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The purpose of this paper is to develop the models of the dielectric permittivity dispersion of heterogeneous systems based on semiconductors to a level that would allow to apply effectively the method of broadband dielectric spectroscopy for the study of electronic processes in ceramic and composite materials.

The new approach for determining the complex dielectric permittivity of heterogeneous systems with semiconductor particles is used. It includes finding the analytical expression of the effective dielectric permittivity of the separate semiconductor particle of spherical shape. This approach takes into account the polarization of the free charge carriers in this particle, including capturing to localized electron states. This enabled the authors to use the known equations for complex dielectric permittivity of two-component matrix systems and statistical mixtures.

The presented dispersion equations establish the relationship between the parameters of the dielectric spectrum and electronic processes in the structures like semiconductor particles in a dielectric matrix in a wide frequency range. Conditions of manifestation and location of the different dispersion regions of the complex dielectric heterogeneous systems based on semiconductors in the frequency axis and their features are established. The most high-frequency dispersion region corresponds to the separation of free charge carriers at polarization. After this region in the direction of reducing of the frequency, the dispersion regions caused by recharge bulk and/or surface localized states follow. The most low-frequency dispersion region is caused by recharging electron traps in the boundary layer of the dielectric matrix.

Dielectric dispersion models are developed that are associated with: electronic processes of separation of free charge carriers in the semiconductor component, recapture of free charge carriers in the localized electronic states in bulk and on the surface of the semiconductor and also boundary layers of the dielectric at the polarization. The authors have analyzed to situations that correspond applicable and promising materials: varistor ceramics and composite structure with conductive and semiconductor fillers. The modelling results correspond to the existing level of understanding of the electron phenomena in matrix systems and statistical mixtures based on semiconductors. It allows to raise efficiency of research and control properties of heterogeneous materials by dielectric spectroscopy.

The semiconductor industry has attracted considerable attention during the last twenty years as a major high stakes business battlefield between American corporations and Japanese society. Recently, other Asian countries have made inroads into this industry. Consistent with Michael Porter's thesis on the importance of national industry related clusters (Porter, J 990), this paper predicts that between now and the year 2000, the entrepreneurial characteristics of American companies will lead them to significant market share increases and that Japanese businesses will lose market share to other Asian companies, particularly in South Korea. Beyond the year 2000, the industry may evolve to the point where geographic areas concentrate on specific dimensions of the industry with the United States strong in innovation and Asia emphasizing manufacturing efficiencies. It is also possible that later in the 21st century, continued economic growth in Asia could lead to Asian companies taking expanded leadership roles in the industry. This paper acknowledges the importance of government intervention both in the United States and Japan in the early stages of the industry, but argues that the evolving maturity of the semiconductor industry is reducing the need for government subsidies, even though trade issues, especially with China, continue to be important.

This study aims to discuss the development of the semiconductor industry in China and analyzes it through current studies about the catch up of latecomers in newly industrialized countries (NICs).

Use the case study approach to explore and discuss the development track of the Chinese semiconductor industry and the catch up experience of Huang Hong NEC in China.

The experience of NICs can explain the catch up of semiconductor latecomers in China. However, the role of government has changed along with the whole development of the China semiconductor industry; external pressure may influence the pace of development and the span of control of the China Government for future catch ups.

The study focuses on one single case, which may not reflect the individual differences appeared in different firms in China.

This study contributes to our knowledge about the catch up of latecomer firms in an emerging market and verifies classical arguments about the experience of NICs through the experience of China's semiconductor industry.

The paper presents one of the first attempts to identify and categorise the fundamental barriers currently preventing the multibillion semiconductor equipment manufacturing industry from implementing existing B2B e-trading models for its secondary market. It furthermore proposes a global e-business strategy supporting aftermarket integration with the industry's supply chain.

Because of the global nature of the industry, the research employs a multiple case-study design to explore the state-of-the-art in semiconductor excess management. The data for this analysis are obtained through a number of in-depth interviews with experts from a cross-section of the industry, and further supplemented and validated with a systematic literature review and public corporate data.

The results indicate that significant market imperfections still exist in the industry due to information and knowledge deficits, organisational inefficiency and IP-related concerns. The considerable levels of third-party competition to the original equipment manufacturers raise questions about the existence and efficacy of reverse logistics processes and Closed-Loop Supply Chain (CLSC) management strategies in this industry. It has been shown that a leaner semiconductor supply chain is achievable through the implementation of the proposed B2B e-marketplace, maintaining the information exchange on the surplus/obsolete equipment and parts.

These outcomes are unique for supporting the design of the first global e-marketplace for the secondary semiconductor equipment and spares. The results can, furthermore, inform the standardisation of the semiconductor aftermarket transactions, streamline knowledge exchange mechanisms amongst different industry players and improve pricing strategies. These contribute to knowledge of principles allowing the aftermarket e-trading to become a key part of the value network in high-tech manufacturing industries.

Foundry, Design House, and integrated device manufacturers (IDM) are major characters in the semiconductor industry value chain. The purpose of this paper is to discuss patterns of characters' evolution in technology through patents classified as wafer‐design application patents and wafer‐process patents.

Various patent indicators, such as average patent citation count, and the combination of the average patent citation count and relative patent count share were used to measure the patent activity, patent quality, and the combination of the patent quality and relative patent activity share, respectively. The study period (1979‐2009) was divided into three major technology or wafer size eras, 1979‐1991 for the 6‐ and pre 6‐inch wafer era, 1989‐1999 for the 8‐inch wafer era, and 1997‐2009 for the 12‐inch wafer era.

Foundry has gradually become the technology transferor rather than purely the manufacturing capacity provider. Foundry's impact on the technology level has risen steeply on both the wafer‐process technology fields and the wafer‐design application technology fields. As a result, IDM, traditionally considered the primary technology contributor in the semiconductor value chain for the past 30 years, will continue to be challenged in the semiconductor industry.

Some hypotheses are clarified to provide managerial implications for the semiconductor industry. Owing to Foundry's rise in technology activity and quality, IDM/Design House should not merely view it as one of their capacity providers but should also pursue a technology alliance with it.

The paper clarifies the traditional hypotheses of the characters of technology in the semiconductor value chain.

In an emerging global competitive environment, the Malaysian semiconductor industry is facing threats from low cost countries with limited innovative capabilities. It urges for improvement in competitiveness of the Malaysian semiconductor industry. This study focuses on the perspectives of the managers towards the enhancement of competitiveness. Through a focus group interview and data collected from 200 managers working in semiconductor‐manufacturing units in Malaysia, the study identified twenty‐two competitive factors for the improvement of competitiveness of the semiconductor industry in Malaysia. Since the collected data did not form a normal distribution, nonparametric tests such as Chi‐squire test and Mann‐Whitney U test were used to test the framed hypotheses. Based on the analysis, ten key competitive factors were identified out of the identified twenty‐two competitive factors through focus group interview. Further, the study also highlighted the differences in the opinion of competitive factors of technical and non‐technical job functioning managers.

A real-time production scheduling method for semiconductor back-end manufacturing process becomes increasingly important in industry 4.0. Semiconductor back-end manufacturing process is always accompanied by order splitting and merging; besides, in each stage of the process, there are always multiple machine groups that have different production capabilities and capacities. This paper studies a multi-agent based scheduling architecture for the radio frequency identification (RFID)-enabled semiconductor back-end shopfloor, which integrates not only manufacturing resources but also human factors.

The architecture includes a task management (TM) agent, a staff instruction (SI) agent, a task scheduling (TS) agent, an information management center (IMC), machine group (MG) agent and a production monitoring (PM) agent. Then, based on the architecture, the authors developed a scheduling method consisting of capability & capacity planning and machine configuration modules in the TS agent.

The authors used greedy policy to assign each order to the appropriate machine groups based on the real-time utilization ration of each MG in the capability & capacity (C&C) planning module, and used a partial swarm optimization (PSO) algorithm to schedule each splitting job to the identified machine based on the C&C planning results. At last, we conducted a case study to demonstrate the proposed multi-agent based real-time production scheduling models and methods.

This paper proposes a multi-agent based real-time scheduling framework for semiconductor back-end industry. A C&C planning and a machine configuration algorithm are developed, respectively. The paper provides a feasible solution for semiconductor back-end manufacturing process to realize real-time scheduling.

Whatever one may feel is the importance of particular interconnection and assembly technologies with which one is associated, Thin Film or Thick Film Hybrid, PCB Through Hole, Surface Mounting, etc., the driving force in electronics is the high degree of low cost functionality brought by semiconductor technology. However, semiconductor science cannot provide systems solutions on its own and needs to be combined with suitable interconnection and assembly technologies to bring its potential processing power to fulfilment. Hybrid technology holds a key role in the use of silicon in overall system integration. On hybrid substrates semiconductors can be applied in any of the forms available, from bare dice to encapsulated, tested and burnt‐in complex functions in LSI. Over the years hybrids have developed, needing semiconductors as the active elements in providing functional modules. The relationship between the technologies has been close but not always in perfect harmony at the commercial interfaces. The first part of this paper reviews development of semiconductors in relation to the forms of packaging available for application in hybrid assembly including the emergent means being adopted to tackle the problems of ever increasing lead counts that will be with us for some time until the dream of total self‐sufficiency on silicon becomes a reality. The second part of the paper reviews silicon design options with the emphasis on the relevance of combining silicon implementation with hybrid methods.

This study aims to understand how Brazilian design houses (DHs) use open innovation in joint development projects for integrated circuits.

As a research strategy, qualitative research using multiple case studies was made. As sources of evidence, semi-structured interviews were conducted with three DHs of Programa integrated circuit [circuito integrado(CI)]-Brasil and with four specialists in the field, as well as analysis of documents. The data were analyzed through content analysis.

The results showed the DHs use sources of external knowledge in their innovation process, to assist the development of new products, to access new knowledge and skills, to attract financial resources and to be competitive in the market of high technology.

The study has important implications on the semiconductor industry in Brazil, as the industry is considered strategic for the competitiveness of final goods sector. The importance of encouraging the development of partnerships in the sector, the possibility of using informal agreements to mediate the collaboration between DHs and external agents, and the improvement and long-term continuity of public policies to support the industry are among the implications. In addition to suggestions for new business approaches to assist the strengthening of this segment.

Scott McGregor is President and CEO of Philips Semiconductors, one of the five divisions of Royal Philips Electronics. Philips Semiconductors, based in Eindhoven, The Netherlands, has over 34,000 employees in more than 50 countries. With sales of around €4.6 billion in 2002, Philips Semiconductors is one of the world’s top ten semiconductor suppliers. The division is focused on becoming the leading provider of semiconductor‐based solutions for connected consumer applications. Additionally, it is a volume manufacturer of semiconductors for multi‐market products. In this interview, Mr. McGregor discusses the need for leaders to practice transparent communication, develop their flexibility and take an informed approach to outsourcing.