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This paper aims to analyze the negative impact of surface mount (SMT) pad and imperfect via structure such as stub, pad, non-functional pad (NFP) and anti-pad on the signal integrity at 40 Gbps transmission on printed circuit board (PCB) due to impedance mismatch or discontinuity. The optimized modeling of via and SMT structures is performed to achieve minimal impedance mismatch and insertion loss less than 10 dB for six-inch full path transmission line between transmitter and receiver on PCB at Nyquist frequency 20 GHz.

This work is split into two phases. The first phase involves optimization of via and SMT structures in three-dimensional electromagnetic (3DEM) simulation using Hyperlynx Via Wizard and Keysight EMPro software, respectively, followed by analysis of time domain reflectometry (TDR) and insertion loss (Sdd21). Whereas, in the second phase, full path hybrid mode simulation involving vias for signal layer transition, a 6-inch PCB channel and SMT pads is performed using Keysight ADS software to observe the TDR, Sdd21 and eye diagram at 40 Gbps transmission.

Imperfect via and SMT structures have a negative effect on signal reflection and attenuation. The optimized via and SMT minimizes the impedance mismatch by 81 per cent and insertion loss by 4.5 dB, ultimately enlarging the eye diagram opening to achieve minimal data loss at receiver with 40 Gbps transmission.

The results of original empirical research work on signal integrity analysis that optimizes the PCB channel design to achieve 40 Gbps signal transmission are presented in this study. It serves as a reference guide for high-speed PCB layout design.

The paper aims to examine some of the requirements for an industrial strength loss measurement technique in FR4 laminate printed circuit boards and, in particular, to take a closer look at one new candidate method.

The paper highlights some of the issues in transferring an essentially laboratory‐based measurement technique to high volume manufacturing, i.e. the shop floor. The paper uses the newly proposed SET2DIL method of characterizing loss, comparing results with established laboratory methods and discusses the practical issues, such as the design of new test probes and coupons, in its implementation.

The paper shows that current time‐consuming laboratory methods of loss measurement using vector network analysers (VNAs), with their associated high skill requirements, though accurate and reproducible, are not viable for the factory floor, with its challenging environment and, occasionally, lack of specialized expertise. The SET2DIL method of loss measurement appears to offer a robust and reliable method of measuring and predicting loss in FR4 and should achieve wide approval across the board manufacturing industry.

The results of extensive testing are compared favourably with the results of established reference methods using VNAs, showing good correlation, and the SET2DIL method is recommended as being suitable for use in a high volume production environment.

This paper aims to analyze the impact of non-perfect reference plane on the integrity of microstrip differential signals at multi-gigabit transmission on a printed circuit board (PCB). The effects of non-perfect reference contributed by signal crossing over split plane such as impedance discontinuity and crosstalk are investigated by performing analysis in two phases.

The first phase involves three-dimensional electromagnetic modeling extraction using Keysight EMPro software. Meanwhile, the second phase involves the import of model extracted from EMPro into simulation using Keysight Advanced Design System that covers insertion loss, return loss, crosstalk, time domain reflectometry and eye diagram.

A non-perfect reference plane has a negative impact on signal reflection, attenuation and crosstalk. The analysis results are presented and discussed in detail in the later section of this paper.

The work that studied the impact of the width and the amount of gaps due to crossing of split planes being experienced on the signal integrity was performed by other researchers. Meanwhile, this paper focused on the impact of length and depth of the gap on signal integrity. These research papers serve as a reference guide for high-speed PCB layout design.