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Construction projects have become larger and more complex and yet still maintain a high drive for quality. As a result of this increase in size and complexity, the quantities of documentation and information required to control the overall project process have themselves become more complex. Underpinning the goal of construction quality is real time information flow to and from the construction site along with communications between all the parties involved. Project information integration and collaboration is the key to achievement of coherent quality management and this can be attained through electronically sharing of information during the construction process. The residential sector of the construction industry continually experiences significant numbers of “snags”. Many site issues including snagging need to be resolved quickly and efficiently to avoid dispute and more importantly cost overrun. However, the distinct professions and artisans within the industry rarely acknowledge the needs of others. Indeed the snagging information they produce is often so incompatible that the next stage in many processes is to reconstruct the information into a workable format. Analysis of a range of organisations' approaches to snagging shows that they have their own distinct snagging process. What is required is a coherent approach to the use and implementation of an IT based, industry wide, snagging format which would revolutionise and streamline the recording and approval process of construction snagging.

Health promotion programmes are widely held to be more effective when the subjects of them actively participate in the process of change. The purpose of this paper is to report on an evaluation of the Food for Life Partnership programme, a multi‐level initiative in England promoting healthier nutrition and food sustainability awareness for students and their families through involvement in cooking, growing, farm visits and School Nutrition Action Groups (SNAGs).

The study adopted a mixed methods approach, drawing upon quantitative and qualitative data sources. The data sources included quantitative data on school level programme related activities, qualitative data collected through focus groups with children and reports from teachers and other staff involved in the delivery of the programme.

The paper concludes that the pivotal role of SNAGs in catalysing and embracing a whole school approach must be seen as an important mechanism for any health promotion in complex school environments.

This was a national evaluation of a unique school food project aiming to transform food culture in primary and secondary schools. The findings highlight the importance of a whole school approach to public health initiatives and the centrality of pupil participation in the success and sustainability of such interventions.

The clamour from UK house buyers over “snags” in new homes seems likely to continue unabated even though house builders are striving to resolve what may be perceived as a quality issue. This paper aims to discuss how the requirements, and hence the quality of new homes in the UK, are defined and the role the house buyer actually plays in this process.

Within the composite quality attainment process “snagging” is defined and discussed in detail along with the resulting quality cognitive dissonance likely to be encountered by the buyer. The results of detailed quantitative analysis of data on snagging from nearly 1,700 new homes are presented.

The snagging process shows how heavily the house buying process is geared towards the builder and that within this snagging process there are areas where the builder is absorbing costs, which reduce the potential profit on each house i.e. the absorbed snagging (snags remedied as the work progresses). The visible snagging at hand‐over stage is a further depletion of profit and completely avoidable. The snags are damaging to the image of house builders, they detract from customer satisfaction and they reduce the potential profit available on each new house. The analysis provided in the paper shows that there is a direct relationship between the size of the property and the number of snags identified. Also, there are differences in the number of snags identified for each of the builders and within the company each site has variance on the number of snags discovered: the scale of snags peaks at 389 for a single property – significant in anyone's terms.

Analysing the data was not a simple task due to the structure and variation within the data. It would be ideal to identify the exact factors that affect the number of snags in newly built properties. Collecting identical data with only one differencing factor would complete this. However, as the inspections were carried out randomly on request this was not possible with the present data.

The legal rights of new homebuyers are severely limited under UK law and this research highlights the need for both an improvement in quality and for buyers to ensure that they take steps to protect what is often the largest investment of their lifetime.

The volume of research into quality of new homes in the UK is remarkably scant given the size of the extent of the industry. The size of the data set for this paper is significant and allows fresh insights to be obtained.

This paper aims to present findings from research that evaluate the defects/snagging management process at construction project level and review the potential for the operation of a novel, paper‐based, records management mechanism.

The design and use of a hybrid electronic/paper‐based snagging management system are discussed. The design and practicalities of the system are considered as a means towards demonstrating that a link currently exists between modern IT systems and traditional, paper‐based methods of document transfer.

The paper finds that the snagging aspect of construction projects is often overlooked and under‐estimated. Construction projects require systems that facilitate data input and records management processing, thus removing the reliance upon traditional methods of working. A highly advanced digital pen and paper technology is discussed which has the potential to totally revolutionise the collection of information on paper (for all organisations). The IT system can be adapted for a range of processes/needs which aids not only management but also the individuals on the frontline responsible for collecting site‐based records.

The system highlighted has the potential to be adopted within every construction‐based organisation and indeed wider industrial sectors due to its unique adaptability and ease with which features can be incorporated. There are a number of business benefits to be accrued from the adoption of digital pen and paper‐based IT systems.

Extremely novel technology is discussed. The value to the construction industry and wider industrial sectors is the opportunity to continue working using existing processes, whilst at the same time becoming wholly electronic.

3D chip stacking is a key technology for 3D integration in which two or more chips are stacked with vertical interconnections. In the case of multi chip stacking with fine pitch microbump connections, capillary dispensing presents big limitations in terms of cost and processability. The purpose of this paper is to describe the way in which wafer‐level underfill (WLUF) process development was carried out with particular emphasis on microbump height coplanarity, bonding pressure distribution and the alignment of the microbumps. A three factorial design of experiment (DOE) was also conducted to enhance the understanding of the factors impacting the WLUF process such as bonding pressure, temperature and time on reliability test.

B‐staged WLUF was laminated on an 8″ wafer with a 30 μm pitch bump structure of 8 μm Cu/5 μm Sn2.5Ag Pb‐free solder. After wafer dicing, the chip with the WLUF was assembled on a substrate chip with the same bump structure using a high accuracy bonder. The substrate chip had metalisation (wiring) to enable evaluation of the electrical characteristics of the bonded daisy chain chips as they varied with material bonding process conditions and reliability testing.

The WLUF bonding process development pertaining to the processability and reliability for the flip chip assembly using Cu/SnAg microbumps was successful in this work.

The development of a WLUF bonding process that offers reliability for flip chip assembly using Cu/SnAg microbumps has been presented in this work. The critical steps, such as alignment of the WLUF coated chip with the substrate chip and void elimination, which enable this technology to work were optimised.

The Kirkendall void had been a well-known issue for long-term reliability of semiconductor interconnects; while even the KVs exist at the interfaces of Cu and Sn, it may still be able to pass the condition of unbias long-term reliability testing, especially for 2,000 cycles of temperature cycling test and 2,000 h of high temperature storage. A large number of KVs were observed after 200 cycles of temperature cycling test at the intermetallic Cu₃Sn layer which locate between the intermetallic Cu₆Sn₅ and Cu layers. These kinds of voids will grow proportional with the aging time at the initial stage. This paper aims to compare various IMC thickness as a function of stress test, the Cu₃Sn and Cu₆Sn₅ do affected seriously by heat, but Ni₃Sn₄ is not affected by heat or moisture.

The package is the design in the flip chip-chip scale package with bumping process and assembly. The package was put in reliability stress test that followed AEC-Q100 automotive criteria and recorded the IMC growing morphology.

The Cu₆Sn₅ intermetallic compound is the most sensitive to continuous heat which grows from 3 to 10 µm at high temperature storage 2,000 h testing, and the second is Cu₃Sn IMC. Cu₆Sn₅ IMC will convert to Cu₃Sn IMC at initial stage, and then Kirkendall void will be found at the interface of Cu and Cu₃Sn IMC, which has quality concerning issue if the void’s density grows up. The first phase to form and grow into observable thickness for Ni and lead-free interface is Ni₃Sn₄ IMC, and the thickness has little relationship to the environmental stress, as no IMC thickness variation between TCT, uHAST and HTSL stress test. The more the Sn exists, the thicker Ni₃Sn₄ IMC will be derived from this experimental finding compare the Cu/Ni/SnAg cell and Ni/SnAg cell.

The research found that FCCSP can pass automotive criteria that follow AEC-Q100, which give the confidence for upgrading the package type with higher efficiency and complexities of the pin design.

This result will impact to the future automotive package, how to choose the best package methodology and what is the way to do the package. The authors can understand the tolerance for the kind of flip chip package, and the bump structure is then applied for high-end technology.

The overall three kinds of bump structures, Cu/Ni/SnAg, Cu/SnAg and Ni/SnAg, were taken into consideration, and the IMC growing morphology had been recorded. Also, the IMC had changed during the environmental stress, and KV formation was reserved.

The effects of Pb contamination on the microstructure and shear strength of lead‐free solder joints with non‐lead containing finishes on both the PCB and terminals of 1,206 chip capacitors at different temperatures were investigated. Two kinds of lead‐free solders (Sn96.5Ag3.5 and Sn95Sb5) were selected, and different amounts of eutectic Sn‐Pb were added to these lead‐free solders according to the potential Pb contamination in a 1,206 chip capacitor solder joint. It was found that there was no difference in shear strength of solder joint at room temperature for those with or without Pb contamination, but the shear strength at 1258C for the solder joint without Pb contamination was about 15 percent higher than for those with Pb contamination.

Certain snags arise when trying to stack periodicals in a library so that the volume and number are visible and a particular issue is easily located. Where possible the following should be made standard on the spine, reading from right to left: month, year, title, volume number and/or part number. Where this is not possible the date should be printed on both front and back covers to assist in location.

Describes a campaign to help schools set up school‐based nutrition action groups (SNAGs) to galvanize change towards provision of healthier food on school premises. Highlights the current lack of coherence present in many schools between what is taught about nutrition in the classroom and the type of food available at school meals. Explains how local authorities, education authorities, schools, parents, caterers, children and other relevant parties can work together to form and implement a common policy. Describes how schools now have the powers to influence contracts with caterers, and how caterers can expect to increase the range and volume of their business by working more closely with schools and pupils.