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The purpose of this paper is to gain a better understanding on how metasurfaces behave, in terms of currents in each unit cell. A better knowledge of their behavior could lead to an ad-hoc design for specific applications.

The methodology used is both theoretical and numerical; it is based on circuit theory and on an optimization procedure.

The results show that when the knowledge of the current in each unit cell of a metasurface is needed, the most common approximations currently used are often not accurate. Furthermore, a procedure for the termination of a metasurface, with application-driven goals, is given.

This paper investigates the distribution of the currents in a 2D metamaterial realized with magnetically coupled resonant coils. Different models for the analysis of these structures are illustrated, and the effects of the approximations they introduce on the current values are shown and discussed. Furthermore, proper terminations of the resonators on the boundaries have been investigated by implementing a numerical optimization procedure with the purpose of achieving a uniform distribution of the resonator currents. The results show that the behavior of a metasurface (in terms of currents in each single resonator) depends on different properties; as a consequence, their design is not a trivial task and is dependent on the specific applications they are designed for. A design strategy, with lumped impedance termination, is here proposed.

This paper aims to present the design development and measurement of two aerodynamic slotted X-bands back-to-back planer substrate-integrated rectangular waveguide (SIRWG/SIW) to Microstrip (MS) line transition for satellite and RADAR applications. It facilitates the realization of nonplanar (waveguide-based) circuits into planar form for easy integration with other planar (microstrip) devices, circuits and systems. This paper describes the design of a SIW to microstrip transition. The transition is broadband covering the frequency range of 8–12 GHz. The design and interconnection of microwave components like filters, power dividers, resonators, satellite dishes, sensors, transmitters and transponders are further aided by these transitions. A common planar interconnect is designed with better reflection coefficient/return loss (RL) (S₁₁/S₂₂ ≤ 10 dB), transmission coefficient/insertion loss (IL) (S₁₂/S₂₁: 0–3.0 dB) and ultra-wideband bandwidth on low profile FR-4 substrate for X-band and Ku-band functioning to interconnect modern era MIC/MMIC circuits, components and devices.

Two series of metal via (6 via/row) have been used so that all surface current and electric field vectors are confined within the metallic via-wall in SIW length. Introduced aerodynamic slots in tapered portions achieve excellent impedance matching and tapered junctions with SIW are mitered for fine tuning to achieve minimum reflections and improved transmissions at X-band center frequency.

Using this method, the measured IL and RLs are found in concord with simulated results in full X-band (8.22–12.4 GHz). RLC T-equivalent and p-equivalent electrical circuits of the proposed design are presented at the end.

The measurement of the prototype has been carried out by an available low-cost X-band microwave bench and with a Keysight E4416A power meter in the microwave laboratory.

The transition is fabricated on FR-4 substrate with compact size 14 mm × 21.35 mm × 1.6 mm and hence economical with IL lie within limits 0.6–1 dB and RL is lower than −10 dB in bandwidth 7.05–17.10 GHz. Because of such outstanding fractional bandwidth (FBW: 100.5%), the transition could also be useful for Ku-band with IL close to 1.6 dB.