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The purpose of this paper is to find optimal sintering conditions of silver-based nano-inks for achieving the high electrical conductivity of the deposited layers applied on polyimide foils as well as the influence of ageing on the electrical conductivity. Therefore, the investigation in the field of silver layers deposited by inkjet printing technology is presented in this paper.

The four-point resistance measurements were realized for a detailed and precise analysis of the resistance of two different silver layers under different sintering conditions depending on the type of nano-ink varied about the recommended values. Highly accelerated stress tests (HASTs) were also applied as an ageing method for confirmation of the high electrical stability of the silver layers.

The results prove the strong influence of the temperature and the time of the sintering process on the sheet resistance of the investigated silver-based layers deposited by inkjet printing technology on polyimide foils. The HASTs caused significant changes in the electrical conductivity for both nano-inks presented in this paper. The existence of noticeable dependence among the resistivity, thermal treatment and ageing was proved.

The main benefit lays in the optimization of sintering conditions to improve the electrical conductivity of the silver layers. The paper also presents a new approach for a stability analysis of the silver layers by HASTs.

Crack and stress distribution on dies are key issues for the pressure-assisted sintering bonding of power modules. The purpose of this research is to build a relationship among stress distributions, sintering sequences and sintering pressures during the sintering processes.

Three sintering sequences, S(a), S(b) and S(c), have been designed for the double-side assembly of power module in this paper. Experiments and finite element method (FEM) analysis are conducted to investigate the crack and stress distribution.

The sintering sequence had significant effects on the crack generation in the chips during the sintering process under 30-MPa pressure. The simulation results revealed that the module sintered by S(a) showed lower chip stress than those by the other two sintering sequences under 30 MPa. In contrast, the chip stress is the highest when the sintering sequence follows S(b). The simulation results explained the crack generation and prolongation in the experiments. S(a) was recommended as the best sintering sequence because of the lowest chip stress and highest yield rate.

This study investigated the stress distributions of the double-side sintered power modules under different sintering pressures. Based on the results of experiments and FEM analysis, the best sintering sequence design is provided under various sintering pressures.

The purpose of this paper is to investigate the effects of the sintering temperature on the microstructural, morphological and electrical characteristics of Zinc oxide (ZnO)-based varistors.

This study used a conventional method to design and produce ZnO varistors by sintering ZnO powder with small amounts of various metal oxides. Furthermore, the effect of sintering temperature on varistor properties of (Bi, Co, Cr, Sb, Mn)-doped ZnO ceramics was investigated in the range of 1280–1350 °C.

The obtained results showed an E_B value of 2109.79 V/cm, a V_gb value of 0.831 V and a nonlinear coefficient (α) value of 19.91 for sample sintered at temperature of 1300 °C. In addition, the low value of tan δ at low frequency range confirmed that the grain boundaries created in 1300 °C sintering temperature were obviously good.

Based on the previous research on the ZnO-based varistors, a thorough study was carried out on these components to improve their electrical characteristics. Thus, it is necessary that those varistors have low leakage current and low value of dissipation factor to ensure their good quality. High breakdown fields and nonlinearity coefficients are also required in such kind of components. The effect of sintering temperature on the varistor properties of the new compositions (zinc, bismuth, manganese, chrome, cobalt, antimony and silicon oxides)-doped ZnO ceramics was studied in the range of 1280–1350 °C. Also, the microstructure and the phase evolution of the samples sintered at various temperatures (1280 °C, 1300 °C, 1320 °C and 1350 °C) were investigated according to X-ray diffraction and scanning electron microscope measurements.

The purpose of this paper is to investigate the fundamentals of the selective inhibition sintering (SIS) process for fabricating dense metallic parts.

A SIS‐Metal process based on the microscopic mechanical inhibition is developed. In the process, salt solution is printed in the selected area of each powder layer; the salt re‐crystallizes when water evaporates; salt crystals decompose and grow rapidly prior to sintering; the generated salt particles spread between metal powder particles and prevent the fusing of these particles together, hence inhibiting the sintering process in the affected regions.

The SIS‐Metal process has numerous advantages. An inhibition of sintering mechanism is established for the future development of the technology. Through chemical and visual analysis using STM the mechanism for the inhibition phenomenon has been identified.

Only bronze powder has been used in the research. Accordingly, the inhibition chemical has been engineered for this material choice. The approach should be feasible for other metals but a proper inhibitor would need to be found for each material choice.

The only limitation envisioned for the process may be the removal after sintering of inhibited sections in hard‐to reach areas using physical means such as scraping or vibration. Chemical removal of such sections should be possible, however.

The paper illustrates a new additive manufacturing technology for metallic parts fabrication.

The purpose of this paper is to investigate the effect of the Q‐switching parameters on the sintering behavior of laser micro sintering Cu‐based metal powder, using Q‐switched 1064 nm Nd‐YAG laser.

An experimental study has been performed. Metal powder mixture with Cu and Cu‐P alloy powders has been utilized. Q‐switching duration of 15 μs∼25 μs, rate of 25 kHz∼45 kHz have been used.

The results show that as the Q‐switching rate and duration increases, the peak laser power decreases and the densification enhances. However, an optimal peak laser power exists and if the peak laser power is too low, the density of the sample is also low. The densification regime of laser micro‐sintering is not only caused by the liquid phase filling the pores, but is also caused by the Cu powder migrating and by coalescence, e.g. including initial stage and intermediate stage of the traditional furnace liquid phase sintering. However, the degree of these stages depends on the peak power and input laser energy.

The effect of the Q‐switching parameters on sintering behavior of laser micro sintering Cu‐based metal powder using Q‐switched 1064 nm Nd‐YAG laser has been obtained. It is found that the densification behavior is Q‐switching parameters dependent, although the average laser power is same. The densification regime of laser micro‐sintering includes initial stage and intermediate stage of the traditional furnace liquid phase sintering, but the degree is Q‐switching parameters dependent.

Tissue engineering (TE) involves biological, medical and engineering expertise and a current engineering challenge is to provide good TE scaffolds. These highly porous 3D scaffolds primarily serve as temporal holding devices for cells that facilitate structural and functional tissue unit formation of the newly transplanted cells. One method used successfully to produce scaffolds is that of rapid prototyping. Selective laser sintering (SLS) is one such versatile method that is able to process many types of polymeric materials and good stability of its products. The purpose of this paper is to present modeling of the heat transfer process, to understand the sintering phenomena that are experienced by powder particles in the SLS powder bed during the sintering process. With the understanding of sintering process obtained through the theoretical modeling, experimental process of biomaterials in SLS could be directed towards the appropriate sintering window, so as not to cause unintentional degradation to the biomaterials.

SLS uses a laser as a heat source to sinter parts. A theoretical study based on heat transfer phenomena during SLS process was carried out. The study identified the significant biomaterial and laser beam properties that were critical to the sintering result. The material properties were thermal conductivity, thermal diffusivity, surface reflectivity and absorption coefficient.

The influential laser beam properties were laser power and scan speed, which were machine parameters that can be controlled by users. The identification of the important parameters has ensured that favorable sintering conditions can be achieved.

The selection of biopolymer influences the manner in which energy is absorbed by the powder bed during the SLS process. In this paper, the modeling and investigative work was validated by poly(vinyl alcohol) which is a biomaterial that has been used for many biomedical and pharmaceutical purposes.

The paper can be the foundation for extension to other types of biomaterials including biopolymers, bioceramics and biocomposites.

The formulation of the theory for heat transfer phenomena during the SLS process is of significant value to any studies in using SLS for biomedical applications.

To investigate the effects of the infra‐red power level on sintering behaviour in the high speed sintering (HSS) process.

Single‐layer parts were produced using the HSS process, in order to determine the effect of the infra‐red power level on the maximum achievable layer thickness, and the degree of sintering. The parts were examined using both optical microscopy and contact methods.

It was initially expected that an increase in the infra‐red lamp powder might allow an increase in the depth of sintering that could be achieved, as a result of increased thermal transfer through the powder. However, results in fact indicated that there is a maximum layer thickness that can be achieved, as a result of part shrinkage in the z direction. Optical microscopy images have shown that a greater degree of sintering occurs at higher power levels, which would be expected to correspond to an improvement in the mechanical properties of the parts produced. These images also indicate that the radiation absorbing material forms in small “islands” on the powder bed surface. As sintering progresses, these islands begin to merge; this occurs to a greater extent at higher infra‐red lamp powers.

These results are based only on single layer parts. Further work will examine the sintering characteristics of multiple layer parts.

Results have shown that, whilst it is not possible to increase the achievable layer thickness of the parts produced by modifying the infra‐red lamp power, the degree of sintering can be improved greatly by increasing the power.

HSS is an entirely new process which is currently still under development; the results presented here will directly impact the direction of further development and research into this process.

Binder jetting is a promising route to produce complex copper components for electronic/thermal applications. This paper aims to lay a framework for determining the effects of sintering parameters on the final microstructure of copper parts fabricated through binder jetting.

The knowledge gained from well-established powder metallurgy processes was leveraged to study the densification behaviour of a fine high-purity copper powder (D₅₀ of 3.4 µm) processed via binder jetting, by performing dilatometry and microstructural characterization. The effects of sintering parameters on densification of samples obtained with a commercial water-based binder were also explored.

Sintering started at lower temperature in cold-pressed (∼680 °C) than in binder jetted parts (∼900 °C), because the strain energy introduced by powder compression reduces the sintering activation energy. Vacuum sintering promoted pore closure, resulting in greater and more uniform densification than sintering in argon, as argon pressure stabilizes the residual porosity. About 6.9% residual porosity was obtained with air sintering in the presence of graphite, promoting solid-state diffusion by copper oxide reduction.

This paper reports the first systematic characterization of the thermal events occurring during solid-state sintering of high-purity copper under different atmospheres. The results can be used to optimize the sintering parameters for the manufacturing of complex copper components through binder jetting.

This paper presents a unified framework to model the sintering process of fine powders. The framework is based on classical virtual power principle and its corresponding variational principle. Firstly, the classical models of solid state, viscous and liquid phase sintering are reproduced assuming single matter re‐distribution mechanism and using the virtual power principle as the starting point. Then we demonstrate how to obtain the governing equations for microstructural evolution using the variational principle. These provide a common thread through the existing sintering models. Finally a numerical solution scheme is briefly outlined for computer simulation of microstructural evolution using the variational principle as the starting point. The computer simulation can follow the entire sintering process from powder compact to fully dense solid and deal with fully couple multi‐physics processes involving all the possible underlying matter re‐distribution mechanisms. Several examples are provided to demonstrate the deep insights that can be gained into the sintering process by using the numerical tool.

This study aims to develop a bimodal nano-silver paste with improved mechanical property and reliability. Silicon carbide (SiC) particles coated with Ag were introduced in nano-silver paste to improve bonding strength between SiC and Ag particles and enhance high-temperature stability of bimodal nano-silver paste. The effect of sintering parameters such as sintering temperature, sintering time and the proportion of SiC particles on mechanical property and reliability of sintered bimodal nano-silver structure were investigated.

Sandwich structures consist of dummy chips and copper substrates with nickel and silver coating bonded by nano-silver paste were designed for shear testing. Shear strength testing was conducted to study the influence of SiC particles proportions on the mechanical property of sintered nano-silver joints. The reliability of the bimodal nano-silver paste was evaluated experimentally by means of shear test for samples subjected to thermal aging test at 150°C and humidity and temperature testing at 85°C and 85 per cent RH, respectively.

Shear strength was enhanced obviously with the increase of sintering temperature and sintering time. The maximum shear strength was achieved for nano-silver paste sintered at 260°C for 10 min. There was a negative correlation between the proportion of SiC particles and shear strength. After thermal aging testing and humidity and temperature testing for 240 h, the shear strength decreased a little. High-temperature stability and high-hydrothermal stability were improved by the addition of SiC particles.

Submicron-scale SiC particles coated with Ag were used as alternative materials to replace part of nano-silver particles to prepare bimodal nano-silver paste due to its high thermal conductivity and excellent mechanical property.