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1 – 10 of 11Bingyi Li, Songtao Qu and Gong Zhang
This study aims to focus on the surface mount technology (SMT) mass production process of Sn-9Zn-2.5Bi-1.5In solder. It explores it with some components that will provide…
Abstract
Purpose
This study aims to focus on the surface mount technology (SMT) mass production process of Sn-9Zn-2.5Bi-1.5In solder. It explores it with some components that will provide theoretical support for the industrial SMT application of Sn-Zn solder.
Design/methodology/approach
This study evaluates the properties of solder pastes and selects a more appropriate reflow parameter by comparing the microstructure of solder joints with different reflow soldering profile parameters. The aim is to provide an economical and reliable process for SMT production in the industry.
Findings
Solder paste wettability and solder ball testing in a nitrogen environment with an oxygen content of 3,000 ppm meet the requirements of industrial production. The printing performance of the solder paste is good and can achieve a printing rate of 100–160 mm/s. When soldering with a traditional stepped reflow soldering profile, air bubbles are generated on the surface of the solder joint, and there are many voids and defects in the solder joint. A linear reflow soldering profile reduces the residence time below the melting point of the solder paste (approximately 110 s). This reduces the time the zinc is oxidized, reducing solder joint defects. The joint strength of tin-zinc joints soldered with the optimized reflow parameters is close to that of Sn-58Bi and SAC305, with high joint strength.
Originality/value
This study attempts to industrialize the application of Sn-Zn solder and solves the problem that Sn-Zn solder paste is prone to be oxidized in the application and obtains the SMT process parameters suitable for Sn-9Zn-2.5Bi-1.5In solder.
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Mohamad Solehin Mohamed Sunar, Maria Abu Bakar, Atiqah A., Azman Jalar, Muhamed Abdul Fatah Muhamed Mukhtar and Fakhrozi Che Ani
This paper aims to investigate the effect of physical vapor deposition (PVD)-coated stencil wall aperture on the life span of fine-pitch stencil printing.
Abstract
Purpose
This paper aims to investigate the effect of physical vapor deposition (PVD)-coated stencil wall aperture on the life span of fine-pitch stencil printing.
Design/methodology/approach
The fine-pitch stencil used in this work is fabricated by electroform process and subsequently nano-coated using the PVD process. Stencil printing process was then performed to print the solder paste onto the printed circuit board (PCB) pad. The solder paste release was observed by solder paste inspection (SPI) and analyzed qualitatively and quantitatively. The printing cycle of up to 80,000 cycles was used to investigate the life span of stencil printing.
Findings
The finding shows that the performance of stencil printing in terms of solder printing quality is highly dependent on the surface roughness of the stencil aperture. PVD-coated stencil aperture can prolong the life span of stencil printing with an acceptable performance rate of about 60%.
Originality/value
Stencil printing is one of the important processes in surface mount technology to apply solder paste on the PCB. The stencil’s life span greatly depends on the type of solder paste, stencil printing cycles involved and stencil conditions such as the shape of the aperture, size and thickness of the stencil. This study will provide valuable insight into the relationship between the coated stencil wall aperture via PVD process on the life span of fine-pitch stencil printing.
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Rizk Mostafa Shalaby and Mohamed Saad
The purpose of the present work is to study the impacts of rapid cooling and Tb rare-earth additions on the structural, thermal and mechanical behavior of Bi–0.5Ag lead-free…
Abstract
Purpose
The purpose of the present work is to study the impacts of rapid cooling and Tb rare-earth additions on the structural, thermal and mechanical behavior of Bi–0.5Ag lead-free solder for high-temperature applications.
Design/methodology/approach
Effect of rapid solidification processing on structural, thermal and mechanical properties of Bi-Ag lead-free solder reinforced Tb rare-earth element.
Findings
The obtained results indicated that the microstructure consists of rhombohedral Bi-rich phase and Ag99.5Bi0.5 intermetallic compound (IMC). The addition of Tb could effectively reduce the onset and melting point. The elastic modulus of Tb-containing solders was enhanced to about 90% at 0.5 Tb. The higher elastic modulus may be attributed to solid solution strengthening effect, solubility extension, microstructure refinement and precipitation hardening of uniform distribution Ag99.5Bi0.5 IMC particles which can reasonably modify the microstructure, as well as inhibit the segregation and hinder the motion of dislocations.
Originality/value
It is recommended that the lead-free Bi-0.5Ag-0.5Tb solder be a candidate instead of common solder alloy (Sn-37Pb) for high temperature and high performance applications.
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Andromeda Dwi Laksono, Chih-Ming Chen and Yee-Wen Yen
The purpose of this study was to examine the influence of adding a small amount of Ti to a Cu-based alloy, specifically the commercial Hyper Titanium Copper alloy (C1990 HP)…
Abstract
Purpose
The purpose of this study was to examine the influence of adding a small amount of Ti to a Cu-based alloy, specifically the commercial Hyper Titanium Copper alloy (C1990 HP), which contains Cu-3.28 wt.% Ti, on its interfacial reaction with Sn-9.0 wt.% Zn (SnZn) solder, using the liquid/solid reaction couple technique.
Design/methodology/approach
The SnZn/C1990 HP couples were subjected to a reaction temperature of 240–270°C for a duration of 0.5–5 h. The resulting reaction couple was characterized using a scanning electron microscope, energy dispersive spectrometer, electron probe microanalyzer and X-ray diffractometer.
Findings
It was observed that the scallop-shaped CuZn5 and planar Cu5Zn8 phases were formed in almost all SnZn/C1990 HP couples. With increased reaction duration and temperature, the Cu-rich intermetallic compound (IMC)-Cu5Zn8 phase became a dominant IMC formed at the interface. The total thickness of the IMCs was increased with the increase in the reaction duration and temperature. The IMC growth obeyed the parabolic law, and the IMC growth mechanism was diffusion controlled. The activation energy of the SnZn/C1990 HP couple was 64.71 kJ/mol.
Originality/value
This article presents an analysis of the IMC thickness in each sample using ImageJ software, followed by kinetic analysis using Origin software at various reaction temperatures of SnZn/C1990 HP in liquid/solid couples. The study also includes detailed reports on the morphology, interface composition and X-ray diffraction analysis, as well as the activation energy. The findings can serve as a valuable reference for electronic packaging companies that utilize C1990 HP substrates.
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Kai Deng, Liang Zhang, Chen Chen, Xiao Lu, Lei Sun and Xing-Yu Guo
This study aims to explore the feasibility of adding Si3N4 nanoparticles to Sn58Bi and provides a theoretical basis for designing and applying new lead-free solder materials for…
Abstract
Purpose
This study aims to explore the feasibility of adding Si3N4 nanoparticles to Sn58Bi and provides a theoretical basis for designing and applying new lead-free solder materials for the electronic packaging industry.
Design/methodology/approach
In this paper, Sn58Bi-xSi3N4 (x = 0, 0.2, 0.4, 0.6, 0.8, 1.0 Wt.%) was prepared for bonding Cu substrate, and the changes in thermal properties, wettability, microstructure, interfacial intermetallic compound and mechanical properties of the composite solder were systematically studied.
Findings
The experiment results demonstrate that including Si3N4 nanoparticles does not significantly impact the melting point of Sn58Bi solder, and the undercooling degree of solder only fluctuates slightly. The molten solder spreading area reached a maximum of 96.17 mm2, raised by 19.41% relative to those without Si3N4, and the wetting angle was the smallest at 0.6 Wt.% of Si3N4, with a minimum value of 8.35°. When the Si3N4 nanoparticles reach 0.6 Wt.%, the solder joint microstructure is significantly refined. Appropriately adding Si3N4 nanoparticles will slightly increase the solder alloy hardness. When the concentration of Si3N4 reaches 0.6 Wt.%, the joints shear strength reached 45.30 MPa, representing a 49.85% increase compared to those without additives. A thorough examination indicates that legitimately incorporating Si3N4 nanoparticles into Sn58Bi solder can enhance its synthetical performance, and 0.6 Wt.% is the best addition amount in our test setting.
Originality/value
In this paper, Si3N4 nanoparticles were incorporated into Sn58Bi solder, and the effects of different contents of Si3N4 nanoparticles on Sn58Bi solder were investigated from various aspects.
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Chen Chen, Liang Zhang, Xi Huang and Xiao Lu
The purpose of this study is to delve into the mechanism of Si3N4 nanowires (NWs) in Sn-based solder, thereby furnishing a theoretical foundation for the expeditious design and…
Abstract
Purpose
The purpose of this study is to delve into the mechanism of Si3N4 nanowires (NWs) in Sn-based solder, thereby furnishing a theoretical foundation for the expeditious design and practical implementation of innovative lead-free solder materials in the electronic packaging industry.
Design/methodology/approach
This study investigates the effect of adding Si3N4 NWs to Sn58Bi solder in various mass fractions (0, 0.1, 0.2, 0.4, 0.6 and 0.8 Wt.%) for modifying the solder and joining the Cu substrate. Meanwhile, the melting characteristics and wettability of solder, as well as the microstructure, interfacial intermetallic compound (IMC) and mechanical properties of joint were evaluated.
Findings
The crystal plane spacing and lattice constant of Sn and Bi phase increase slightly. A minor variation in the Sn58Bi solder melting point was caused, while it does not impact its functionality. An appropriate Si3N4 NWs content (0.2∼0.4 Wt.%) significantly improves its wettability, and modifies the microstructure and interfacial IMC layer. The shear strength increases by up to 10.74% when adding 0.4 Wt.% Si3N4 NWs, and the failure mode observed is brittle fracture mainly. However, excessive Si3N4 will cause aggregation at the junction between the solder matrix and IMC layer, this will be detrimental to the joint.
Originality/value
The Si3N4 NWs were first used for the modification of lead-free solder materials. The relative properties of composite solder and joints were evaluated from different aspects, and the optimal ratio was obtained.
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Muhammad Arif Mahmood, Chioibasu Diana, Uzair Sajjad, Sabin Mihai, Ion Tiseanu and Andrei C. Popescu
Porosity is a commonly analyzed defect in the laser-based additive manufacturing processes owing to the enormous thermal gradient caused by repeated melting and solidification…
Abstract
Purpose
Porosity is a commonly analyzed defect in the laser-based additive manufacturing processes owing to the enormous thermal gradient caused by repeated melting and solidification. Currently, the porosity estimation is limited to powder bed fusion. The porosity estimation needs to be explored in the laser melting deposition (LMD) process, particularly analytical models that provide cost- and time-effective solutions compared to finite element analysis. For this purpose, this study aims to formulate two mathematical models for deposited layer dimensions and corresponding porosity in the LMD process.
Design/methodology/approach
In this study, analytical models have been proposed. Initially, deposited layer dimensions, including layer height, width and depth, were calculated based on the operating parameters. These outputs were introduced in the second model to estimate the part porosity. The models were validated with experimental data for Ti6Al4V depositions on Ti6Al4V substrate. A calibration curve (CC) was also developed for Ti6Al4V material and characterized using X-ray computed tomography. The models were also validated with the experimental results adopted from literature. The validated models were linked with the deep neural network (DNN) for its training and testing using a total of 6,703 computations with 1,500 iterations. Here, laser power, laser scanning speed and powder feeding rate were selected inputs, whereas porosity was set as an output.
Findings
The computations indicate that owing to the simultaneous inclusion of powder particulates, the powder elements use a substantial percentage of the laser beam energy for their melting, resulting in laser beam energy attenuation and reducing thermal value at the substrate. The primary operating parameters are directly correlated with the number of layers and total height in CC. Through X-ray computed tomography analyses, the number of layers showed a straightforward correlation with mean sphericity, while a converse relation was identified with the number, mean volume and mean diameter of pores. DNN and analytical models showed 2%–3% and 7%–9% mean absolute deviations, respectively, compared to the experimental results.
Originality/value
This research provides a unique solution for LMD porosity estimation by linking the developed analytical computational models with artificial neural networking. The presented framework predicts the porosity in the LMD-ed parts efficiently.
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Bifu Xiong, Siliang He, Jinguo Ge, Quantong Li, Chuan Hu, Haidong Yan and Yu-An Shen
This paper aims to examine the effects of bonding temperature, bonding time, bonding pressure and the presence of a Pt catalyst on the bonding strength of Cu/SB/P-Cu/SB/Cu joints…
Abstract
Purpose
This paper aims to examine the effects of bonding temperature, bonding time, bonding pressure and the presence of a Pt catalyst on the bonding strength of Cu/SB/P-Cu/SB/Cu joints by transient liquid phase bonding (TLPB).
Design/methodology/approach
TLPB is promising to assemble die-attaching packaging for power devices. In this study, porous Cu (P-Cu) foil with a distinctive porous structure and Sn-58Bi solder (SB) serve as the bonding materials for TLPB under a formic acid atmosphere (FA). The high surface area of P-Cu enables efficient diffusion of the liquid phase of SB, stimulating the wetting, spreading and formation of intermetallic compounds (IMCs).
Findings
The higher bonding temperature decreased strength due to the coarsening of IMCs. The longer bonding time reduced the bonding strength owing to the coarsened Bi and thickened IMC. Applying optimal bonding pressure improved bonding strength, whereas excessive pressure caused damage. The presence of a Pt catalyst enhanced bonding efficiency and strength by facilitating reduction–oxidation reactions and oxide film removal.
Originality/value
Overall, this study demonstrates the feasibility of low-temperature TLPB for Cu/SB/P-Cu/SB/Cu joints and provides insights into optimizing bonding strength for the interconnecting materials in the applications of power devices.
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Ravikantha Prabhu, Sharun Mendonca, Pavana Kumara Bellairu, Rudolf D'Souza and Thirumaleshwara Bhat
This study explores how titanium oxide (TiO2) filler influences the specific wear rate (SWR) in flax fiber-reinforced epoxy composites (FFRCs) through a Taguchi approach. It aims…
Abstract
Purpose
This study explores how titanium oxide (TiO2) filler influences the specific wear rate (SWR) in flax fiber-reinforced epoxy composites (FFRCs) through a Taguchi approach. It aims to boost abrasive wear resistance by incorporating TiO2 filler, promoting sustainable and eco-friendly materials.
Design/methodology/approach
This study fabricates epoxy/flax composites with TiO2 particles (0–8 wt%) using hand layup. Composites were tested for wear following American Society for Testing and Materials (ASTM) G99-05. Statistical analysis used Taguchi design of experiments (DOE), with ANOVA identifying key factors affecting SWR in abrasive sliding conditions.
Findings
The study illuminates how integrating TiO2 filler particles into epoxy/flax composites enhances abrasive wear properties. Statistical analysis of SWR highlights abrasive grit size (grit) as the most influential factor, followed by normal load, wt% of TiO2 and sliding distance. Grit size has the highest effect at 43.78%, and wt% TiO2 filler contributes 15.61% to SWR according to ANOVA. Notably, the Taguchi predictive model closely aligns with experimental results, validating its reliability.
Originality/value
This paper integrates TiO2 filler and flax fibers to form a novel hybrid composite with enhanced tribological properties in epoxy composites. The use of Taguchi DOE and ANOVA offers valuable insights for optimizing control variables, particularly in natural fiber-reinforced composites (NFRCs).
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Ravikantha Prabhu, Sharun Mendonca, Pavana Kumara Bellairu, Rudolf Charles DSouza and Thirumaleshwara Bhat
The purpose of this study is to investigate the impact of titanium oxide (TiO2) filler on the abrasive wear properties of bamboo fiber reinforced epoxy composites (BFRCs) using a…
Abstract
Purpose
The purpose of this study is to investigate the impact of titanium oxide (TiO2) filler on the abrasive wear properties of bamboo fiber reinforced epoxy composites (BFRCs) using a Taguchi approach. The study aims to enhance the abrasive wear resistance of these composites by introducing TiO2 filler as a potential reinforcement, thus contributing to the development of sustainable and environmentally friendly materials.
Design/methodology/approach
This study focuses on the fabrication of epoxy/bamboo composites infused with TiO2 particles within the Wt.% range of 0–8 Wt.% using hand layup techniques. The resulting composites were subjected to wear testing according to ASTM G99-05 standards. Statistical analysis of the wear results was carried out using the Taguchi design of experiments (DOE). Additionally, an analysis of variance (ANOVA) was used to determine the influential control factors impacting the specific wear rate (SWR) and coefficient of friction (COF).
Findings
The study illuminates how integrating TiO2 filler enhances abrasive wear in epoxy/bamboo composites. Statistical analysis of SWR highlights abrasive grit size (grit) as the most influential factor, followed by normal load, Wt.% of TiO2 and sliding distance. Analysis of the COF identifies normal load as the primary influential factor, followed by grit, Wt.% of TiO2 and sliding distance. The Taguchi predictive model closely aligns with experimental results, validating its reliability. The morphological study revealed significant differences between the unfilled and TiO2-filled composites. The inclusion of TiO2 improved wear resistance, as evidenced by reduced surface damage and wear debris.
Originality/value
This research paper aims to integrate TiO2 filler and bamboo fibers to create an innovative hybrid composite material. TiO2 micro and nanoparticles show promise as filler materials, contributing to improved tribological properties of epoxy composites. The utilization of Taguchi’s DOE and ANOVA for statistical analysis provides valuable guidance for academic researchers and practitioners in optimizing control variables, especially in the context of natural fiber reinforced composites.
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