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Article
Publication date: 12 May 2020

Barbara Dziurdzia, Maciej Sobolewski, Janusz Mikołajek and Sebastian Wroński

This paper aims to investigate voiding phenomena in solder joints under thermal pads of light-emitting diodes (LEDs) assembled in mass production environment by reflow soldering

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Abstract

Purpose

This paper aims to investigate voiding phenomena in solder joints under thermal pads of light-emitting diodes (LEDs) assembled in mass production environment by reflow soldering by using seven low-voiding lead-free solder pastes.

Design/methodology/approach

The solder pastes investigated are of SAC305 type, Innolot type or they are especially formulated by the manufacturers on the base of (SnAgCu) alloys with addition of some alloying elements such as Bi, In, Sb and Ti to provide low-void contents. The SnPb solder paste – OM5100 – was used as a benchmark. The solder paste coverage of LED solder pads was chosen as a measure of void contents in solder joints because of common usage of this parameter in industry practice.

Findings

It was found that the highest coverage and, related to it, the least void contents are in solder joints formed with the pastes LMPA-Q and REL61, which are characterized by the coverage of mean value 93.13% [standard deviation (SD) = 2.72%] and 92.93% (SD = 2.77%), respectively. The void diameters reach the mean value equal to 0.061 mm (SD = 0.044 mm) for LMPA-Q and 0.074 mm (SD = 0.052 mm) for REL61. The results are presented in the form of histograms, plot boxes and X-ray images. Some selected solder joints were observed with 3D computer tomography.

Originality/value

The statistical analyses are carried out on the basis of 2D X-ray images with using Origin software. They enable to compare features of various solder pastes recommended by manufacturers as low voiding. The results might be useful for solder paste manufacturers or electronic manufacturing services.

Details

Soldering & Surface Mount Technology, vol. 32 no. 4
Type: Research Article
ISSN: 0954-0911

Keywords

Content available
Article
Publication date: 1 December 2000

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Abstract

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Soldering & Surface Mount Technology, vol. 12 no. 3
Type: Research Article
ISSN: 0954-0911

Keywords

Content available
67

Abstract

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Soldering & Surface Mount Technology, vol. 12 no. 3
Type: Research Article
ISSN: 0954-0911

Content available
Article
Publication date: 1 August 2003

55

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Soldering & Surface Mount Technology, vol. 15 no. 2
Type: Research Article
ISSN: 0954-0911

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Content available
Article
Publication date: 1 December 2003

44

Abstract

Details

Soldering & Surface Mount Technology, vol. 15 no. 3
Type: Research Article
ISSN: 0954-0911

Keywords

Content available
Article
Publication date: 1 December 2001

72

Abstract

Details

Soldering & Surface Mount Technology, vol. 13 no. 3
Type: Research Article
ISSN: 0954-0911

Keywords

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Article
Publication date: 1 December 2002

33

Abstract

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Soldering & Surface Mount Technology, vol. 14 no. 3
Type: Research Article
ISSN: 0954-0911

Content available
Article
Publication date: 1 August 2001

43

Abstract

Details

Soldering & Surface Mount Technology, vol. 13 no. 2
Type: Research Article
ISSN: 0954-0911

Keywords

Content available
Article
Publication date: 1 April 2000

57

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Details

Soldering & Surface Mount Technology, vol. 12 no. 1
Type: Research Article
ISSN: 0954-0911

Keywords

Content available
Article
Publication date: 1 December 2001

26

Abstract

Details

Soldering & Surface Mount Technology, vol. 13 no. 3
Type: Research Article
ISSN: 0954-0911

Keywords

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