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This paper aims to provide a review of available published literature in which nanostructures are incorporated into AM printing media as an attempt to improve the properties of the final printed part. The purpose of this article is to summarize the research done to date, to highlight successes in the field, and to identify opportunities that the union of AM and nanotechnology could bring to science and technology.

Research in which metal, ceramic, and carbon nanomaterials have been incorporated into AM technologies such as stereolithography, laser sintering, fused filament fabrication, and three‐dimensional printing is presented. The results of the addition of nanomaterials into these AM processes are reviewed.

The addition of nanostructured materials into the printing media for additive manufacturing affects significantly the properties of the final parts. Challenges in the application of nanomaterials to additive manufacturing are nevertheless numerous.

Each of the AM methods described in this review has its own inherent limitations when nanoparticles are applied with the respective printing media. Overcoming these design boundaries may require the development of new instrumentation for successful AM with nanomaterials.

This review shows that there are many opportunities in the marriage of AM and nanotechnology. Promising results have been published in the application of nanomaterials and AM, yet significant work remains to fully harness their inherent potential. This paper serves the purpose to researchers to explore new nanomaterials‐based composites for additive manufacturing.

The purpose of this paper is to develop the models of the dielectric permittivity dispersion of heterogeneous systems based on semiconductors to a level that would allow to apply effectively the method of broadband dielectric spectroscopy for the study of electronic processes in ceramic and composite materials.

The new approach for determining the complex dielectric permittivity of heterogeneous systems with semiconductor particles is used. It includes finding the analytical expression of the effective dielectric permittivity of the separate semiconductor particle of spherical shape. This approach takes into account the polarization of the free charge carriers in this particle, including capturing to localized electron states. This enabled the authors to use the known equations for complex dielectric permittivity of two-component matrix systems and statistical mixtures.

The presented dispersion equations establish the relationship between the parameters of the dielectric spectrum and electronic processes in the structures like semiconductor particles in a dielectric matrix in a wide frequency range. Conditions of manifestation and location of the different dispersion regions of the complex dielectric heterogeneous systems based on semiconductors in the frequency axis and their features are established. The most high-frequency dispersion region corresponds to the separation of free charge carriers at polarization. After this region in the direction of reducing of the frequency, the dispersion regions caused by recharge bulk and/or surface localized states follow. The most low-frequency dispersion region is caused by recharging electron traps in the boundary layer of the dielectric matrix.

Dielectric dispersion models are developed that are associated with: electronic processes of separation of free charge carriers in the semiconductor component, recapture of free charge carriers in the localized electronic states in bulk and on the surface of the semiconductor and also boundary layers of the dielectric at the polarization. The authors have analyzed to situations that correspond applicable and promising materials: varistor ceramics and composite structure with conductive and semiconductor fillers. The modelling results correspond to the existing level of understanding of the electron phenomena in matrix systems and statistical mixtures based on semiconductors. It allows to raise efficiency of research and control properties of heterogeneous materials by dielectric spectroscopy.

Alan Hobby has recently been appointed Applications Engineer at DEK Printing Machines Ltd, Weymouth. In 1968 he joined Ferranti at Bracknell and became one of the small team setting up the thick film production unit. Four years later he joined EMI at Hayes as the Production Engineer, where he gained experience in the manufacture of high volume but relatively simple hybrids. In 1975 Alan moved to Marconi Electronic Devices Ltd at Portsmouth, where he was one of the engineers responsible for the company's programme of qualification as a hybrid manufacturer for the European Space Agency and for their BS 9450 approval programme. Since then he has been concerned with the development of printing and firing techniques both at Portsmouth and at Marconi's high volume production unit at Swindon.

The purpose of this study is to prepare a state-of-the-art review on advanced ceramic materials including their fabrication techniques, characteristics, applications and wettability.

This review paper presents the various types of advanced ceramic materials according to their compounding elements, fabrication techniques of advanced ceramic powders as well as their consolidation, their characteristics, applications and wetting properties. Hydrophobic/hydrophilic properties of advanced ceramic materials are described in the paper with their state-of-the-art application areas. Optical properties of fine ceramics with their intrinsic characteristics are also presented within. Special focus is given to the brief description of application-based manipulation of wetting properties of advanced ceramics in the paper.

The study of wetting/hydrophobicity/hydrophilicity of ceramic materials is important by which it can be further modified to achieve the required applications. It also makes some sense that the material should be tested for its wetting properties when it is going to be used in some important applications like biomedical and dental. Also, these advanced ceramics are now often used in the fabrication of filters and membranes to purify liquid/water so the study of wetting characteristics of these materials becomes essential. The optical properties of advanced ceramics are equally making them suitable for many state-of-the-art applications. Dental, medical, imaging and electronics are the few sectors that use advanced ceramics for their optical properties.

This review paper includes various advanced ceramic materials according to their compounding elements, different fabrication techniques of powders and their consolidation, their characteristics, various application area and hydrophobic/hydrophilic properties.

Vertical-cavity surface-emitting laser (VCSEL) is a high-performance semiconductor device made of unique epitaxial layers grown on n-type GaAs or InP substrates. The VCSEL’s thermal resistance, Rth, is an essential metric that reflects its thermal properties and dependability. The purpose of this paper is to develop packaging for 1 mm² VCSEL chips made of a variety of materials, such as ceramic, lead frame and printed circuit board (PCB)-based packaging, as well as provide an idea or design that can withstand and perform well in terms of Rth and heat dissipation during operation. SolidWorks 2017 and AutoCAD Mechanical 2017 software were used to publish all thoughts and ideas, including the size dimensions (x, y and z) and material choices for each package.

Following the modelling and material selection, the next step is to use the Ansys Mechanical Structural FEA Analysis software to simulate all packaging for Rth and determine which packaging produced the best result, therefore, determining the heat dissipation for each packing. All parameters were used based on the standard cleanroom requirement for the industrial manufacturing backend process, where the cleanroom classification is 10,000 particles (ISO 7). The results demonstrated that the ceramic and lead frame provided good Rth values of 7.3 and 7.0 K/W, respectively, when compared to the PCB, which provided more than 80 K/W; thus, the heat dissipation for PCB packaging also increased.

As a result of the research, it was determined that ceramic and lead frame packaging are appropriate and capable of delivering good Rth and heat dissipation values when compared to PCB. In comparison to PCB, which requires numerous modifications, such as adding via holes and a thermal bar in an attempt to lower the Rth value, neither packaging requires improvement. Ceramic was chosen for development based on Rth's highest performance, with the actual device consisting of a lead frame and PCB. The Zth measurement test was carried out on a ceramic package, and the Rth result was comparable to the simulation result of 7.6 K/W, indicating that simulation was already proved for research and development.

The purpose of this study is to determine which proposed packaging design would give the highest Rth performance of a 1 mm² chip as well as the best heat dissipation. In comparison to other studies, VCSEL packaging used the header and window cap as package components with a wavelength of 850 nm, and other VCSEL packaging developments used the sub mount on ceramic package with an output power ranging from 500 mW to 2 W, whereas this study used a huge wavelength and an output power of 4 W.

On 20 April ISHM‐Benelux held its 1988 Spring meeting at the Grand Hotel Heerlen. This meeting was totally devoted to implantable devices, in particular to the technologies used for these high reliability, extremely demanding devices. For this meeting ISHM‐Benelux was the guest of the Kerkrade facility of Medtronic. Medtronic (headquartered in Minneapolis, USA) is the world's leading manufacturer of implantable electronic devices. Apart from the assembly of pacemakers and heart‐wires, the Kerkrade facility acts as a manufacturing technology centre for Medtronic's European facilities.

The purpose of this paper is to present the utilities of packaging and PCB fabrication processes for manufacturing micro electromechanical systems (MEMS) and its package for sensing and actuation applications.

A broad array of manufacturing approaches available in the packaging industry, including lamination, lithography, etching, electroforming, machining, bonding, etc. and a large number of available functional materials such as polymers, ceramics, metals, etc. were explored for producing functional microdevices with greater design freedom.

Good quality MEMS devices can be manufactured using packaging style fabrication, particularly using stacks of laminates. Furthermore, such microdevices can be built with a high degree of integration, pre‐packaged, and at low cost.

Further manufacturing research work should be undertaken in collaboration with the PCB and packaging industries, which stand to benefit greatly by expanding their offerings beyond serving the semiconductor industry and developing their own integrated MEMS products.

The paper presents examples of basic packaging fabrication processes for producing 3‐D structures and free‐standing structures, and a new MEMS manufacturing paradigm to build micro‐electromechanical (MEMS) for biomedical, optical, and RF communication applications.

Janette Rowland has been appointed marketing services manager of General Hybrid. Based at their facility on Tyneside, and reporting to the general sales manager, Ms Rowland is responsible for all PR, marketing support and promotional activities for General Hybrid worldwide. She joins the company from CSM, a software house, where she held the position of marketing executive.

Amalgams, which are mechanically alloyed mixes of a liquid metal with a powder, offer advantages in situations where large devices are to be bonded to materials with significant coefficient of expansion differences or where extremely temperature‐sensitive devices are to be bonded. This is because these materials will set or harden at or near room temperature to yield hard metallic bonds with melting points from 280°C up to ∼600°C depending upon the systems used. In this paper the results of a survey study of three binary systems of gallium with copper, nickel and silver are described. Wetting characteristics, bond strengths with and without metallisation, bulk properties including electrical and thermal properties and thermal cycle performance of joints are described. The feasibility of using these materials for bonding metallised and unmetallised surfaces of a variety of ceramics and semiconductors is clearly demonstrated.