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The purpose of this paper is to present a review of research performed at the Communications Research Centre Canada on sensing applications of femtosecond infrared laser‐inscribed Bragg gratings.

By using fibre Bragg gratings induced with ultrafast infrared radiation, inscription of high temperature stable sensors in standard and exotic optical waveguides is investigated for a variety of novel applications.

Generally, femtosecond laser‐induced gratings are effective sensors that can be applied in situations and environments where most fibre optic sensors are not effective.

The paper is a review of existing work already published in the literature and provides an overview of this technology to the reader.

This paper aims to review recent advances and applications of abrasive processes for microelectronics fabrications.

More than 80 patents and journal and conference articles published recently are reviewed. The topics covered are chemical mechanical polishing (CMP) for semiconductor devices, key/additional process conditions for CMP, and polishing and grinding for microelectronics fabrications and fan-out wafer level packages (FOWLPs).

Many reviewed articles reported advanced CMP for semiconductor device fabrications and innovative research studies on CMP slurry and abrasives. The surface finish, sub-surface damage and the strength of wafers are important issues. The defects on wafer surfaces induced by grinding/polishing would affect the stability of diced ultra-thin chips. Fracture strengths of wafers are dependent on the damage structure induced during dicing or grinding. Different thinning processes can reduce or enhance the fracture strength of wafers. In the FOWLP technology, grinding or CMP is conducted at several key steps. Challenges come from back-grinding and the wafer warpage. As the Si chips of the over-molded FOWLPs are very thin, wafer grinding becomes critical. The strength of the FOWLPs is significantly affected by grinding.

This paper attempts to provide an introduction to recent developments and the trends in abrasive processes for microelectronics manufacturing. With the references provided, readers may explore more deeply by reading the original articles. Original suggestions for future research work are also provided.

The purpose of this paper is to present a novel method to investigate the microscopic mechanism of the oil film under the pure squeeze elastohydrodynamic lubrication (EHL) motion. An optical EHL squeeze tester is used to explore the effects of squeeze velocity, load, temperature, and lubricant viscosity on the dimple film thickness that occurs when a ball approaches a flat plate covered by a thin layer of oil.

The grayscale interferometric technique was used to study the thickness of the lubricating film in an EHL point contact. The light source was a He‐Ne laser. Through the transparent optical glass and by means of optical interference, the interference fringe patterns of the contact region were observed by a charge‐coupled device camera recording. The two elastic bodies were a sapphire disk and a steel ball. The contact was lubricated with paraffin‐based oil.

Results show that increasing the squeeze speed, load, viscosity, and decreasing the temperature, make the dimple deeper, and the contact area increases. Moreover, as the squeeze speed and load decrease and temperature increases, the fluidity of the lubricant increases and less time is needed to extrude. The maximum thickness of the dimple increases with increasing squeeze speed, load, lubricant viscosity, and decreasing temperature. The greatest effect of pure squeeze EHL motion is found with squeeze velocity, followed by load, and then temperature for the same lubricant viscosity.

The paper usefully describes the use of a self‐development optical EHL squeeze tester to explore the effects of temperature, squeeze velocity, load, and lubricant viscosity on the dimple film thickness which occurs between two components approaching each other.

‘Britain will have in the future, as in the past, the finest public library service in the world.’ That was the prediction of Richard Luce, Minister for the Arts, speaking at the CLSI Annual Lecture on Library Automation. The Minister was speaking at the invitation of Patrick Regester, Managing Director of CLSI, who invited Mr. Luce to outline his proposals for the future financing of public libraries in England as published in the Government's Green Paper, Financing our Public Libraries.

Thermal management under high heat flux is crucial to developing high‐power light‐emitting diode (LED) applications. The purpose of this paper is to propose an efficient thermal dissipation technique for an LED back light unit (BLU) system.

A typical BLU system includes an LED package (GaN on sapphire, cathode/anode, silicone encapsulant, resin plus phosphor) on a printed circuit board (PCB), a light guide panel, and an aluminum cover frame. The temperature distribution of this system has been simulated and the thermal behavior within a 3D model has been investigated using a commercial computational fluid dynamic code (FLUENT 6.3).

The authors examined the heat‐spreading effect of cover lengths ranging from 6 to 300 mm and also observed the effect of back cover thickness on the junction temperature and cover frame temperature and investigated the influence of the air gap between the package and the cover frame. Removing the air gap lowers the maximum temperature by about 6 percent. It was found that the addition of a copper layer covering the external surfaces of the LED chip enhanced the cooling efficiency. Finally, the maximum junction temperature can be decreased by more than 21 percent in the range of parameters considered by removing the air gap, adding a heat spreader, and using a thick cover frame.

In this paper, thermal management for efficient heat spreading through a typical BLU system without using any additional devices is investigated. Several parameters that increase the system's temperature are examined, and a combination of design features that attenuate the junction temperature is proposed.

The purpose of this study is for solving many issues in production that includes processing of complex-shaped profile, machining of high-strength materials, good surface finish with high-level precision and minimization of waste. Among the various advanced machining processes, abrasive jet machining (AJM) is one of the non-traditional machining techniques used for various applications such as polishing, deburring and hole making. Hence, an overview of the investigations done on carbon fiber-reinforced polymer (CFRP) and glass fiber-reinforced polymer (GRFP) composites becomes important.

Discussion on various approaches to AJM, the effect of process parameters on the glass fiber and carbon fiber polymeric composites are presented. Kerf characteristics, surface roughness and various nozzle design were also discussed.

It was observed that abrasive jet pressure, stand-off distance, traverse rate, abrasive size, nozzle diameter, angle of attack are the significant process parameters which affect the machining time, material removal rate, top kerf, bottom kerf and kerf angle. When the particle size is maximum, the increased kinetic energy of the particle improves the penetration depth on the CFRP surface. As the abrasive jet pressure is increased, the cutting process is enabled without severe jet deflection which in turn minimizes the waviness pattern, resulting in a decrease of the surface roughness.

The review is limited to glass fiber and carbon fiber polymeric composites.

In many applications, the use of composite has gained wide acceptance. Hence, machining of the composite need for the study also has gained wide acceptance.

The usage of composites reduces the usage of very costly materials of high density. The cost of the material also comes down.

This paper is a comprehensive review of machining composite with abrasive jet. The paper covers in detail about machining of only GFRP and CFRP composites with various nozzle designs, unlike many studies which has focused widely on general AJM of various materials.

The purpose of this paper is to investigate the effect of growth temperature on the evolution of indium incorporation and the growth process of InGaN/GaN heterostructures.

To examine this effect, the InGaN/GaN heterostructures were grown using Taiyo Nippon Sanso Corporation metal-organic chemical vapor deposition (MOCVD) SR4000-HT system. The InGaN/GaN heterostructures were epitaxially grown on 3.4 µm undoped-GaN (ud-GaN) and GaN nucleation layer, respectively, over a commercial 2” c-plane flat sapphire substrate. The InGaN layers were grown at different temperature settings ranging from 860°C to 820°C in a step of 20°C. The details of structural, surface morphology and optical properties were investigated using X-ray diffraction (XRD), field emission scanning electron microscope (FE-SEM), atomic force microscopy and ultraviolet-visible (UV-Vis) spectrophotometer, respectively.

InGaN/GaN heterostructure with indium composition up to 10.9% has been successfully grown using the MOCVD technique without any phase separation detected within the sensitivity of the instrument. Indium compositions were estimated through simulation fitting of the XRD curve and calculation of Vegard’s law from UV-Vis measurement. The thickness of the structures was determined using the Swanepoel method and the FE-SEM cross-section image.

This paper report on the effect of MOCVD growth temperature on the growth process of InGaN/GaN heterostructure, which is of interest in solid-state lighting technology, especially in light-emitting diodes and solar cell application.

This paper aims to explore whether brand corporate social responsibility (CSR) initiatives increase consumers’ happiness via a mediating mechanism of emotional brand attachment and to examine how brand CSR’s effect may be moderated by CSR fit (e.g. CSR-brand fit vs misfit) and sense of relatedness (e.g. low vs high).

A series of six studies (including the one that is available online), combining field and experimental data, were conducted to test the hypothesized relationships.

Results support the hypothesis that brand CSR initiatives make consumers happy by increasing their attachment to the brand (Studies 1 and 2). This effect is strengthened both directly and indirectly through emotional attachment when brands engage in CSR fit activities (Study 3), but it is weakened when brands engage in CSR misfit activities (Study 4). Furthermore, the effect is more pronounced when brands choose CSR activities that have a high sense of relatedness, and it is eliminated when brands use CSR activities with a low sense of relatedness (Study 5). Finally, the results indicate that when brand CSR programs make consumers happy, they become more likely to purchase, spread positive word of mouth and pay a premium (Study 6).

This research has several major implications for business-to-consumer companies that are unsure about the value of brand CSR initiatives, want to make consumers happy but are unsure which CSR strategies to focus on and/or have decided to launch CSR initiatives but lack guidance on the specific strategies relevant to their desired performance outcomes.

The purpose of this study is to prolong the service life of the Al–Si alloy cylinder and achieve the objective of energy saving and emission reduction by the composite treatments.

Chemical etching + laser texturing + filled MoS₂ composite treatment was applied to the friction surface of aluminum–silicon (Al–Si) alloy cylinder. The friction coefficient and wear loss were measured to characterize the tribology property of cylinders.

The composite-treated Al–Si alloy cylinder had the lowest friction coefficient and weight loss. The friction coefficient and weight loss of the composite treatment were approximately 27.08% and 54.17% lower than those of the untreated sample, respectively. The laser micro-textures control the release of solid lubricant to the interface of friction pairs slowly, which prolongs the service life of cylinders.

The synergistic effect of the chemical etching + laser texturing + filled MoS2 modified the tribology properties of Al–Si alloy cylinder. The chemical etching raised the silicon particles to bear the load, and laser micro-textures control the release of solid lubricant to improve the lubrication property.

The purpose of this paper is to enhance the efficiency of the LED by introducing three-step magnesium (Mg) doping profile. Attention was paid to the effects of the Mg doping concentration of the first p-GaN layer (i.e. layer close to the active region). Attention was paid to the effects of the Mg doping concentration of the first p-GaN layer (i.e. layer close to the active region).

Indium gallium nitride (InGaN)–based light-emitting diode (LED) was grown on a 4-inch c-plane patterned sapphire substrate using metal organic chemical vapor deposition. The Cp₂Mg flow rates for the second and third p-GaN layers were set at 50 sccm and 325 sccm, respectively. For the first p-GaN layer, the Cp₂Mg flow rate varied from 150 sccm to 300 sccm to achieve different Mg dopant concentrations.

The full width at half maximum (FWHM) for the GaN (102) plane increases with increasing Cp₂Mg flow rate. FWHM for the sample with 150, 250 and 300 sccm Cp₂Mg flow rates was 233 arcsec, 236 arcsec and 245 arcsec, respectively. This result indicates that the edge and mixed dislocations in the p-GaN layer were increased with increasing Cp₂Mg flow rate. Atomic force microscopy (AFM) results reveal that the sample grown with 300 sccm exhibits the highest surface roughness, followed by 150 sccm and 250 sccm. The surface roughness of these samples is 2.40 nm, 2.12 nm and 2.08 nm, respectively. Simultaneously, the photoluminescence (PL) spectrum of the 250 sccm sample shows the highest band edge intensity over the yellow band ratio compared to that of other samples. The light output power measurements found that the sample with 250 sccm exhibits high output power because of sufficient hole injection toward the active region.

Through this study, the three steps of the Mg profile on the p-GaN layer were proposed to show high-efficiency InGaN-based LED. The optimal Mg concentration was studied on the first p-GaN layer (i.e. layer close to active region) to improve the LED performance by varying the Cp₂Mg flow rate. This finding was in line with the result of PL and AFM results when the samples with 250 sccm have the highest Mg acceptor and good surface quality of the p-GaN layer. It can be deduced that the first p-GaN layer doping has a significant effect on the crystalline quality, surface roughness and light emission properties of the LED epi structure.