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This paper aims to investigate voiding phenomena in solder joints under thermal pads of light-emitting diodes (LEDs) assembled in mass production environment by reflow soldering by using seven low-voiding lead-free solder pastes.

The solder pastes investigated are of SAC305 type, Innolot type or they are especially formulated by the manufacturers on the base of (SnAgCu) alloys with addition of some alloying elements such as Bi, In, Sb and Ti to provide low-void contents. The SnPb solder paste – OM5100 – was used as a benchmark. The solder paste coverage of LED solder pads was chosen as a measure of void contents in solder joints because of common usage of this parameter in industry practice.

It was found that the highest coverage and, related to it, the least void contents are in solder joints formed with the pastes LMPA-Q and REL61, which are characterized by the coverage of mean value 93.13% [standard deviation (SD) = 2.72%] and 92.93% (SD = 2.77%), respectively. The void diameters reach the mean value equal to 0.061 mm (SD = 0.044 mm) for LMPA-Q and 0.074 mm (SD = 0.052 mm) for REL61. The results are presented in the form of histograms, plot boxes and X-ray images. Some selected solder joints were observed with 3D computer tomography.

The statistical analyses are carried out on the basis of 2D X-ray images with using Origin software. They enable to compare features of various solder pastes recommended by manufacturers as low voiding. The results might be useful for solder paste manufacturers or electronic manufacturing services.

The purpose of this paper is to develop and test the thermal interface materials (TIM) for application in assembly of semiconductor chips to package. Good adhesion properties (>5 MPa shear strength) and low thermal interface resistance (better than for SAC solders) are the goal of this research.

Mechanical and thermal properties of TIM joints between gold plated contacts of chip and substrate were investigated. Sintering technique based on Ag pastes was applied for purpose of this study. Performance properties were assessed by shear force tests and thermal measurements. Scanning electron microscopy was used for microstructural observations of cross-section of formed joints.

It was concluded that the best properties are achieved for pastes containing spherical Ag particles of dozens of micrometer size with flake shaped Ag particles of few micrometers size. Sintering temperature at 230°C and application of 1 MPa force on the chip during sintering gave the higher adhesion and the lowest thermal interface resistance.

The new material based on Ag paste containing mixtures of Ag particles of different size (form nanometer to dozens of microns) and shape (spherical, flake) suspended in resin was proposed. Joints prepared using sintering technique and Ag pastes at 230°C with applied pressure shows better mechanical and thermal than other TIM materials such as thermal grease, thermal gel or thermally conductive adhesive. Those material could enable electronic device operation at temperatures above 200°C, currently unavailable for Si-based power electronics.

The Kirkendall void had been a well-known issue for long-term reliability of semiconductor interconnects; while even the KVs exist at the interfaces of Cu and Sn, it may still be able to pass the condition of unbias long-term reliability testing, especially for 2,000 cycles of temperature cycling test and 2,000 h of high temperature storage. A large number of KVs were observed after 200 cycles of temperature cycling test at the intermetallic Cu₃Sn layer which locate between the intermetallic Cu₆Sn₅ and Cu layers. These kinds of voids will grow proportional with the aging time at the initial stage. This paper aims to compare various IMC thickness as a function of stress test, the Cu₃Sn and Cu₆Sn₅ do affected seriously by heat, but Ni₃Sn₄ is not affected by heat or moisture.

The package is the design in the flip chip-chip scale package with bumping process and assembly. The package was put in reliability stress test that followed AEC-Q100 automotive criteria and recorded the IMC growing morphology.

The Cu₆Sn₅ intermetallic compound is the most sensitive to continuous heat which grows from 3 to 10 µm at high temperature storage 2,000 h testing, and the second is Cu₃Sn IMC. Cu₆Sn₅ IMC will convert to Cu₃Sn IMC at initial stage, and then Kirkendall void will be found at the interface of Cu and Cu₃Sn IMC, which has quality concerning issue if the void’s density grows up. The first phase to form and grow into observable thickness for Ni and lead-free interface is Ni₃Sn₄ IMC, and the thickness has little relationship to the environmental stress, as no IMC thickness variation between TCT, uHAST and HTSL stress test. The more the Sn exists, the thicker Ni₃Sn₄ IMC will be derived from this experimental finding compare the Cu/Ni/SnAg cell and Ni/SnAg cell.

The research found that FCCSP can pass automotive criteria that follow AEC-Q100, which give the confidence for upgrading the package type with higher efficiency and complexities of the pin design.

This result will impact to the future automotive package, how to choose the best package methodology and what is the way to do the package. The authors can understand the tolerance for the kind of flip chip package, and the bump structure is then applied for high-end technology.

The overall three kinds of bump structures, Cu/Ni/SnAg, Cu/SnAg and Ni/SnAg, were taken into consideration, and the IMC growing morphology had been recorded. Also, the IMC had changed during the environmental stress, and KV formation was reserved.

This paper aims to perform thermal and mechanical characterization for silver-based sintered thermal joints. Layer quality affects thermal and mechanical performance, and it is important to achieve information about how materials and process parameters influence them.

Thermal investigation of the thermal joints analysis method was focused on determination of thermal resistance, where temperature measurements were performed using infrared camera. They were performed in two modes: steady-state analysis and dynamic analysis. Mechanical analysis based on measurements of mechanical shear force. Additional characterizations based on X-ray image analysis (image thresholding), optical microscope of polished cross-section and scanning electron microscope image analysis were proposed.

Sample surface modification affects thermal resistance. Silver metallization exhibits the lowest thermal resistance and the highest mechanical strength compared to the pure Si surface. The type of dynamic analysis affects the results of the thermal resistance.

Investigation of the layer quality influence on mechanical and thermal performance provided information about different joint types.

The purpose of this paper is to investigate the application of reliability engineering to oil and gas (O&G) pipeline systems with the aim of identifying means through which reliability engineering can be used to improve pipeline integrity, specifically with regard to man-made incidents (e.g. material/weld/equipment failure, corrosion, incorrect operation and excavation damages).

A literature review was carried out on the application of reliability tools to O&G pipeline systems and four case studies are presented as examples of how reliability engineering can help to improve pipeline integrity. The scope of the paper is narrowed to four stages of the pipeline life cycle; the decommissioning stage is not part of this research. A survey was also carried out using a questionnaire to check the level of application of reliability tools in the O&G industry.

Data from survey and literature show that a reliability-centred approach can be applied and will improve pipeline reliability where applied; however, there are several hindrances to the effective application of reliability tools, the current methods are time based and focus mainly on design against failure rather than design for reliability.

The tools identified do not cover the decommissioning of the pipeline system. Research validation sample size can be broadened to include more pipeline stakeholders/professionals. Pipeline integrity management systems are proprietary information and permission is required from stakeholders to do a detailed practical study.

This paper proposes the minimum applied reliability tools for application during the design, operation and maintenance phases targeted at the O&G industry. Critically, this paper provides a case for an integrated approach to applying reliability and maintenance tools that are required to reduce pipeline failure incidents in the O&G industry.

This paper aims to develop thermal analysis method of thermal joints characterization. The impact on convection on thermal resistance analysis with use thermography for silver-based thermal joints were investigated for non-metallized and metalized semiconductor surfaces. Heat transfer efficiency depends on thermal conductivity; radiation was used to perform thermographic analysis; the convection is energy loss, so its removing might improve measurements accuracy.

Investigation of thermal joints analysis method was focused on determination of convection impact on thermal resistance thermographic analysis method. Measuring samples placed in vacuum chamber with lowered pressure requires transparent window for infrared radiation that is used for thermographic analysis. Impact of infrared window and convection on temperature measurements and thermal resistance were referred.

The results showed that the silicon window allowed to perform thermal analysis through, and the convection was heat transfer mode which create 15% energy loss.

It is possible to measure thermal resistance for silver-based thermal joints with convection eliminated to improve measurements accuracy.

The purpose of this paper is to present an alternative solution for press-fit technology processes, which could improve the precision of the positioning movements and the stiffness of the structural elements.

A concept is presented and the related kinematics is described. Then, preliminary embodiment evaluations have been performed in terms of kinematics, force control and load distribution on the main structural elements.

Thanks to the additional leg, the proposed solution allows a preload that is capable of compensating the backlash of joints. The particular structure with four extendible legs and eight cardan joints ensures the parallelism between the ground and the plate holding the end effector, without any need of additional controls. However, it implies that the legs are not subjected to pure tension–compression stresses.

This work is focused on the conceptual phase of the design process, with only preliminary embodiment analysis that paves the way for subsequent and more detailed design steps. Especially concerning the actual stiffness of the system, comprehensive evaluations could be performed only after the identification of the particular parts/devices used to implement the main functional elements.

To the best of the authors’ knowledge, this is the first research work that comprehensively describes and analyzes the considered kinematics, within a real industrial application context.

This paper empirically investigates the processes by which manufacturing firms create radical innovations in their core production process, referred to as radical manufacturing technology innovations (RMTI). The purpose of this paper is to improve the understanding of the processes and practices manufacturing firms use to create RMTI.

Creation processes for 23 RMTI projects from diverse industry and technology contexts are explored. Data were collected via semi-structured interviews, and an inductive analysis was carried out to identify similarities and differences in RMTI types and creation processes.

Three types of RMTI and three alternative RMTI creation processes are revealed and characterized. An integrated view is developed of the activities of the equipment supplier and the manufacturing firm, highlighting their different roles and interaction across the three RMTI creation process types.

The exploratory design limits the depth of the analysis per RMTI project, and the focus is on manufacturing technology innovations in one country. The results extend previous case and context-specific findings on RMTI creation processes and provide novel frameworks for cross-case comparisons.

The manufacturing firms’ proactive role in RMTI creation is defined. A framework is proposed for using different RMTI creation processes for different types of RMTI.

This study addresses recent calls for empirical research on understanding the ways in which process innovations unfold in manufacturing firms. The findings emphasize the role of manufacturing firms as creators of RMTI in addition to their role as innovation adopters and implementers and reveal the suitability of different RMTI creation processes for different RMTI types.