Search results

1 – 3 of 3
Article
Publication date: 22 September 2022

Youxin Zhang, Yang Liu, Rongxing Cao, Xianghua Zeng and Yuxiong Xue

Concerning the radiation effects on the three-dimensional (3D) packaging in space environment, this study aims to investigate the influence of the total dose effect on the…

Abstract

Purpose

Concerning the radiation effects on the three-dimensional (3D) packaging in space environment, this study aims to investigate the influence of the total dose effect on the transmission characteristics of high-frequency electrical signals using experimental and simulation methods.

Design/methodology/approach

This work carries out the irradiation test of the specimens and measures their S21 parameters before and after irradiation. A simulation model describing the total dose effect was built based on the experimental test results. And, the radiation hardening design is evaluated by the simulation method.

Findings

The experimental results demonstrate that the S21 curve of the interconnection decreases with the increase of the irradiation dose, indicating that the total dose effect leads to the decline of its signal transmission characteristics. According to the simulation results, decreasing the height of the through silicon via (TSV), increasing the radius of the TSV, reducing the length of Si and increasing the number of grounded through silicon via have positive effects on improving the radiation resistance of the interconnection structure.

Originality/value

This work investigates the effect of radiation on the transmission characteristics of interconnection structures for 3D packaging and proposes the hardening design methods. It is meaningful for improving the reliability of 3D packaging in space applications.

Details

Microelectronics International, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 1356-5362

Keywords

Article
Publication date: 1 November 2021

Yang Liu, Yuxiong Xue, Min Zhou, Rongxing Cao, Xianghua Zeng, Hongxia Li, Shu Zheng and Shuang Zhang

The purpose of this paper is to investigate the effects of Sn-Ag-x leveling layers on the mechanical properties of SnBi solder joints. Four Sn-Ag-x (Sn-3.0Ag-0.5Cu…

Abstract

Purpose

The purpose of this paper is to investigate the effects of Sn-Ag-x leveling layers on the mechanical properties of SnBi solder joints. Four Sn-Ag-x (Sn-3.0Ag-0.5Cu, Sn-0.3Ag-0.7Cu, Sn-0.3Ag-0.7Cu-0.5 Bi-0.05Ni and Sn-3.0Ag-3.0 Bi-3.0In) leveling layers were coated on Cu pads to prepare SnBi/Sn-Ag-x/Cu solder joints. The microstructure, hardness, shear strength and fracture morphology of solder joints before and after aging were studied.

Design/methodology/approach

The interfacial brittleness of the SnBi low-temperature solder joint is a key problem affecting its reliability. The purpose of this study is to improve the mechanical properties of the SnBi solder joint.

Findings

Owing to the addition of the leveling layers, the grain size of the ß-Sn phase in the SnBi/Sn-Ag-x/Cu solder joint is significantly larger than that in the SnBi/Cu eutectic solder joint. Meanwhile, the hardness of the solder bulk in the SnBi/Cu solder joint shows a decrease trend because of the addition of the leveling layers. The SnBi/Cu solder joint shows obvious strength drop and interfacial brittle fracture after aging. Through the addition of the Sn-Ag-x layers, the brittle failure caused by aging is effectively suppressed. In addition, the Sn-Ag-x leveling layers improve the shear strength of the SnBi/Cu solder joint after aging. Among them, the SnBi/SACBN/Cu solder joint shows the highest shear strength.

Originality/value

This work suppresses the interfacial brittleness of the SnBi/Cu solder joint after isothermal aging by adding Sn-Ag-x leveling layers on the Cu pads. It provides a way to improve the mechanical performances of the SnBi solder joint.

Details

Soldering & Surface Mount Technology, vol. 34 no. 3
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 19 March 2021

Rongxing Duan, Shujuan Huang and Jiejun He

This paper aims to deal with the problems such as epistemic uncertainty, common cause failure (CCF) and dynamic fault behaviours that arise in complex systems and develop…

Abstract

Purpose

This paper aims to deal with the problems such as epistemic uncertainty, common cause failure (CCF) and dynamic fault behaviours that arise in complex systems and develop an effective fault diagnosis method to rapidly locate the fault when these systems fail.

Design/methodology/approach

First, a dynamic fault tree model is established to capture the dynamic failure behaviours and linguistic term sets are used to obtain the failure rate of components in complex systems to deal with the epistemic uncertainty. Second, a β factor model is used to construct a dynamic evidence network model to handle CCF and some parameters obtained by reliability analysis are used to build the fault diagnosis decision table. Finally, an improved Vlsekriterijumska Optimizacija I Kompromisno Resenje algorithm is developed to obtain the optimal diagnosis sequence, which can locate the fault quickly, reduce the maintenance cost and improve the diagnosis efficiency.

Findings

In this paper, a new optimal fault diagnosis strategy of complex systems considering CCF under epistemic uncertainty is presented based on reliability analysis. Dynamic evidence network is easy to carry out the quantitative analysis of dynamic fault tree. The proposed diagnosis algorithm can determine the optimal fault diagnosis sequence of complex systems and prove that CCF should not be ignored in fault diagnosis.

Originality/value

The proposed method combines the reliability theory with multiple attribute decision-making methods to improve the diagnosis efficiency.

Details

Engineering Computations, vol. 38 no. 9
Type: Research Article
ISSN: 0264-4401

Keywords

1 – 3 of 3