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The paper presents one of the first attempts to identify and categorise the fundamental barriers currently preventing the multibillion semiconductor equipment manufacturing industry from implementing existing B2B e-trading models for its secondary market. It furthermore proposes a global e-business strategy supporting aftermarket integration with the industry's supply chain.

Because of the global nature of the industry, the research employs a multiple case-study design to explore the state-of-the-art in semiconductor excess management. The data for this analysis are obtained through a number of in-depth interviews with experts from a cross-section of the industry, and further supplemented and validated with a systematic literature review and public corporate data.

The results indicate that significant market imperfections still exist in the industry due to information and knowledge deficits, organisational inefficiency and IP-related concerns. The considerable levels of third-party competition to the original equipment manufacturers raise questions about the existence and efficacy of reverse logistics processes and Closed-Loop Supply Chain (CLSC) management strategies in this industry. It has been shown that a leaner semiconductor supply chain is achievable through the implementation of the proposed B2B e-marketplace, maintaining the information exchange on the surplus/obsolete equipment and parts.

These outcomes are unique for supporting the design of the first global e-marketplace for the secondary semiconductor equipment and spares. The results can, furthermore, inform the standardisation of the semiconductor aftermarket transactions, streamline knowledge exchange mechanisms amongst different industry players and improve pricing strategies. These contribute to knowledge of principles allowing the aftermarket e-trading to become a key part of the value network in high-tech manufacturing industries.

The semiconductor industry has attracted considerable attention during the last twenty years as a major high stakes business battlefield between American corporations and Japanese society. Recently, other Asian countries have made inroads into this industry. Consistent with Michael Porter's thesis on the importance of national industry related clusters (Porter, J 990), this paper predicts that between now and the year 2000, the entrepreneurial characteristics of American companies will lead them to significant market share increases and that Japanese businesses will lose market share to other Asian companies, particularly in South Korea. Beyond the year 2000, the industry may evolve to the point where geographic areas concentrate on specific dimensions of the industry with the United States strong in innovation and Asia emphasizing manufacturing efficiencies. It is also possible that later in the 21st century, continued economic growth in Asia could lead to Asian companies taking expanded leadership roles in the industry. This paper acknowledges the importance of government intervention both in the United States and Japan in the early stages of the industry, but argues that the evolving maturity of the semiconductor industry is reducing the need for government subsidies, even though trade issues, especially with China, continue to be important.

The purpose of this paper is to evaluate logistics service quality using the Kano’s service quality model in the logistics-triadic context.

This study undertakes a survey research in semiconductor manufacturing equipment (SME) industry. Logistics service quality is categorized using Kano’s classification and a comparison is made of the perception of three sample groups who are SME firms, semiconductor manufacturers (SMs) and third-party logistics (TPL) providers.

Several attributes of logistics service quality are evaluated as “Must-be” quality which does not contribute to customer satisfaction, indicating existence of the non-linear relationship between some logistics service quality attributes and customers’ satisfaction. The group comparison reveals that TPL firms perceive most quality attributes as “Attractive” and “One-dimensional” whereas SMs and SME firms perceive more attributes as “Must-be.”

Logistics service quality elements should not be used in the same way assuming the same effect of logistics service elements on customer satisfaction. It should be also noted that logistics service quality attributes have different effect on satisfaction according to the positions in the logistics triad.

This paper provides SME firms with useful information on how to manage their logistics service quality to improve customer satisfaction. SME firms and TPL providers need to arrange a collaborative format where logistics service quality is regularly monitored and three members discuss solutions to improve their quality performance.

This study is a rare empirical investigation to actually assess and compare perception on logistics service quality among the entities in a logistics triad. This study applies the Kano model to the triadic relationship in logistics service provision, which may be the first attempt to the authors’ best knowledge.

The electronics industries are relying increasingly on robotics for their production. Wafer handling robots are used to transfer wafers between wafer processing stations. A pick‐measure‐place method is typically utilized to transfer wafers accurately. The measurement step is performed using an aligner, which is time‐consuming. To increase wafer transfer efficiency, it is desirable to speed up the measurement process or place it in parallel with other operations. To solve the problem, optic sensors are installed at each station to estimate the wafer eccentricity on‐the‐fly. The eccentricity values are then applied to control the robot to place the wafer directly onto another station accurately without using the aligner. However, current methods face problems to achieve high accuracy requirements to meet the electronic manufacturing needs. The purpose of this paper is to develop a technique to improve the wafer handling performance in semiconductor manufacturing.

The kinematics model of the wafer handling robot is developed. Two sensor location calibration algorithms are proposed. Method I is based on the wafer handling path. Method II uses the offset paths from the wafer handling path. The results from these two methods are compared. To compute the wafer eccentricity on‐the‐fly, a wafer eccentricity estimation technique is developed.

The developed methods are implemented using a wafer handling robotic system in semiconductor manufacturing. The wafer eccentricity estimation errors are greatly reduced using the developed methods. The experimental results demonstrate that Method II achieves better results and can be used to improve the wafer handling accuracy and efficiency.

The proposed technique is implemented and tested many times on a wafer handing robotic system. The notch alignment in the wafer handling needs further research.

The developed method is validated using a system in semiconductor manufacturing. Hence the developed method can be directly implemented in production if the notch of a wafer can be identified.

This paper provides techniques to improve the wafer handling accuracy in semiconductor manufacturing. Compared with the results using other methods, Method II greatly increases the wafer handling accuracy to satisfy the semiconductor manufacturing needs.

The purpose of this paper is to examine the relationship between service integration and manufacturing firms’ profitability and to identify profitable services.

The study examines the service integration data of 202 firms in the machinery and equipment sector in Korea. Firm profitability comes from secondary data to eliminate common method bias.

The relationship between service integration, measured as the service-revenue ratio, and profitability has an inverted U-shape, likely stemming from political costs, a loss of opportunity in manufacturing improvements arising from resource constraints, and an increase in transaction costs. In addition, process operation outsourcing and technical consulting significantly contribute to profitability.

The authors show that the effect of service integration on profitability diminishes when firms experience both resource constraints and an increase in transaction costs from implementing the strategy. Furthermore, the profitability of services is heterogeneous across different offerings. Further research in other countries and sectors is necessary to refine the relationships suggested herein.

Managers should strive to minimize the costs and problems stemming from resource constraints and transaction costs. It is also important to utilize external resources to achieve profitability from service integration. Managers also need to realize the different cost-revenue structure of each service.

The authors find that the relationship between profitability and service integration depends on the degree of resource constraints and transaction costs. The authors also identify which service offerings are highly profitable, which has not been done in previous research.

The purpose of this paper is to address the gap between definition and practical aspects of production efficiency in mass customization (MC). The paper summarizes all major issues impacting efficiency in MC. Also, the paper reviews metrics, relationship between various parameters and provides a best practices benchmark toolkit to achieve higher machine efficiencies.

The paper identified and categorized multiple challenges impacting machine efficiency in MC through a literature review spanning over three decades, and also ranked the identified issue-based parameters. Top issues were found varying across different types of industries identified through the review. Metrics pertaining to efficiency and degree of MC are reviewed in the paper. A chronological review of issues is presented, and a chain diagram is built in the paper. Toolkit of best practices created with solution strategies and tools are summarized through the review.

The paper found that MC reasonably impacts machine efficiency which needs to be addressed. Major issues through literature review-based ranking are uncovered, and worldwide research trend and comparison are presented. Active research in this area is observed to be at its peak since 2010. The extensive use of strategies and benchmark toolkit for improving efficiency are summarized.

Ranking of issues has been done through a literature review; hence, there can be skewness depending on the frequency of issues researched by various authors in various areas of industries.

This paper is useful for manufacturing managers and companies willing to increase the size of their product portfolio and choices within their available resources without compromising machine efficiencies and, thereby, the cost. The identified issues help in providing a comprehensive issue list to the academia.

This paper describes what is believed to be the first study that explicitly examines the issues faced in achieving machine efficiency while manufacturing in an MC environment.

Briefly reviews previous literature by the author before presenting an original 12 step system integration protocol designed to ensure the success of companies or countries in their efforts to develop and market new products. Looks at the issues from different strategic levels such as corporate, international, military and economic. Presents 31 case studies, including the success of Japan in microchips to the failure of Xerox to sell its invention of the Alto personal computer 3 years before Apple: from the success in DNA and Superconductor research to the success of Sunbeam in inventing and marketing food processors: and from the daring invention and production of atomic energy for survival to the successes of sewing machine inventor Howe in co‐operating on patents to compete in markets. Includes 306 questions and answers in order to qualify concepts introduced.

Researchers continue to seek understanding of industrialization as a state managed process. How to create and implement new industries based on advanced knowledge is on the policy agenda of many advanced nations. Measures that promote these developments include national capacity building in science and technology, the formation of technology transfer systems, and the establishment of industrial clusters. What these templates often overlook is an analysis of use. This chapter aims to increase the understanding of the processes that embed new solutions in structures from an industrial network perspective. The chapter describes an empirical study of high-technology industrialization in Taiwan that the researcher conducts to this end. The study shows that the Taiwanese industrial model is oversimplified and omits several important factors in the development of new industries. This study bases its findings on the notions that resource combination occurs in different time and space, the new always builds on existing resource structures, and the users are important as active participants in development processes.

To provide an overview of the most commonly used performance and productivity evaluation metrics in the semiconductor industry in order to understand both the impact of the different metrics and the relationship between them, and to identify emerging opportunities for future research.

A range of recently published works (1988‐2003), which aim to provide engineering‐oriented approaches for the analysis of manufacturing operations in the semiconductor industry, is reviewed and critiqued to help researchers and practitioners to well understand the impacts of implementing such performance metrics. After a background on performance management, the metrics are sorted into sections and analysed both individually and in comparison with one another.

Information about each performance index, mainly indicating how it is applied to semiconductor fabrication, as well as the internal and external factors that affect it. A list of relevant scientific works related to these topics is presented.

This paper only focuses on a review of manufacturing performance in the semiconductor industry. Nevertheless, the analysis does not limit the applicability of some concepts to other types of manufacturing industries.

A very successful source of information and analysis that has general applicability as a reference tutorial for practitioners and researchers within the operations and production management community, and especially for those working with the integrated circuit semiconductor industry.

By adding a management dimension, this paper is a useful synthesis of practitioners' insights and of the contents of research papers that have been traditionally engineering‐oriented. This analysis has general applicability as a reference tutorial for practitioners and researchers within the operations and production management community.

The purpose of this paper is to demonstrate industrial Internet of Things (IIoT) solution to improve the equipment condition monitoring with equipment status data and process condition monitoring with plasma optical emission spectroscopy data, simultaneously. The suggested research contributes e-maintenance capability by remote monitoring in real time.

Semiconductor processing equipment consists of more than a thousand of components, and unreliable condition of equipment parts leads to the failure of wafer production. This study presents a web-based remote monitoring system for physical vapor deposition (PVD) systems using programmable logic controller (PLC) and Modbus protocol. A method of obtaining electron temperature and electron density in plasma through optical emission spectroscopy (OES) is proposed to monitor the plasma process. Through this system, parts that affect equipment and processes can be controlled and properly managed. It is certainly beneficial to improve the manufacturing yield by reducing errors from equipment parts.

A web-based remote monitoring system provides much of benefits to equipment engineers to provide equipment data for the equipment maintenance even though they are physically away from the equipment side. The usefulness of IIoT for the e-maintenance in semiconductor manufacturing domain with the in situ monitoring of plasma parameters is convinced. The authors found the average electron temperature gradually with the increase of Ar carrier gas flow due to the increased atomic collisions in PVD process. The large amount of carrier gas flow, in this experimental case, was 90 sccm, dramatically decreasing the electron temperature, which represents kinetic energy of electrons.

Semiconductor industries require high level of data security for the protection of their intellectual properties, and it also falls into equipment operational condition; however, data security through the Internet communication is not considered in this research, but it is already existing technology to be easily adopted by add-on feature.

The findings indicate that crucial equipment parameters are the amount of carrier gas flow rate and chamber pressure among the many equipment parameters, and they also affect plasma parameters of electron temperature and electron density, which directly affect the quality of metal deposition process result on wafer. Increasing the gas flow rate beyond a certain limit can yield the electron temperature loss to have undesired process result.

Several research studies on data mining with semiconductor equipment data have been suggested in semiconductor data mining domain, but the actual demonstration of the data acquisition system with real-time plasma monitoring data has not been reported. The suggested research is also valuable in terms of high cost and complicated equipment manufacturing.