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The purpose of this paper is to address the gap between definition and practical aspects of production efficiency in mass customization (MC). The paper summarizes all major issues impacting efficiency in MC. Also, the paper reviews metrics, relationship between various parameters and provides a best practices benchmark toolkit to achieve higher machine efficiencies.

The paper identified and categorized multiple challenges impacting machine efficiency in MC through a literature review spanning over three decades, and also ranked the identified issue-based parameters. Top issues were found varying across different types of industries identified through the review. Metrics pertaining to efficiency and degree of MC are reviewed in the paper. A chronological review of issues is presented, and a chain diagram is built in the paper. Toolkit of best practices created with solution strategies and tools are summarized through the review.

The paper found that MC reasonably impacts machine efficiency which needs to be addressed. Major issues through literature review-based ranking are uncovered, and worldwide research trend and comparison are presented. Active research in this area is observed to be at its peak since 2010. The extensive use of strategies and benchmark toolkit for improving efficiency are summarized.

Ranking of issues has been done through a literature review; hence, there can be skewness depending on the frequency of issues researched by various authors in various areas of industries.

This paper is useful for manufacturing managers and companies willing to increase the size of their product portfolio and choices within their available resources without compromising machine efficiencies and, thereby, the cost. The identified issues help in providing a comprehensive issue list to the academia.

This paper describes what is believed to be the first study that explicitly examines the issues faced in achieving machine efficiency while manufacturing in an MC environment.

We examine the evolution of vertical specialization in three industries: chemicals, computers, and semiconductors. Vertical specialization is the restructuring of industry-wide value chains, such that different stages are controlled by different firms, rather than being vertically integrated within the boundaries of individual firms. In some cases, vertical specialization may span international boundaries and is associated with complex international production networks. After decades of vertical specialization, firms in the chemical industry are re-integrating stages of the value chain. By contrast, the semiconductor and computer industries have experienced significant vertical specialization during the past ten years. We examine how and why these contrasting trends in vertical specialization have co-evolved with industry maturation and decline, and underscore the importance and role of both industry factors and business strategies necessary for industries to become more specialized. We also consider the effects of vertical specialization on the sources of innovation and the geographic redistribution of production and other activities. We conclude that the evolution of vertical specialization in these three industries has both reflected and influenced the strategies of leading firms, while also displays industry-specific characteristics that are rooted in different technological and market characteristics.

Researchers continue to seek understanding of industrialization as a state managed process. How to create and implement new industries based on advanced knowledge is on the policy agenda of many advanced nations. Measures that promote these developments include national capacity building in science and technology, the formation of technology transfer systems, and the establishment of industrial clusters. What these templates often overlook is an analysis of use. This chapter aims to increase the understanding of the processes that embed new solutions in structures from an industrial network perspective. The chapter describes an empirical study of high-technology industrialization in Taiwan that the researcher conducts to this end. The study shows that the Taiwanese industrial model is oversimplified and omits several important factors in the development of new industries. This study bases its findings on the notions that resource combination occurs in different time and space, the new always builds on existing resource structures, and the users are important as active participants in development processes.

Foundry, Design House, and integrated device manufacturers (IDM) are major characters in the semiconductor industry value chain. The purpose of this paper is to discuss patterns of characters' evolution in technology through patents classified as wafer‐design application patents and wafer‐process patents.

Various patent indicators, such as average patent citation count, and the combination of the average patent citation count and relative patent count share were used to measure the patent activity, patent quality, and the combination of the patent quality and relative patent activity share, respectively. The study period (1979‐2009) was divided into three major technology or wafer size eras, 1979‐1991 for the 6‐ and pre 6‐inch wafer era, 1989‐1999 for the 8‐inch wafer era, and 1997‐2009 for the 12‐inch wafer era.

Foundry has gradually become the technology transferor rather than purely the manufacturing capacity provider. Foundry's impact on the technology level has risen steeply on both the wafer‐process technology fields and the wafer‐design application technology fields. As a result, IDM, traditionally considered the primary technology contributor in the semiconductor value chain for the past 30 years, will continue to be challenged in the semiconductor industry.

Some hypotheses are clarified to provide managerial implications for the semiconductor industry. Owing to Foundry's rise in technology activity and quality, IDM/Design House should not merely view it as one of their capacity providers but should also pursue a technology alliance with it.

The paper clarifies the traditional hypotheses of the characters of technology in the semiconductor value chain.

Briefly reviews previous literature by the author before presenting an original 12 step system integration protocol designed to ensure the success of companies or countries in their efforts to develop and market new products. Looks at the issues from different strategic levels such as corporate, international, military and economic. Presents 31 case studies, including the success of Japan in microchips to the failure of Xerox to sell its invention of the Alto personal computer 3 years before Apple: from the success in DNA and Superconductor research to the success of Sunbeam in inventing and marketing food processors: and from the daring invention and production of atomic energy for survival to the successes of sewing machine inventor Howe in co‐operating on patents to compete in markets. Includes 306 questions and answers in order to qualify concepts introduced.

The semiconductor industry has attracted considerable attention during the last twenty years as a major high stakes business battlefield between American corporations and Japanese society. Recently, other Asian countries have made inroads into this industry. Consistent with Michael Porter's thesis on the importance of national industry related clusters (Porter, J 990), this paper predicts that between now and the year 2000, the entrepreneurial characteristics of American companies will lead them to significant market share increases and that Japanese businesses will lose market share to other Asian companies, particularly in South Korea. Beyond the year 2000, the industry may evolve to the point where geographic areas concentrate on specific dimensions of the industry with the United States strong in innovation and Asia emphasizing manufacturing efficiencies. It is also possible that later in the 21st century, continued economic growth in Asia could lead to Asian companies taking expanded leadership roles in the industry. This paper acknowledges the importance of government intervention both in the United States and Japan in the early stages of the industry, but argues that the evolving maturity of the semiconductor industry is reducing the need for government subsidies, even though trade issues, especially with China, continue to be important.

The purpose of this paper is to present the utilities of packaging and PCB fabrication processes for manufacturing micro electromechanical systems (MEMS) and its package for sensing and actuation applications.

A broad array of manufacturing approaches available in the packaging industry, including lamination, lithography, etching, electroforming, machining, bonding, etc. and a large number of available functional materials such as polymers, ceramics, metals, etc. were explored for producing functional microdevices with greater design freedom.

Good quality MEMS devices can be manufactured using packaging style fabrication, particularly using stacks of laminates. Furthermore, such microdevices can be built with a high degree of integration, pre‐packaged, and at low cost.

Further manufacturing research work should be undertaken in collaboration with the PCB and packaging industries, which stand to benefit greatly by expanding their offerings beyond serving the semiconductor industry and developing their own integrated MEMS products.

The paper presents examples of basic packaging fabrication processes for producing 3‐D structures and free‐standing structures, and a new MEMS manufacturing paradigm to build micro‐electromechanical (MEMS) for biomedical, optical, and RF communication applications.

This study aims to discuss the development of the semiconductor industry in China and analyzes it through current studies about the catch up of latecomers in newly industrialized countries (NICs).

Use the case study approach to explore and discuss the development track of the Chinese semiconductor industry and the catch up experience of Huang Hong NEC in China.

The experience of NICs can explain the catch up of semiconductor latecomers in China. However, the role of government has changed along with the whole development of the China semiconductor industry; external pressure may influence the pace of development and the span of control of the China Government for future catch ups.

The study focuses on one single case, which may not reflect the individual differences appeared in different firms in China.

This study contributes to our knowledge about the catch up of latecomer firms in an emerging market and verifies classical arguments about the experience of NICs through the experience of China's semiconductor industry.

Semiconductor manufacturing is in the spotlight of the global manufacturing industries. Quality management is strategically and tactically important for gaining a competitive advantage. Since Taiwan’s semiconductor industry is one of the major suppliers of global semiconductor products, its quality management practice has a global impact. This research was conducted based on a proven measurement instrument for quality management practices including eight critical factors and 63 measuring items. Data were analyzed with respect to their reliability, mean rank, consistency, and correlation. Analysis results revealed insights into managers’ perception of quality management practices in the semiconductor industries.

Existing earlier supplier involvement (ESI) models mostly emphasize the product development perspective with limited attention to the process development dimension. Towards this end, this paper aims at a tailored framework for semiconductor manufacturing firms by taking into account the implementation of ESI in process development as well as product development.

A number of well‐recognized propositions are examined through a case study of MIC Semiconductors Asia. Based on observations from the case study, the problems of existing frameworks are analyzed and accordingly possible solutions are explored.

The case study reveals the importance of process development in ESI implementation. It is imperative to build up on some fundamentals of the company before ESI can be carried out successfully. Also observed is that the effectiveness of a supplier selection criterion should be gauged from the performance of the suppliers. It is also found out what type of relationships with suppliers are favorable to ESI, regardless whether the length of the relationship can be translated to trust in technical capability in practice.

Examining existing ESI models through a real case study sheds light on the practical application of ESI. In particular, the semiconductor manufacturing process is emphasized in addition to the general ESI focus on product development.