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Article
Publication date: 1 December 2001

Eric Beyne, Rita Van Hoof, Tomas Webers, Steven Brebels, Stéphanie Rossi, François Lechleiter, Marianna Di Ianni and Andreas Ostmann

A novel interconnect technology, introducing thin film on a laminate substrate base, is presented. A specially constructed laminate board is used as a substrate for the thin film…

Abstract

A novel interconnect technology, introducing thin film on a laminate substrate base, is presented. A specially constructed laminate board is used as a substrate for the thin film build‐up process. The main characteristics of the laminate core substrate are the z‐axis electrical connections, the absence of holes in the substrate and the very flat nature of the top surface. As a result, the base substrate can be processed further in a thin film processing line. The manufacturing and properties of these substrates are discussed.

Details

Microelectronics International, vol. 18 no. 3
Type: Research Article
ISSN: 1356-5362

Keywords

Article
Publication date: 18 November 2013

Liang Wang, Maarten Cauwe, Steven Brebels, Walter De Raedt and Jan Vanfleteren

Ultra-thin chip packaging (UTCP) is one of the flexible assembly technologies, by which thinned dies are encapsulated inside spin-coated dielectric films. For sake of higher…

Abstract

Purpose

Ultra-thin chip packaging (UTCP) is one of the flexible assembly technologies, by which thinned dies are encapsulated inside spin-coated dielectric films. For sake of higher density integration and bending stress suppression, two UTCPs can be stacked vertically. The purpose of this paper is to present an improved UTCP process flow to embed thinned chip in a symmetric dielectric sandwich for a flat topography. The UTCP flat top surface is suitable for metallization and further 3D stacking.

Design/methodology/approach

In the new process, a central photosensitive polyimide film is introduced, in which a cavity is made for the embedded chip. The cavity is defined by lithography using the chip itself as a photo-mask. In this way, the cavity size and position is self-aligned to the chip. The chip thickness is compensated by the surrounding central layer, and a UTCP with flat topography (flat UTCP) is realized after top dielectric deposition.

Findings

A batch of daisy chain test vehicles was produced. The feasibility of the process flow is verified by optical and electrical measurements. The result shows 100 percent yield, which is much better than previous work. A thermal humidity test showed no significant degradation of the flat UTCPs after 1,000 hours.

Originality/value

High yield fabrication of flat UTCP is first shown. An innovative self-alignment lithography step is introduced to make a cavity in dielectric for chip thickness compensation by using the chip itself as a photo-mask.

Details

Circuit World, vol. 39 no. 4
Type: Research Article
ISSN: 0305-6120

Keywords

Content available
Article
Publication date: 1 December 2002

183

Abstract

Details

Microelectronics International, vol. 19 no. 3
Type: Research Article
ISSN: 1356-5362

Content available
Article
Publication date: 18 November 2013

Martin Goosey

211

Abstract

Details

Circuit World, vol. 39 no. 4
Type: Research Article
ISSN: 0305-6120

Article
Publication date: 2 September 2019

Avnish Sharma, Rakesh Agrawal and Utkal Khandelwal

The purpose of this paper is to understand the growing construct of ethical leadership and its related concepts that focus on the importance of the moral aspect of leadership. It…

9286

Abstract

Purpose

The purpose of this paper is to understand the growing construct of ethical leadership and its related concepts that focus on the importance of the moral aspect of leadership. It focuses on the idea of ethical leadership, personality attributes of ethical leaders and develops a conceptual framework including various propositions related to the antecedents and outcomes of ethical leadership.

Design/methodology/approach

This is a review paper based on a synthesis of leadership literature from existing research journals and articles on ethical leadership. Authors analyzed selected papers on ethical leadership to propose a conceptual framework that shows the antecedents and outcomes of ethical leadership.

Findings

An ethical leader is one who strongly believes in following the right set of values and ideals in their decisions, actions and behavior. One has to be honest with high integrity, with people orientation and communicates assertively. Among the other attributes of an ethical leader, one needs to be responsible for taking unbiased decisions in benefit and overall interest of people and organization. This ethical leadership plays a vital role in developing positive outcomes such as followers’ organizational commitment and organizational identification. Trust in leadership can moderate this relationship.

Practical implications

This paper offers opportunities for researchers to explore discoveries in leadership style and also helps to understand the ways the organizations can develop ethical leaders at the workplace. An effective and efficient leader integrates ethics with leadership and thus makes its presence felt and emerges as a role model to play a more positive and valuable role in an organization.

Originality/value

This paper helps the strategist and educators to conceptualize ethical leadership and its framework including leaders’ ideal traits, similarities and differences of ethical leadership with other leadership styles and its role in developing positive outcomes in an organization. It presents a framework of ten testable propositions about ethical leadership that are relevant for both the practitioners and the scholars.

Details

Leadership & Organization Development Journal, vol. 40 no. 6
Type: Research Article
ISSN: 0143-7739

Keywords

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