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Article
Publication date: 24 November 2022

Hadi Karimi Aliabad and Mohammadreza Baghayipour

This paper aims to propose a novel simple and efficient structure for line-start axial-flux permanent magnet (LSAFPM) synchronous motor, especially regarding the permanent magnets…

Abstract

Purpose

This paper aims to propose a novel simple and efficient structure for line-start axial-flux permanent magnet (LSAFPM) synchronous motor, especially regarding the permanent magnets (PMs) demagnetization reduction.

Design/methodology/approach

At first, a primitive raw scheme of the new structure for the LSAFPM motor is introduced. Considering this raw scheme, the levels of irreversible demagnetization in various regions throughout the entire volume of each PM are evaluated using 3 dimensional (3D) finite elements analysis (3D FEA) in full loading condition during startup until reaching steady state. Based on the results of these analyses, the primitive structural scheme is then modified through segmenting (cutting into four pieces) each PM from where the worst irreversible demagnetization levels occurred.

Findings

As will be demonstrated by the results of 3D FEA, the proposed modified structure is not only capable of successful startup and synchronization of the motor but also it considerably reduces the PM demagnetization level. Thus, the performance of the motor is significantly improved.

Originality/value

The demagnetization of PMs is an important effect in PM synchronous motors, which can greatly affect motor performance. Therefore, it is necessary to be considered in the motor design processes. This effect becomes much more significant in the line-start PM motors because the usual high-magnitude startup induction current produces a strong armature-reaction magnetic field, which may cause the PMs to be irreversibly demagnetized. The approach proposed in this paper provides a structural solution to mitigate the PM demagnetization effect and thereby improve the performance of an LSAFPM motor through modifying the structure of the LSAFPM motor according to an FEA-based PM demagnetization analysis. As a considerable contribution, in this analysis, the variation of demagnetization level between different areas inside each PM is computed and is considered as a basis for proposing an appropriate structural modification to mitigate the PM demagnetization effect as much as possible.

Details

COMPEL - The international journal for computation and mathematics in electrical and electronic engineering , vol. 42 no. 6
Type: Research Article
ISSN: 0332-1649

Keywords

Article
Publication date: 22 September 2023

Mohamad Solehin Mohamed Sunar, Maria Abu Bakar, Atiqah A., Azman Jalar, Muhamed Abdul Fatah Muhamed Mukhtar and Fakhrozi Che Ani

This paper aims to investigate the effect of physical vapor deposition (PVD)-coated stencil wall aperture on the life span of fine-pitch stencil printing.

Abstract

Purpose

This paper aims to investigate the effect of physical vapor deposition (PVD)-coated stencil wall aperture on the life span of fine-pitch stencil printing.

Design/methodology/approach

The fine-pitch stencil used in this work is fabricated by electroform process and subsequently nano-coated using the PVD process. Stencil printing process was then performed to print the solder paste onto the printed circuit board (PCB) pad. The solder paste release was observed by solder paste inspection (SPI) and analyzed qualitatively and quantitatively. The printing cycle of up to 80,000 cycles was used to investigate the life span of stencil printing.

Findings

The finding shows that the performance of stencil printing in terms of solder printing quality is highly dependent on the surface roughness of the stencil aperture. PVD-coated stencil aperture can prolong the life span of stencil printing with an acceptable performance rate of about 60%.

Originality/value

Stencil printing is one of the important processes in surface mount technology to apply solder paste on the PCB. The stencil’s life span greatly depends on the type of solder paste, stencil printing cycles involved and stencil conditions such as the shape of the aperture, size and thickness of the stencil. This study will provide valuable insight into the relationship between the coated stencil wall aperture via PVD process on the life span of fine-pitch stencil printing.

Details

Soldering & Surface Mount Technology, vol. 36 no. 1
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 7 March 2023

Muthuram N. and Saravanan S.

This paper aims to improve the life of the printed circuit boards (PCB) used in computers based on modal analysis by increasing the natural frequency of the PCB assembly.

Abstract

Purpose

This paper aims to improve the life of the printed circuit boards (PCB) used in computers based on modal analysis by increasing the natural frequency of the PCB assembly.

Design/methodology/approach

In this work, through experiments and numerical simulations, an attempt has been made to increase the fundamental natural frequency of the PCB assembly as high as practically achievable so as to minimize the impacts of dynamic loads acting on it. An optimization tool in the finite element software (ANSYS) was used to search the specified design space for the optimal support location of the six fastening screws.

Findings

It is observed that by changing the support locations based on the optimization results the fundamental natural frequency can be raised up to 51.1% and the same is validated experimentally.

Research limitations/implications

Manufacturers of PCBs used in computers fix the support locations based on symmetric feature of the board not on the dynamic behavior of the assembly. This work might lead manufacturers to redesign the location of other surface mount components.

Practical implications

This work provides guidelines for PCB manufacturers to finalize their support locating points which will improve the dynamic characteristics of the PCB assembly during its functioning.

Originality/value

This study provides a novel method to improve the life of PCB based on support locations optimization which includes majority of the surface mount components that contributes to the total mass the PCB assembly.

Details

Microelectronics International, vol. 41 no. 2
Type: Research Article
ISSN: 1356-5362

Keywords

Article
Publication date: 6 December 2022

Xinhong Zou, Hongchang Ding and Jinhong Li

This paper aims to present a sliding mode control method based on disturbance observer (DO) for improving the reaching law of permanent magnet synchronous motor (PMSM).

Abstract

Purpose

This paper aims to present a sliding mode control method based on disturbance observer (DO) for improving the reaching law of permanent magnet synchronous motor (PMSM).

Design/methodology/approach

Aiming at the insufficiency of the traditional exponential reaching law used in sliding mode variable structure control, an exponential reaching law related to the speed error is proposed. The improved exponential reaching law can adaptively adjust the size of the constant velocity term in the reaching law according to the size of the speed error, so as to adaptively adjust the speed of the system approaching the sliding mode surface to overcome the control deviation and improve the dynamic and steady state performance. To improve the anti-interference ability of the system, a DO is proposed to observe the external disturbance of the system, and the observed value is used to compensate the system. The stability of the system is analyzed by Lyapunov theorem. The effectiveness of this method is proved by simulation and experiment.

Findings

Simulation and experiment show that the proposed method has the advantages of fast response and strong anti-interference ability.

Research limitations/implications

The proposed method cannot observe the disturbance caused by the change of internal parameters of the system.

Originality/value

A sliding mode control method for PMSM is proposed, which has good control performance. The proposed method can effectively suppress chattering, ensure fast response speed and have strong anti-interference ability. The effectiveness of the algorithm is verified by simulation and experiment.

Details

COMPEL - The international journal for computation and mathematics in electrical and electronic engineering , vol. 42 no. 6
Type: Research Article
ISSN: 0332-1649

Keywords

Article
Publication date: 15 April 2024

Rilwan Kayode Apalowo, Mohamad Aizat Abas, Zuraihana Bachok, Mohamad Fikri Mohd Sharif, Fakhrozi Che Ani, Mohamad Riduwan Ramli and Muhamed Abdul Fatah bin Muhamed Mukhtar

This study aims to investigate the possible defects and their root causes in a soft-termination multilayered ceramic capacitor (MLCC) when subjected to a thermal reflow process.

Abstract

Purpose

This study aims to investigate the possible defects and their root causes in a soft-termination multilayered ceramic capacitor (MLCC) when subjected to a thermal reflow process.

Design/methodology/approach

Specimens of the capacitor assembly were subjected to JEDEC level 1 preconditioning (85 °C/85%RH/168 h) with 5× reflow at 270°C peak temperature. Then, they were inspected using a 2 µm scanning electron microscope to investigate the evidence of defects. The reliability test was also numerically simulated and analyzed using the extended finite element method implemented in ABAQUS.

Findings

Excellent agreements were observed between the SEM inspections and the simulation results. The findings showed evidence of discontinuities along the Cu and the Cu-epoxy layers and interfacial delamination crack at the Cu/Cu-epoxy interface. The possible root causes are thermal mismatch between the Cu and Cu-epoxy layers, moisture contamination and weak Cu/Cu-epoxy interface. The maximum crack length observed in the experimentally reflowed capacitor was measured as 75 µm, a 2.59% difference compared to the numerical prediction of 77.2 µm.

Practical implications

This work's contribution is expected to reduce the additional manufacturing cost and lead time in investigating reliability issues in MLCCs.

Originality/value

Despite the significant number of works on the reliability assessment of surface mount capacitors, work on crack growth in soft-termination MLCC is limited. Also, the combined experimental and numerical investigation of reflow-induced reliability issues in soft-termination MLCC is limited. These cited gaps are the novelties of this study.

Details

Microelectronics International, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 1356-5362

Keywords

Article
Publication date: 17 April 2024

Bingyi Li, Songtao Qu and Gong Zhang

This study aims to focus on the surface mount technology (SMT) mass production process of Sn-9Zn-2.5Bi-1.5In solder. It explores it with some components that will provide…

Abstract

Purpose

This study aims to focus on the surface mount technology (SMT) mass production process of Sn-9Zn-2.5Bi-1.5In solder. It explores it with some components that will provide theoretical support for the industrial SMT application of Sn-Zn solder.

Design/methodology/approach

This study evaluates the properties of solder pastes and selects a more appropriate reflow parameter by comparing the microstructure of solder joints with different reflow soldering profile parameters. The aim is to provide an economical and reliable process for SMT production in the industry.

Findings

Solder paste wettability and solder ball testing in a nitrogen environment with an oxygen content of 3,000 ppm meet the requirements of industrial production. The printing performance of the solder paste is good and can achieve a printing rate of 100–160 mm/s. When soldering with a traditional stepped reflow soldering profile, air bubbles are generated on the surface of the solder joint, and there are many voids and defects in the solder joint. A linear reflow soldering profile reduces the residence time below the melting point of the solder paste (approximately 110 s). This reduces the time the zinc is oxidized, reducing solder joint defects. The joint strength of tin-zinc joints soldered with the optimized reflow parameters is close to that of Sn-58Bi and SAC305, with high joint strength.

Originality/value

This study attempts to industrialize the application of Sn-Zn solder and solves the problem that Sn-Zn solder paste is prone to be oxidized in the application and obtains the SMT process parameters suitable for Sn-9Zn-2.5Bi-1.5In solder.

Details

Soldering & Surface Mount Technology, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 11 January 2024

Ahmed Ashteyat, Ala Taleb Obaidat, Yasmeen Taleb Obeidat and Ahmad Bani Awwad

The paper aims to introduces an experimental work to investigate the torsional behavior of reinforced concrete (RC) beams strengthened by near-surface mounted (NSM) carbon…

20

Abstract

Purpose

The paper aims to introduces an experimental work to investigate the torsional behavior of reinforced concrete (RC) beams strengthened by near-surface mounted (NSM) carbon fiber-reinforced polymer (CFRP) ropes.

Design/methodology/approach

In this research, nine rectangular RC beams of 250 mm × 300 mm cross-section and 1,600 mm in length were constructed and tested considering the studied parameters. These parameters include the length of the CFRP rope, the orientation of the CFRP rope, the arrangement of longitudinal and the scheme of NSM-CFRP ropes.

Findings

In comparison to control specimens, the results demonstrate a considerable improvement in the torsional response of RC beams strengthened with the CFRP rope. Additionally, specimens strengthened with 90° vertical ropes increase torsional moment capacity more efficiently than specimens strengthened with 45° inclined ropes since the stress concentration leads to premature debonding of the CFRP rope. Whereas RC beams' ability to withstand torsional moments is reduced as the distance between reinforcing CFRP ropes is increased. According to test results, adding CFRP ropes to RC beams' bottoms had a slightly positive impact on torsional response.

Originality/value

This paper fulfills an identified need to study how the using of the CFRP rope is effective in strengthening RC beam subjected to torsion moment.

Details

International Journal of Building Pathology and Adaptation, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 2398-4708

Keywords

Article
Publication date: 20 March 2024

Heji Zhang, Dezhao Lu, Wei Pan, Xing Rong and Yongtao Zhang

The purpose of this study is to design a closed hydrostatic guideway has the ability to resist large-side load, pitch moments and yaw moments, has good stiffness and damping…

Abstract

Purpose

The purpose of this study is to design a closed hydrostatic guideway has the ability to resist large-side load, pitch moments and yaw moments, has good stiffness and damping characteristics, and provides certain beneficial guidance for the design of large-span closed hydrostatic guideway on the basis of providing a large vertical load bearing capacity.

Design/methodology/approach

The Reynolds’ equation and flow continuity equation are solved simultaneously by the finite difference method, and the perturbation method and the finite disturbance method is used for calculating the dynamic characteristics. The static and dynamic characteristics, including recess pressure, flow of lubricating oil, carrying capacity, pitch moment, yaw moment, dynamic stiffness and damping, are comprehensively analyzed.

Findings

The designed closed hydrostatic guideway has the ability to resist large lateral load, pitch moment and yaw moment and has good stiffness and damping characteristics, on the basis of being able to provide large vertical carrying capacity, which can meet the application requirements of heavy two-plate injection molding machine (TPIMM).

Originality/value

This paper researches static and dynamic characteristics of a large-span six-slider closed hydrostatic guideway used in heavy TPIMM, emphatically considering pitch moment and yaw moment. Some useful guidance is given for the design of large-span closed hydrostatic guideway.

Details

Industrial Lubrication and Tribology, vol. 76 no. 3
Type: Research Article
ISSN: 0036-8792

Keywords

Article
Publication date: 16 February 2023

Shanmugan Subramani and Mutharasu Devarajan

Light emitting diode (LED) has been the best resource for commercial and industrial lighting applications. However, thermal management in high power LEDs is a major challenge in…

Abstract

Purpose

Light emitting diode (LED) has been the best resource for commercial and industrial lighting applications. However, thermal management in high power LEDs is a major challenge in which the thermal resistance (Rth) and rise in junction temperature (TJ) are critical parameters. The purpose of this work is to evaluate the Rth and Tj of the LED attached with the modified heat transfer area of the heatsink to improve thermal management.

Design/methodology/approach

This paper deals with the design of metal substrate for heatsink applications where the surface area of the heatsink is modified. Numerical simulation on heat distribution proved the influence of the design aspects and surface area of heatsink.

Findings

TJ was low for outward step design when compared to flat heatsink design (ΔT ∼ 38°C) because of increase in surface area from 1,550 mm2 (flat) to 3,076 mm2 (outward step). On comparison with inward step geometry, the TJ value was low for outward step configuration (ΔTJ ∼ 6.6°C), which is because of efficient heat transfer mechanism with outward step design. The observed results showed that outward step design performs well for LED testing by reducing both Rth and TJ for different driving currents.

Originality/value

This work is authors’ own design and also has the originality for the targeted application. To the best of the authors’ knowledge, the proposed design has not been tried before in the electronic or LED applications.

Details

Microelectronics International, vol. 41 no. 2
Type: Research Article
ISSN: 1356-5362

Keywords

Article
Publication date: 5 October 2022

Parvathidevi A. and Naga Satish Kumar Ch

This study aims to assess the efficacy of thermal analysis of concrete slabs by including different insulation materials using ANSYS. Regression equations were proposed to predict…

Abstract

Purpose

This study aims to assess the efficacy of thermal analysis of concrete slabs by including different insulation materials using ANSYS. Regression equations were proposed to predict the thermal conductivity using concrete density. As these simulation and regression analyses are essential tools in designing the thermal insulation concretes with various densities, they sequentially reduce the associated time, effort and cost.

Design/methodology/approach

Two grades of concretes were taken for thermal analysis. They were designed by replacing the natural fine aggregates with thermal insulation aggregates: expanded polystyrene, exfoliated vermiculite and light expanded clay. Density, temperature difference, specific heat capacity, thermal conductivity and time were measured by conducting experiments. This data was used to simulate concrete slabs in ANSYS. Regression analysis was performed to obtain the relation between density and thermal conductivity. Finally, the quality of the predicted regression equations was assessed using root mean square error (RMSE), mean absolute error (MAE), integral absolute error (IAE) and normal efficiency (NE).

Findings

ANSYS analysis on concrete slabs accurately estimates the thermal behavior of concrete, with lesser error value ranges between 0.19 and 7.92%. Further, the developed regression equations proved accurate with lower values of RMSE (0.013 to 0.089), MAE (0.009 to 0.088); IAE (0.216 to 5.828%) and higher values of NE (94.16 to 99.97%).

Originality/value

The thermal analysis accurately simulates the experimental transfer of heat across the concrete slab. Obtained regression equations proved helpful while designing the thermal insulation concrete.

Details

World Journal of Engineering, vol. 21 no. 1
Type: Research Article
ISSN: 1708-5284

Keywords

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