchical controller can decouple vertical and heading coupling problem which exists in coaxial UH. Furthermore, the confronted UAS-TSMC method can guarantee finite-time convergence and meet the quick flight trim requirements during take-off and landing.

The designed flight control strategy has not implemented in real flight test yet, as all the tests are conducted in the numerical simulation and simulation with a hardware-in-the-loop (HIL) platform.

The designed flight control strategy can solve the common problem of coupling characteristics between channels for coaxial UH, and it has important theoretical basis and reference value for engineering application; the control strategy can meet the demands of engineering practice.

In consideration of the TSMC approach, which can increase the convergence speed of the system state effectively, and the high level of response speed requirements to UH flight trim, the UAS-TSMC method is first applied to the coaxial ducted fan UH flight control. The proposed control strategy is implemented on the UH flight control system, and the HIL simulation clearly demonstrates that a much better performance could be achieved.

According to bidirectional ability, wind application are having variable acceleration which connected large quantity of wind ability bearing system with doubly-fed induction generator (DFIG) fed by the two-stage cast converter (TSMC) system, the accentuation action for TSMC and arithmetic standard for DFIG are all deduced. The purpose of this study is for, stator accelerated action in Doubly fed induction generator and controlled by the Two Stage Cast Converter for better control.

The purpose of this study is for, stator accelerated action in Doubly fed induction generator and controlled by the Two Stage Cast Converter for better control.

Then, the beginning ancestor was set up to verify this system; the allotment of the filigree beginning after-effects are offered beneath no-load and the three plan states.

These after-effects apparent by the fact that the arrangement fed by TSMC-DFIG could apprehend the safe ability bearing accumulated to the filigree in the sub-synchronous, synchronisation and super-synchronous state; meanwhile generated sinusoidal describes the displacement factor.

The semiconductor market exceeded US$250 billion worldwide in 2010 and has had a double‐digit compound annual growth rate (CAGR) in the last 20 years. As it is located far upstream of the electronic product market, the semiconductor industry has suffered severely from the “bullwhip” effect. Therefore, effective e‐based supply chain management (e‐SCM) has become imperative for the efficient operation of semiconductor manufacturing (SM) companies. The purpose of this research is to define and analyze the key success factors (KSF) for e‐SCM system implementation in the semiconductor industry.

A hierarchy of KSFs is defined first by a combination of a literature review and a focus group discussion with experts who successfully implemented an inter‐organizational e‐SCM project. Fuzzy analytic hierarchy process (FAHP) is then employed to rank the importance of these identified KSFs. To confirm the research result and further explore the managerial implications, a second in‐depth interview with the e‐SCM project executives is conducted.

The KSF hierarchy is constructed with two levels: a top‐level consisting of four dimensions and a detailed‐level consisting of 15 individual factors. The research shows that, in the top‐level, strategy is the most critically successful dimension followed by process, organization, and technical; whereas in the detailed‐level, the top management commitment, clear project goal and business requirements, and business process re‐engineering are the top three critical successful factors.

Research surveys and interviews were conducted with two leading companies: Taiwan Semiconductor Manufacturing Company (TSMC) and ASE; they are the largest front‐end and back‐end SM companies in the world, respectively. Although the data collected was primarily based on the experience of one successful e‐SCM project, the significant roles of these two companies and compelling contribution made by the e‐SCM project leading to the research resulted in valuable guidelines for the companies in the semiconductor industry and a useful reference for companies in other manufacturing industries.

e‐SCM system has a high failure rate and there is little literature discussing the KSF of e‐SCM implementation from a holistic view for certain industries. This paper not only provides a structured and comprehensive list of KSFs but also illustrates the application of the most critical factors by examples. In addition to the contributions made to industries, the research results can also serve as a foundation for related academic research when comparing the KSFs of implementing e‐SCM by different industries.

Many manufacturers are transforming into manufacturing service industry to enhance their value creation. Adopting the value‐added chain model, this study aimed to conduct four case studies, including Acer, Giant, TSMC and Eternal, to verify the high‐valued strategies and the common characteristics of service provisions.

Four case studies, including Acer, Giant, TSMC and Eternal, were conducted to verify the high‐valued strategies and the common characteristics of service provisions. Specifically, these companies are selected from different industry and value chain position to enhance the robustness of the research findings.

This study concluded that the manufacturing firms strengthen their position as system integrator. The provision of high‐valued services is orientated toward the integration of the value chain stages according to the industry and business model. The companies are going to upstream or downstream, outsource non‐core manufacturing activities, and sell some manufacturing assets. The high‐valued service strategies provided the manufacturing firms with new approaches to compete in a rapidly changing economy. The findings also provided the direction for the emerging economies in confronting with industrial structure transformation.

This study focuses on the transformation of four manufacturing firms toward providing high value‐added services. The results conclude that manufacturing firms can integrate forward and backward stages in the value‐added chain, and provide the knowledge‐based services including R&D, marketing, information system, branding, financial and after‐sale services to enhance the market value of their products. This study argues that the high value‐added service strategies can be a great opportunity for the manufacturers.

Researchers continue to seek understanding of industrialization as a state managed process. How to create and implement new industries based on advanced knowledge is on the policy agenda of many advanced nations. Measures that promote these developments include national capacity building in science and technology, the formation of technology transfer systems, and the establishment of industrial clusters. What these templates often overlook is an analysis of use. This chapter aims to increase the understanding of the processes that embed new solutions in structures from an industrial network perspective. The chapter describes an empirical study of high-technology industrialization in Taiwan that the researcher conducts to this end. The study shows that the Taiwanese industrial model is oversimplified and omits several important factors in the development of new industries. This study bases its findings on the notions that resource combination occurs in different time and space, the new always builds on existing resource structures, and the users are important as active participants in development processes.

The purpose of this paper is to use data envelopment analysis (DEA) to evaluate the efficiency of the wafer fabrication industry in Taiwan.

The input variables are total assets, operation costs, and operation expenditures, and the output variable is net sales. This study uses the Pearson correlation to indicate positively correlation between input and output variables, applies DEA to analyze the efficiency scores, and utilizes Mann‐Whitney U‐test to compare the efficiency score of stock exchange market group (SEM group) with that of over‐the‐counter market group (OTC group). Moreover, this paper explores the efficiency performance over different periods by use of the Malmquist productive Index (MPI).

This study indicates that Taiwan Semiconductor Manufacturing Corporation (TSMC) has the most relative efficiency in the wafer fabrication industry of Taiwan. In addition, this study finds out the average constant returns to scale (CRS) efficiency of the Taiwanese wafer fabrication industry from 1999 to 2003 is 84.98 per cent, and the average CRS efficiencies of all nine wafer fabrication companies are over 70 per cent. This study finds out that net sales and scale efficiency of SEM group are higher than those of OTC group. Moreover, this study shows that the main inefficient causes of four companies of SEM group except TSMC and Nanya are from the inefficiency of variable returns to scale efficiency, while the main inefficient causes of all companies of OTC group are from the inefficiency of scale efficiency. Finally, according the results of the MPI in this study, the wafer fabrication industry should introduce the new technology to improve its technology change effect.

This study provides a valuable reference for wafer fabrication companies not only in reviewing their efficiency, but also in enhancing their operational performance.