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We examine the patenting behavior of firms in an industry characterized by rapid technological change and cumulative innovation. Recent survey evidence suggests that semiconductor firms do not rely heavily on patents to appropriate returns to R&D. Yet the propensity of semiconductor firms to patent has risen dramatically since the mid-1980s. We explore this apparent paradox by conducting interviews with industry representatives and analyzing the patenting behavior of 95 U.S. semiconductor firms during 1979–1995. The results suggest that the 1980s strengthening of U.S. patent rights spawned “patent portfolio races” among capital-intensive firms, but it also facilitated entry by specialized design firms.

A real-time production scheduling method for semiconductor back-end manufacturing process becomes increasingly important in industry 4.0. Semiconductor back-end manufacturing process is always accompanied by order splitting and merging; besides, in each stage of the process, there are always multiple machine groups that have different production capabilities and capacities. This paper studies a multi-agent based scheduling architecture for the radio frequency identification (RFID)-enabled semiconductor back-end shopfloor, which integrates not only manufacturing resources but also human factors.

The architecture includes a task management (TM) agent, a staff instruction (SI) agent, a task scheduling (TS) agent, an information management center (IMC), machine group (MG) agent and a production monitoring (PM) agent. Then, based on the architecture, the authors developed a scheduling method consisting of capability & capacity planning and machine configuration modules in the TS agent.

The authors used greedy policy to assign each order to the appropriate machine groups based on the real-time utilization ration of each MG in the capability & capacity (C&C) planning module, and used a partial swarm optimization (PSO) algorithm to schedule each splitting job to the identified machine based on the C&C planning results. At last, we conducted a case study to demonstrate the proposed multi-agent based real-time production scheduling models and methods.

This paper proposes a multi-agent based real-time scheduling framework for semiconductor back-end industry. A C&C planning and a machine configuration algorithm are developed, respectively. The paper provides a feasible solution for semiconductor back-end manufacturing process to realize real-time scheduling.

Whatever one may feel is the importance of particular interconnection and assembly technologies with which one is associated, Thin Film or Thick Film Hybrid, PCB Through Hole, Surface Mounting, etc., the driving force in electronics is the high degree of low cost functionality brought by semiconductor technology. However, semiconductor science cannot provide systems solutions on its own and needs to be combined with suitable interconnection and assembly technologies to bring its potential processing power to fulfilment. Hybrid technology holds a key role in the use of silicon in overall system integration. On hybrid substrates semiconductors can be applied in any of the forms available, from bare dice to encapsulated, tested and burnt‐in complex functions in LSI. Over the years hybrids have developed, needing semiconductors as the active elements in providing functional modules. The relationship between the technologies has been close but not always in perfect harmony at the commercial interfaces. The first part of this paper reviews development of semiconductors in relation to the forms of packaging available for application in hybrid assembly including the emergent means being adopted to tackle the problems of ever increasing lead counts that will be with us for some time until the dream of total self‐sufficiency on silicon becomes a reality. The second part of the paper reviews silicon design options with the emphasis on the relevance of combining silicon implementation with hybrid methods.

This study aims to understand how Brazilian design houses (DHs) use open innovation in joint development projects for integrated circuits.

As a research strategy, qualitative research using multiple case studies was made. As sources of evidence, semi-structured interviews were conducted with three DHs of Programa integrated circuit [circuito integrado(CI)]-Brasil and with four specialists in the field, as well as analysis of documents. The data were analyzed through content analysis.

The results showed the DHs use sources of external knowledge in their innovation process, to assist the development of new products, to access new knowledge and skills, to attract financial resources and to be competitive in the market of high technology.

The study has important implications on the semiconductor industry in Brazil, as the industry is considered strategic for the competitiveness of final goods sector. The importance of encouraging the development of partnerships in the sector, the possibility of using informal agreements to mediate the collaboration between DHs and external agents, and the improvement and long-term continuity of public policies to support the industry are among the implications. In addition to suggestions for new business approaches to assist the strengthening of this segment.

Scott McGregor is President and CEO of Philips Semiconductors, one of the five divisions of Royal Philips Electronics. Philips Semiconductors, based in Eindhoven, The Netherlands, has over 34,000 employees in more than 50 countries. With sales of around €4.6 billion in 2002, Philips Semiconductors is one of the world’s top ten semiconductor suppliers. The division is focused on becoming the leading provider of semiconductor‐based solutions for connected consumer applications. Additionally, it is a volume manufacturer of semiconductors for multi‐market products. In this interview, Mr. McGregor discusses the need for leaders to practice transparent communication, develop their flexibility and take an informed approach to outsourcing.

To determine the status of internet and e‐commerce adoption by the Taiwan semiconductor industry, the research is designed to help government and enterprise in formulating strategic plans and making resource allocation decisions.

Using the three‐level model of internet commerce adoption (MICA), a survey of 287 companies and web sites was designed. Semiconductor firms were placed into five categories: integrated circuit (IC) design, manufacturing, packaging, IC testing, and peripheral device manufacturing.

The MICA model shows the internet adoption ratio for semiconductor firms as 82.6 percent, significantly higher than the electronics and electrical machinery industry sector (56.5 percent). The IC manufacturing and packaging segment are in the processing stage, the final stage of development for the MICA model. One‐third of the IC testing industry segment falls into the provision stage, and 36.1 percent web sites are in the processing stage. The IC design and peripherals industrial segments are located in the provision stage.

The IC manufacturing segment is conducting more financial transactions than the other segments – a result that matches earlier research showing that larger companies are most likely to implement e‐business applications. Many enterprises in the industry are lagging with the adoption of the internet indicating a need for education and training.

This benchmark study provides a framework for evaluating the internet adoption status of semiconductor and other high technology firms. The MICA model is demonstrated to be suitable for evaluating the different stages of internet adoption.

The paper deals with a spatial discretization of transient semiconductor device equations. The method can be regarded as a combination of FDM‐ and FEM‐ideas. In the first part of the paper the method is described and—for a weakly acute triangulation—existence, uniqueness, non‐negativity, stability and conservativity of the semidiscrete solution are proved. The second part contains an error estimation under stronger assumptions on the regularity of the analytical solution and on the uniformity of the triangulation respectively. A linear convergence rate is obtained.

The purpose of this paper is to address the gap between definition and practical aspects of production efficiency in mass customization (MC). The paper summarizes all major issues impacting efficiency in MC. Also, the paper reviews metrics, relationship between various parameters and provides a best practices benchmark toolkit to achieve higher machine efficiencies.

The paper identified and categorized multiple challenges impacting machine efficiency in MC through a literature review spanning over three decades, and also ranked the identified issue-based parameters. Top issues were found varying across different types of industries identified through the review. Metrics pertaining to efficiency and degree of MC are reviewed in the paper. A chronological review of issues is presented, and a chain diagram is built in the paper. Toolkit of best practices created with solution strategies and tools are summarized through the review.

The paper found that MC reasonably impacts machine efficiency which needs to be addressed. Major issues through literature review-based ranking are uncovered, and worldwide research trend and comparison are presented. Active research in this area is observed to be at its peak since 2010. The extensive use of strategies and benchmark toolkit for improving efficiency are summarized.

Ranking of issues has been done through a literature review; hence, there can be skewness depending on the frequency of issues researched by various authors in various areas of industries.

This paper is useful for manufacturing managers and companies willing to increase the size of their product portfolio and choices within their available resources without compromising machine efficiencies and, thereby, the cost. The identified issues help in providing a comprehensive issue list to the academia.

This paper describes what is believed to be the first study that explicitly examines the issues faced in achieving machine efficiency while manufacturing in an MC environment.

We present a qualitative analysis of the fundamental static semiconductor device equations which is based on singular perturbation theory. By appropriate scaling the semiconductor device equations are reformulated as singularly perturbed elliptic system (the Laplacian in Poisson's equation is multiplied by a small parameter ?2, the so‐called singular perturbation parameter). Physically the singular perturbation parameter is identified with the square of the normed minimal Debye length of the device under consideration. Using matched asymptotic expansions for small A we characterize the behaviour of the solutions locally at pn junctions, Schottky contacts and oxide‐semiconductor interfaces and demonstrate the occurrence of exponential internal/boundary layers at these surfaces. The derivatives of the solutions blow up within these layer regions (as ?2 decreases) and they remain bounded away from the layers. We demonstrate that the solutions of the ‘zero‐space charge approximation’ are close to the solutions of the ‘full’ semiconductor problem (when ? is small) away from layer regions and derive a second‐order ordinary differential equation which (when subjected to appropriate boundary/interface conditions) ‘describes’ the solutions within layer regions.

Taiwan's semiconductor industry continues moving out to China, therefore Taiwan's semiconductor distributors must cooperate with the local distributors in China in order to survive. The purpose of this paper is to discover the key factors considered by Taiwan's semiconductor distributors when selecting partners in China.

This study summarizes the factors from the literatures and the experts' discussion, then develops a hierarchical structure. Using DEMATEL and MMDE to construct the causality of the dimensions, which are then taken as the basis for the development of the analytic network process (ANP) framework. Finally, it gets the weight values of various factors through the results of ANP, which serves as a proposal to discuss how Taiwan's professional semiconductor distributors select partners in China.

According to the weight of the ANP, results show that trust and commitment, scale, market share and corporate culture are factors that increase the possibility of collaboration.

China has become a favorite for foreign investments. Taiwan's semiconductor distributors must actively expand the China market in order to maintain their survival. This study focuses on Taiwan semiconductor distributors who want to invest and establish factories in China, and investigates the key factors that are involved in the selection of partners for Taiwan semiconductor distributors. The results can increase the chances of success among cooperative members.