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Fine diamond powders, in some cases composed of particles smaller than one micron, are assuming ever increasing importance, especially as the cost of conventional abrasives rises…
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Fine diamond powders, in some cases composed of particles smaller than one micron, are assuming ever increasing importance, especially as the cost of conventional abrasives rises disproportionately. This article looks at the advancing technology behind natural and synthetic micron diamond powders and their significance in the automated industry of today
The stud bump bonding (SBB) process was evaluated for a flip chip in package application. An SBB packaging process, having a reduced number of process steps compared with the…
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The stud bump bonding (SBB) process was evaluated for a flip chip in package application. An SBB packaging process, having a reduced number of process steps compared with the typical SBB process, was proposed. The two separate steps of curing of conductive adhesive and underfill epoxy, which for the application targeted in this study needed a total of four hours for curing plus further time for cooling, were not required. This proposed process therefore resulted in a reduced packaging time. Several issues affecting the assembly are also discussed in this paper.
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