Search results

David Tuffield, former UK marketing manager for Augat/Isotronics, has been appointed European marketing manager to head the company's plans to increase penetration into this expanding hybrid micropackaging industry. He will be responsible for the complete marketing and sales effort for micropackaging products providing the interface between US manufacturing facilities and Augat subsidiary product managers.

Dynapert Ltd of Colchester have announced the introduction of a new ‘starter’ package for their production proven MPS318.

To examine the different types of equipment available for optical inspection of assembled electronic circuit boards.

Compares bench magnifiers and microscopes, “eyepieceless” scopes and video microscopes. Presents the Mantis range from Vision Engineering Ltd, and the video inspection products from Close Ups. Compares the cost and performance of various systems.

“Eyepieceless” and video microscopes allow the operator more head movement and are less tiring than traditional microscopes. Very clear and detailed images are required for solder joint inspection, and the customer should look for equipment with an established track record in this field.

Points out the pitfalls of equipment selection for electronic circuit assemblers.

Pace Inc.'s MBT 250 is a microprocessor controlled assembly and repair system for surface mount and through‐hole applications which can proportionally power up to three handpieces simultaneously with total power of 120 watts. An easy‐to‐use key array allows quick entry of idle tip temperature, tip temperature offset and temperature range for each channel into a non‐volatile memory. Set values and true operating temperatures for the channel are displayed on an LED readout, and any recalibration is quickly and easily performed.

With the increased functional density requirements of military avionics it is impossible to meet these demands without utilising Surface Mount Technology. The Electronics Manufacturing Technology Group at Boeing Military Airplanes is working to meet SMT design requirements through research and development of processes, materials and equipment for all variations of SMT. Basic processes have been established for both 100% SMT and mixed technology. However, the Group continues to advance its capabilities by evaluating and improving all aspects of SMT manufacturing. A description of the initial thrust into Type III SMT as well as subsequent development is given. This includes a description of the evaluation of Surface Mount Component (SMC) attach adhesives comparing the adhesive used initially with others available by examining the various criteria involved in selecting the appropriate one for a given process. Also, a discussion follows of factors involved in determination of Mil‐spec. passive SMCs which are compatible with wave soldering. Included in the evaluation of passive SMCs is a comparison of the compatibility of the wave solder system in use with the component industry's recommended temperature profiles through an analysis based on in‐house testing to determine the actual component endurance to solder system heating. Throughout this discussion emphasis is placed on a systematic guided approach to examining process development.

Argos Electronics Ltd are pleased to announce the appointment of David E. Skertchly to the position of Quality Assurance Manager. This strengthens Argos technical and quality capability as Mr Skertchly has joined them from Marconi Space Systems where his work encompassed production and management aspects of hardware for the Exosat, Marecs, Meteosat and ERS 1 Satellite projects.

The UK is a leader in the implementation of surface mount technology, and SMARTEX '91 sponsored by the SMART Group is one of only a few shows organised worldwide which is dedicated solely to this field. Perhaps it was not surprising then that this year's three‐day event proved a great success.