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The purpose of this paper is to identify trust‐building signals and signaling patterns of commercial and non‐commercial wine bloggers within a trustworthiness framework and assess prominence of balanced versus unbalanced resource‐based or compensatory approaches for the management of consumer trust beliefs and the facilitation of positive trust intentions.

Development and validation of theory‐based signal‐classification scheme and two‐stage content analysis of trust‐building signals embedded in wine blogs.

It is found that wine bloggers manage consumer trust beliefs using an unbalanced signaling approach emphasizing ability over character. Ability sub‐dimension signals vary by commercial orientation. Also, character signaling varies with commercial orientation.

Only English‐language wine blogs were studied. Limitations of content analysis procedures preclude direct evaluation of signal efficacy in absolute or contextualized terms.

Bloggers must secure reader trustworthiness to be effective communicators. Readers are likely to possess latent concerns about the bias of commercial bloggers and abilities of non‐commercial ones. Bloggers recognize the importance of ability signaling but may not be fully exploiting their positions of perceived advantage nor fully compensating for their distinctive inherent perceived weaknesses.

Trustworthiness signaling in wine blogs has implications for bloggers in other contexts, including consumer and non‐consumer information environments and not‐for‐profit and governmental communicators. Blog and blogger trustworthiness must be addressed by these communicators to effect audience persuasion.

The paper discusses deductive development and validation of a novel signal classification scheme applied to trust building by bloggers that, through analysis of signal content, sheds light on behavior of commercial and non‐commercial information sources in emerging product information environments.

As a common transmission line, the microstrip line plays an important role in high-speed circuits. The purpose of this paper was to investigate the effects of the circuit design of microstrip lines on the signal integrity (SI). In addition, the influence of the type and thickness of the solder resist ink on SI was analyzed to provide guidance for the related producing process design of printed circuit boards (PCBs).

Microstrip line properties consisting of shape, line-width/line-space ratio, reference layer design and as-covered solder resist ink were designed to measure the insertion loss (S₂₁) in high-speed PCB.

The study showed that the insertion loss (S₂₁) of straight, meander, snake-shaped and wavy microstrip lines was approximately consistent. A microstrip line with width/space ratio less than 0.96 is necessary, as the differential line closing produces a mutual interference. Reference layer including the discontinuous area should be repaired by adjusting the microstrip line parameters. With regard to the solder resist ink, the insertion loss of novel solder resist ink decreased by 0.163 dB/in at 12.9 GHz and 0.164 dB/in at 14 GHz, compared with traditional solder resist ink. Accordingly, the insertion loss effectively improved at a lower thickness of solder resist.

This paper demonstrated that the common designing factors of line shape, line/space ratio, reference layer and solder resist influence microstrip line SI in the significant reference of designer-making PCB layout.

To review the challenges confronting the electronics interconnection industry as it transitions into the gigahertz frequency range and to describe novel prospective solutions designed to circumvent the problems by means of alternative interconnection architectures while remaining within the confines of the existing manufacturing infrastructure.

The paper has been written in a manner so as to provide first a brief review of the history of interconnections as background reference, providing access and understanding to a broader readership of the significance of the area of investigation. From there, the paper describes the problems facing electronic circuit manufactures relative to the serious matter of assuring signal integrity of high speed interconnections. It then goes on to describe a general class of prospective solutions, which can be implemented through simple architectural changes in design and manufacture. Finally, the paper describes a prototype system which was fabricated using the concepts and the first‐order findings are provided.

From operation of the prototype system, it was found that the concepts, relative to PCB architectural changes prescribed in the paper are capable of delivering performance levels beyond what is accepted when using traditional interconnection modalities. The 10 Gbps backplane prototype has proved capable of sending a 100 mV peak‐to‐peak signal a distance of 75 cm through a two wire single differential pair which pass through two industry standard connectors. The signal generated has a ∼65 percent margin indicating it could go much further and determining the limits an object of future study. The modulation is standard NRZ. With only two wires there was no cross talk in the system, however, the next stage of investigation will consist of a multi‐device assembly to see what cross talk effect there might be, if any.

The chief value of the paper resides in its disclosure of novel approaches to electronic interconnection involving simple changes in circuit architectural structures which extend the signal performance limits of copper interconnections, well beyond present consensus expectations of industry. Moreover, the paper provides first experimental results of the technology in actual operation as proof of concept.

This paper aims to present the problems connected with integrity of electrical signals in microelectronic hybrid systems made on metal substrates. The systems made on ferritic and austenitic sheet substrates were selected for the analysis.

For experimental investigations for the identification of the per-unit-length parameters for the simplest planar structures realized in thick-film technology on metal substrates, three types of path test systems with different geometric parameters were made. For the test circuits’ realization, the metal substrates of ferritic stainless steel of H17 grade (1.4016) with a thickness of 1 mm were selected. The sizes of 110 × 60 mm were obtained by laser cutting which process was required to obtain sufficient flatness of the substrates. Measurements were conducted using special elaborated equipment.

For selected configurations of conductive paths, the results of calculations and measurements of the range of variability of residual parameters for the systems of mutually parallel paths were presented. For selected path systems, the results of signals integrity analysis in mutually parallel path systems have been included.

The influence of configuration of paths, their geometrical and physical parameters on the value of residual elements parameters was determined, and their role in propagation process of fast-changing signals in the mutually parallel path systems was analyzed. These effects are very important from the point of view of electromagnetic compatibility and signal integrity of electronic circuits.

Increasing speeds combined with the level of integration that can be obtained with advanced IC technology has dramatically changed the interconnection requirements for high performance electronic systems. With much of today's circuitry being implemented in custom silicon, IC technology has allowed both a dramatic reduction in size and a tremendous increase in performance. However, in terms of the interconnection problem, the by‐product of advanced IC technology is a new generation of IC s that often require several hundred I/OS, exhibit rise times of 150 ps to 300 ps, and dissipate several watts per device. As demanding requirements are placed upon circuit boards, the complexity of the design task increases dramatically, since a working solution must simultaneously address interconnection density, signal integrity and thermal performance. This paper examines embedded discrete wiring technology as a high density solution that meets the requirements necessary for transporting high speed digital signals.

A family of cavity‐down plastic ball grid array (PBGA) packages have been designed by split via connection (SVC) and split wrap around (SWA) methods. Because of the special designs, these packages consist of a single core of organic material and two‐metal layers of copper and are manufactured with the conventional printed circuit board (PCB) process at very low cost. The electrical performances of the packages are studied by both numerical simulations and experimental measurements. Parasitic parameters are extracted from time domain reflectometer (TDR) and time domain transmission (TDT) measurements. Cross‐talk and simultaneous switch output (SSO) noise of the packages are also investigated.

Drawing on the signaling theory and the relational exchange theory, this study investigates how buyer–supplier trust is influenced through the congruence and incongruence between blockchain and norm of solidarity. The moderating role of technology uncertainty is further examined.

Using a survey data of 110 Chinese firms, this study empirically tests not only the combined effect of blockchain and norm of solidarity on trust, but also how this combined effect is moderated by technology uncertainty. The proposed hypotheses are tested using the polynomial regression analysis and the response surface methodology.

The results suggest that trust increases along with an increasing congruence between blockchain and norm or solidarity, but in a diminishing rate (i.e. an inverted U-shaped relationship). Simultaneously, incongruence between blockchain and norm of solidarity can also guarantee sufficient trust (i.e. a U-shaped relationship). Moreover, technology uncertainty overturns the inverted U-shaped relationship between blockchain and norm of solidarity congruence on trust into a U-shaped relationship and nullifies the U-shaped relationship between blockchain and norm of solidarity incongruence on trust.

This study enriches supply chain governance literature by introducing the emerging blockchain governance and examining the blockchain governance's interplay with a conventional relational norm. The study emphasizes that the combined effects of these two are quite complex. Blockchain and norm of solidarity can offset each other’s limitations when both are at low to moderate levels. But simultaneous pursuit of both high blockchain and norm has only limited marginal benefits. Furthermore, the study also highlights the importance of technology uncertainty under which the combined effects between the two governance mechanisms vary. Collectively, the results provide nuanced insights into the design of supply chain governance portfolios in the digital era.

Describes the Westland active control of structural response (ACSR) technique for reducing and alleviating vibration. Examines a refined coupled rotor/flexible fuselage model based on the ACSR approach. Reports on vibration health monitoring (VHM) which has been developed by Westland and details further work which is continuing in this field.

Typical passive and active vibration reduction systems are dealt with, particular emphasis being on the Westland active control of structural response system fitted to all versions of the EH101. In addition, the extensive experience acquired during the evolution of vibration health monitoring on North Sea helicopters is outlined.