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This study aims to develop a bimodal nano-silver paste with improved mechanical property and reliability. Silicon carbide (SiC) particles coated with Ag were introduced in nano-silver paste to improve bonding strength between SiC and Ag particles and enhance high-temperature stability of bimodal nano-silver paste. The effect of sintering parameters such as sintering temperature, sintering time and the proportion of SiC particles on mechanical property and reliability of sintered bimodal nano-silver structure were investigated.

Sandwich structures consist of dummy chips and copper substrates with nickel and silver coating bonded by nano-silver paste were designed for shear testing. Shear strength testing was conducted to study the influence of SiC particles proportions on the mechanical property of sintered nano-silver joints. The reliability of the bimodal nano-silver paste was evaluated experimentally by means of shear test for samples subjected to thermal aging test at 150°C and humidity and temperature testing at 85°C and 85 per cent RH, respectively.

Shear strength was enhanced obviously with the increase of sintering temperature and sintering time. The maximum shear strength was achieved for nano-silver paste sintered at 260°C for 10 min. There was a negative correlation between the proportion of SiC particles and shear strength. After thermal aging testing and humidity and temperature testing for 240 h, the shear strength decreased a little. High-temperature stability and high-hydrothermal stability were improved by the addition of SiC particles.

Submicron-scale SiC particles coated with Ag were used as alternative materials to replace part of nano-silver particles to prepare bimodal nano-silver paste due to its high thermal conductivity and excellent mechanical property.

The purpose of this paper is to discuss the use of epoxy‐based conducting adhesives in z‐axis interconnections.

A variety of conductive adhesives with particle sizes ranging from 80 nm to 15 μm were laminated into printed wiring board substrates. SEM and optical microscopy were used to investigate the micro‐structures, conducting mechanism and path. The mechanical strength of the various adhesives was characterized by 90° peel test and measurement of tensile strength. Reliability of the adhesives was ascertained by IR‐reflow, thermal cycling, pressure cooker test (PCT), and solder shock. Change in tensile strength of adhesives was within 10 percent after 1,000 cycles of deep thermal cycling (DTC) between −55 and 125°C.

The volume resistivity of copper, silver and low‐melting point (LMP) alloy based paste were 5 × 10⁻⁴, 5 × 10⁻⁵ and 2 × 10⁻⁵ Ω cm, respectively. Volume resistivity decreased with increasing curing temperature. Adhesives exhibited peel strength with Gould's JTC‐treated Cu as high as 2.75 lbs/in. for silver, and as low as 1.00 lb/in. for LMP alloy. Similarly, tensile strength for silver, copper and LMP alloy were 3,370, 2,056 and 600 ψ, respectively. There was no delamination for silver, copper and LMP alloy samples after 3X IR‐reflow, PCT, and solder shock. Among all, silver‐based adhesives showed the lowest volume resistivity and highest mechanical strength. It was found that with increasing curing temperature, the volume resistivity of the silver‐filled paste decreased due to sintering of metal particles.

As a case study, an example of silver‐filled conductive adhesives as a z‐axis interconnect construction for a flip‐chip plastic ball grid array package with a 150 μm die pad pitch is given.

A high‐performance Z‐interconnect package can be provided which meets or exceeds JEDEC level requirements if specific materials, design, and manufacturing process requirements are met, resulting in an excellent package that can be used in single and multi‐chip applications. The processes and materials used to achieve smaller feature dimensions, satisfy stringent registration requirements, and achieve robust electrical interconnections are discussed.

The purpose of this paper is to characterize and understand the effects of polymer binder, thixotropic agent, solvent and organic medium content on the rheological properties of silver pastes for screen printing front electrode films of solar cells.

Dispersions of silver particles (surface modified with oleic acid) in ethyl cellulose (EC) polymer solutions with and without thixotropic agent were prepared, and yield stress values were measured by setting shear stress to characterize the inter-particle interaction strength of pastes. Steady-state flow, three interval thixotropy shear test and oscillatory measurements were conducted to study the effect of EC polymer and thixotropic agent on viscosity, structure rebuilding and viscoelastic properties of electrode pastes. The effect of solvent was studied by investigating the steady viscosity of cellulose acetate butyrate (CAB) polymer solutions and Ag dispersions.

Weak flocculation network of silver particles was produced because of depletion flocculation. Besides the interaction between thixotropic agent micelles, EC polymer also has a significant interaction with thixotropic agent. Merely increasing EC polymer or thixotropic agent content is not the best way to prevent the layer printed from laying down. The effect of solvent on the viscosity of paste is mainly attributed to the difference of hydromechanics radius and configuration of CAB polymer in solvents. With the increase of organic medium content, the properties of electrode pastes were converted from rigidity to flexibility.

It is still a challenge to obtain high-quality front electrode films for crystalline silicon solar cells by screen printing, because of the difficulty in reducing shadowing losses while ensuring a low series resistance and high filling factor. The paste rheological properties are the key properties related to the paste’s passing ability through the meshes and resistance of paste spreading on the substrate. Organic medium as an important component of the paste is acknowledged to be used to tailor the paste’s rheological properties and have a great role in screen printing.

Printed flexible circuits that combined conventional silicon technology will enable the realisation of many value added products such as smart packaging for the fast moving consumer goods (FMCG) industry. This paper aims to describe an investigation into integrating silicon and printable circuits for the FMCG packaging industry and this would allow products with features such as brand protection, time temperature indicators, customer feedback and visual product enhancement. Responding to interest from the FMCG packaging industry, an investigation was carried out which investigated the printing conductive silver ink on common packaging substrates.

Standard IC mounting patterns were screen printed using two conductive silver materials (one high silver content traditional paste and one lower silver content gel polymer) to four plastic and three paper substrates which represent common FMCG substrates (HDPE, BOPP, PET and three paper substrates). Materials were characterised in terms of material rheology whereas prints were characterised through electrical performance and printed film topology.

There was a significant interaction between the substrate, silver ink formulation and the resultant line quality, line topology and conductivity. On paper substrates, the absorption of binder into the substrate resulted in denser silver packing and higher conductivity for the paste material. Higher conductivities were obtained on the substrates capable of withstanding higher curing temperatures. On the polymer substrates higher conductivity could be obtained by lower content silver materials due to the denser particle packing in the cured ink film as a result of its higher solvent/lower solids components.

Further work should examine the interactions for other printing processes commonly used in the FMCG industry such as rotogravure of flexography and should also examine nano particle materials. Further work should also address the mechanical adhesion of silicon logic on the substrates and bottlenecks in processing.

The lower silver content gel material potentially provides material cost reduction by a factor of between 4 and 7 for the same conductivity. The gel material also has potential for more uniform performance across all substrate types. Typically 3.1 Ω/cm resistance values are achieved on all substrates for 300 micron lines.

For those in the field of smart packaging the work has highlighted the interaction between silver materials and non PET/PEN substrates in flexible printed circuits. It has demonstrated the implications of rheology, substrate absorbency and materials processing temperature on circuit design. For those seeking printing process understanding it has provided further validation to support material transfer mechanisms in the screen printing process.

The purpose of this paper is to characterise the electrical and mechanical properties of multiwall carbon nanotubes (MWCNTs)-based isotropic conductive adhesives (ICAs). The paper also compares the electrical and mechanical performance of MWCNTs-based ICAs with silver flakes and silver nanoparticles-based ICAs.

The ICAs were formulated with dyglycidyl ether bisphenol A epoxy resin and conductive fillers such as silver flakes, silver nanoparticles and MWCNTs. The four-point probe is used to measure the bulk resistivity of the ICAs.

The results from the study showed that the percolation threshold of the MWCNTs-based ICAs is 1.5 Wt.%. At 3 Wt.%, the drop in bulk resistivity is lower than the conventional ICAs. The addition of silver nanoparticles increased the overall bulk resistivity of the system. The mechanical properties improved with the introduction of carbon nanotubes into the silver flakes–epoxy system.

The results from bulk resistivity and mechanical properties of the MWCNTs could help to formulate MWCNTs-based ICAs with optimum weight fraction.

The paper demonstrates that the addition of MWCNTs to the silver-based ICAs will enhance their mechanical and electrical conductivity. In addition, the optimum weight percentage is also determined, which shows a bulk resistivity value lower along with improved mechanical property with the conventional ICA system.

The purpose of this paper was to investigate an influence of a low temperature pressureless sintering process of silver paste on the quality of sintered joints.

The authors analyzed various curing conditions of the paste during its sintering process: 175°C/90 min, 200°C/60 min, 250°C/30 min, 250°C/60 min, 350°C/30 min and 350°C/60 min. They analyzed an influence of the surface plating applied on a ceramic substrate/layer (Cu, Ag, AgPt and Au thick film) on the joints quality. The authors analyzed microstructure and electrical resistance of the joints. They evaluated these properties from the point of view of thermal aging process and changing resistance, after a constant current loading of the sintered joints.

The nanoscale pressureless silver paste can be applied for replacing a pressure-assisted micro-sized silver paste. It was found that the quality of the metal plating applied on the ceramic substrate/layer has a significant impact on the quality of the sintered joints. Copper and AgPt plating have better impact on quality of sintered joints in compare with Ag plating.

This investigation of the quality of the pressureless sintered joints at the silver-silver interface reveals an evident cracking immediately after the silver paste curing. Rapid sintering process typical for silver-based films on the substrate is because of the inter-diffusion between the micro and nanoparticles of silver at interfacial interface.

This study aims to address a comprehensive and integrated investigations pertaining to the preparation of AgNPs with well-defined nano-sized scale using the aforementioned poly (meth acrylic acid [MAA])–chitosan graft copolymer, which is cheap, nontoxic, biodegradable and biocompatible agent as a substitute for the traditionally used toxic reducing agents.

AgNPs are prepared under a range of conditions, containing silver nitrate and poly (MAA)–chitosan graft copolymer concentrations, time, temperature and pH of the preparation medium. To classify AgNPs obtained under the various conditions, ultraviolet–visible spectroscopy spectra and transmission electron microscopy images are used for characterization of AgNPs instrumentally in addition to the visual color change throughout the work. The work was further extended to study the application of the so prepared AgNPs on cotton fabric to see their suitability as antibacterial agent as well as their durability after certain washing cycles.

According to the current investigation, the optimal conditions for AgNPs formation of nearly 3–15 nm in size are 5 g/l, poly (MAA)–chitosan graft copolymer and 300 ppm AgNO₃ in addition to carrying out the reaction at 60°C for 30 min at pH 12. Besides, the application of the so prepared AgNPs on cotton fabric displayed a substantial reduction in antibacterial efficiency against gram-positive and gram-negative bacteria estimated even after 10 washing cycles in comparison with untreated one.

To the best of the authors’ information, no comprehensive study of the synthesis of AgNPs using poly (MAA)–chitosan graft copolymer with a graft yield of 48% has been identified in the literature.

The purpose of this article is the development of up-to-date equipment for making nanocomposites for investigation of the antimicrobial properties of nanotextiles and the creation of a scientific base to choose materials of clothing with a special purpose.

Investigations are focussed on modifying the surface of textile materials by metal ions nanoparticles (AgJ, CuJ). The work of the equipment is based on the creation of metal nanocomposites in polyethyleneglycol (PEG). It is heated up to a temperature of not more than 130ºС, followed by adding the dispersion of metal in small portions to water. Nanoparticles are uniformly distributed on material surface that provides the improvement of its characteristics.

It has been found that modifying natural fibrous materials by nanoparticles of metal ions (AgJ, CuJ) promotes increasing their bactericidal and fungicidal properties with a comparison with traditional cotton materials. Microbiological investigations of antimicrobial properties of the cotton fabric have been conducted according to their effects on staphylococcus bacteria, E. coli and fungi.

This research is limited to cotton fabrics. Therefore, other fabric types can be investigated to expand the data basis in the future.

The main practical point of developed equipment is that it can be used for obtaining bactericidal and fungicidal properties of natural and fibrous materials modified by nanoparticles of metal ions (AgJ, CuJ). That provides new characteristics of textile materials that can be used in the future for special clothing tailoring.

The use of engineering equipment will allow in perspective to produce clothes with bactericidal and fungicidal properties, which can improve people’s lives through the prism of health and finished product quality.

Special equipment for investigation of antimicrobial properties of nanomodified textile materials of different kinds has been engineered, and there is an opportunity to create materials with antibacterial and antifungal properties. The application of this equipment provides the receiving of new characteristics for textile materials with silver ions nanoparticles. Such properties of nanomodified materials are useful for human health and can be used in the production of various textile products.

The purpose of this paper is to present an exhaustive review of research studies and activities in the inkjet printing of conductive materials.

This paper gives a detailed literature survey of research carried out in inkjet printing of conductive materials.

This article explains the inkjet printing process and the various types of conductive inks. It then examines the various factors that affect the quality of inkjet printed interconnects such as printing parameters, materials and substrate treatments. Methods of characterising both the inkjet printing process and the electrical properties of printed conductive materials are also presented. Finally relevant applications of this technology are described.

Inkjet printing is currently one of the cheapest direct write techniques for manufacturing. The use of this technique in electronic manufacturing, where interconnects and other conductive features are required is an area of increasing relevance to the fields of electronics manufacturing, packaging and assembly. This review paper would therefore be of great value and interest to this community.