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Organizations need to have undertaken an analysis of business risk and to have formulated a recovery plan. However, only a small number of businesses have made any attempt to minimize their risks and even fewer have a recovery plan which has been tested. Most are a token gesture to auditors. An out‐of‐date, untested plan can often be more dangerous than not having a plan at all as it lulls the organization into a false sense of security. But how do you test plans? If the strategy is to use a computer‐processing facility in another place – perhaps a commercial hot and cold site – the costs of regular testing can be high and the disruption to the business great. In tight economic times, senior management is too often prepared to gamble with the organization′s future. Develops a testing methodology, based on many years of designing plans and hands‐on testing, which reduces costs by breaking down the test procedure into components, modules and full tests.

The purpose of this paper is to study the shape memory properties of SMP samples produced through a MEAM process. Fused deposition modeling or, as it will be referred to in this paper, material extrusion additive manufacturing (MEAM) is a technique in which polymeric materials are extruded though a nozzle creating parts via accumulation and joining of different layers. These layers are fused together to build three-dimensional objects. Shape memory polymers (SMP) are stimulus responsive materials, which have the ability to recover their pre-programmed form after being exposed to a large strain. To induce its shape memory recovery movement, an external stimulus such as heat needs to be applied.

This project investigates and characterizes the influence of print orientation and infill percentage on shape recovery properties. The analyzed shape recovery properties are shape recovery force, shape recovery speed and time elapsed before activation. To determine whether the analyzed factors produce a significant variation on shape recovery properties, t-tests were performed with a 95% confidence factor between each analyzed level.

Results proved that print angle and infill percentage do have a significant impact on recovery properties of the manufactured specimens.

The manufacturing of SMP objects through a MEAM process has a vast potential for different applications; however, the shape recovery properties of these objects need to be analyzed before any practical use can be developed. These have not been studied as a function of print parameters, which is the focus of this study.

To authenticate the existence and principles of the adhesion recovery phenomenon under water pollution conditions, an innovative circumferential rail–wheel adhesion test rig was used. The study conducted extensive tests on the adhesion characteristics under large sliding conditions.

Experiments were conducted to investigate the influence of speed, axle load and slip on adhesion recovery. Based on the experimental results, the adhesion recovery transition function was re-fitted.

The study reveals that the adhesion recovery phenomenon truly exists under water conditions. The adhesion coefficient shows an increasing trend with the growth of the slip ratio. Moreover, at the current speed and axle load levels, the adhesion recovery is directly proportional to the square of the slip ratio and inversely proportional to the axle load.

The phenomenon of adhesion recovery and the formulated equations in this study can serve as an experimental and theoretical foundation for the design of braking and anti-skid control algorithms for trains.

The peer review history for this article is available at: https://publons.com/publon/10.1108/ILT-11-2023-0379/

The purpose of this paper is to develop a quality control tool based on rheological test methods for solder paste and flux media.

The rheological characterisation of solder pastes and flux media was carried out through the creep‐recovery, thixotropy and viscosity test methods. A rheometer with a parallel plate measuring geometry of 40 mm diameter and a gap height of 1 mm was used to characterise the paste and associated flux media.

The results from the study showed that the creep‐recovery test can be used to study the deformation and recovery of the pastes, which can be used to understand the slump behaviour in solder pastes. In addition, the results from the thixotropic and viscosity test were unsuccessful in determining the differences in the rheological flow behaviour in the solder pastes and the flux medium samples.

More extensive rheological and printing testing is needed in order to correlate the findings from this study with the printing performance of the pastes.

The rheological test method presented in the paper will provide important information for research and development, quality control and production staff to facilitate the manufacture of solder pastes and flux media.

The paper explains how the rheological test can be used as a quality control tool to identify the suitability of a developmental solder paste and flux media used for the printing process.

The purpose of this paper is to study the rheological behaviours of lead‐free solder pastes used for flip‐chip assembly applications and to correlate rheological behaviours with the printing performance.

A range of rheological characterization techniques including viscosity, yield stress, oscillatory and creep‐recovery tests were carried out to investigate the rheological properties and behaviours of four different solder paste formulations based on no‐clean flux composition, with different alloy composition, metal content and particle size. A series of printing tests were also conducted to correlate printing performance.

The results show that in the viscosity test, all solder pastes exhibited a shear thinning behaviour in nature with different highest maximum viscosity. The yield stress test has been used to study the effect of temperature on the flow behaviour of solder pastes. A decrease in yield stress value with temperature was observed. The results from the oscillatory test were used to study the solid‐ and liquid‐like behaviours of solder pastes. Creep‐recovery testing showed that the solder paste with smaller particle size exhibited less recovery.

More extensive research is needed to simulate the paste‐roll, aperture‐filling and aperture‐emptying stages of the stencil printing process using rheological test methods.

Implementation of these rheological characterization procedures in product development, process optimization and quality control can contribute significantly to reducing defects in the assembly of flip‐chip devices and subsequently increasing the production yield.

The paper shows how the viscosity, yield stress, oscillatory and creep‐recovery test methods can be successfully used to characterize the flow behaviour of solder pastes and also to predict their performance during the stencil printing process.

The paper's aim is to test the existence of the service recovery paradox.

To date, much of the literature exploring the service recovery paradox has generated mixed results. The paper argues that a service recovery paradox is a rare event, which makes its measurement difficult, since the “treatment group” sample size is usually too small to produce significant results. For that reason, the existence of the service recovery paradox in a banking context with more than 11,000 customer interviews based on actual customer encounters is tested.

Overall, the survey findings support the argument that a service recovery paradox is a rare event, and the hypothesized mean differences are, albeit significant, not very large, which diminishes their managerial relevance to some degree.

Because of the required extremely large sample size, no multi‐item measures were collected. Furthermore, privacy concerns restricted us from a longitudinal study and from linking the survey results to behavioural data. Both limitations are inherent in the chosen setting.

While a service failure offers an opportunity to create an excellent recovery, the likelihood of a service paradox is very low. The implications of verifying a service recovery paradox do not suggest that ineffective service followed by an outstanding service recovery is a viable strategy.

To the authors' knowledge, this is the first empirical study testing not only the existence of the service recovery paradox, but also exploring its magnitude and frequency. This is crucial because the paradox is a very rare event, which, in turn, limits its managerial relevance.

The purpose of this paper is to understand the recovery mechanism of poly(trimethylene terephthalate) (PTT) shape memory fabrics.

Tests were designed to study the effects of force, temperature and their combinations on the fabrics' crease recoveries. In the test a cantilever device and an ironing force which simulated people ironing their clothes were used, respectively.

Temperature was found to have little effect on the recovery of both the warp and filling of the fabrics. Crease recoveries did not improve significantly when the temperature was increased to above the polymer's glass transition. However, forces, applied in primarily compressive and tensile modes to simulate ironing and hand stroking actions, were found to be very effective in the fabrics' crease recoveries. Recoveries were 81‐87 per cent even when the applied force was very small, at 5 N/cm². When forces were applied at elevated temperatures, just below and above the polymer's glass transition, there were no significant improvements in crease recoveries. Therefore, force was the main factor in PTT shape memory fabrics' recovery mechanism for the fabrics to return to their initial shapes.

The results suggest that PTT shape memory fabric has excellent shape recoverability and easy care property and it has large application potentiality.

Although work-related antecedents of abusive supervision are well-known, knowledge on the cross-domain antecedents of this destructive leadership behavior is scarce. Accordingly, this study aims to investigate off-the-job supervisors’ after-work experiences that may influence their work behavior. The authors explore how and when a supervisor’s poor recovery experiences lead to abusive supervisory behaviors through a negative start-of-workday mood for high vs low supervisor sleep quality.

The authors conducted a single-source, three-phase field study (N = 422) to test the proposed moderated mediation model for participants from a large telecommunications company located in Anhui province, People’s Republic of China.

Poor recovery experiences in the supervisor’s personal life can spill over to their work domain and provoke abusive supervisory behavior through the mediating effect of a negative start-of-workday mood. Moreover, a supervisor’s good night’s sleep (i.e. first-stage moderator) serves as a key mitigating factor to diminish the negative start-of-workday mood resulting from a lack of relaxation, mastery experiences and control experiences (except for the lack of psychological detachment from work) and lessens abusive supervision.

This study contributes to the literature examining off-the-job events to understand the antecedents of abusive supervision that are beyond organizations’ control but significantly influence workplace behaviors, showing that not all antecedents of abusive supervision exist in the workplace; some are transferred from the home domain through nonvisible moods. Finally, the inclusion of sleep quality as a first-stage moderator provides insights on preventing abusive supervision caused by nonwork-related events. This adds a unique dimension to the abusive supervision literature by highlighting factors in the home domain that can prevent negative spillovers to the work domain. The authors conclude with some theoretical and practical implications for researchers and practitioners.

Employees may adopt deceptive knowledge hiding (DKH) due to nonworking time information and communication technology (ICT) demands. Drawing from the conservation of resources (COR) theory, this study aims to develop and test a model of deceptive knowledge hiding (DKH) due to nonworking time information and communication technology (ICT) demands.

In total, 300 service employees have joined the three-wave surveys. Path analysis and bootstrapping methods were used to test the theoretical model.

Results suggest that knowledge requests during nonworking time could deplete employees’ resources and increase their tendency to engage in DKH, whereas work recovery and emotional exhaustion mediate this relationship. In addition, employees’ work–family segmentation preferences (WFSP) were found to moderate the direct effects of nonworking time ICT demands on employees’ work recovery and emotional exhaustion and the indirect effects of knowledge requests after working hours on DKH through employees’ work recovery and emotional exhaustion.

First, the findings of this study shed light on the relationship between knowledge requests during employees’ nonworking time and knowledge hiding, suggesting that knowledge hiding could occur beyond working hours. Second, drawing on COR theory, this study explored two joint processes of resource replenishment failure and depletion and how nonworking time ICT demands trigger knowledge hiding. Third, the interaction effect of individuals’ WFSP and nonworking time factors on knowledge hiding deepens the understanding of when nonworking time ICT demands may induce knowledge hiding through various processes.

The purpose of this paper is to investigate surroundings for transfer film formation and removal, the effect of the transfer film formation on friction coefficients, the effect of four different abrasive components, ZrO₂, ZrSiO₄, Al₂O₃ and Fe₃O₄, on transfer film formation and the effect of lubricating component MoS₂ on transfer film formation and friction coefficients.

Two different MoS₂ contents of 5.5 and 8.5 per cent were added to friction materials with no MoS₂ content, which have four different abrasive components, ZrO₂, ZrSiO₄, Al₂O₃, Fe₃O₄. Friction tests composed of three different stages were conducted for those materials, and the friction surfaces of the counterpart disks were examined by scanning electron microscopy (SEM) to access the formation of transfer film at each stage.

For the transfer film formation, high temperature was a prerequisite, but the magnitude of deceleration rate was not important. The effect of the transfer film formation was to reduce the friction coefficients for most friction materials. Friction coefficients of materials which contain lubricating component MoS₂ were higher than those which contain no MoS₂ for most friction materials. The effect of the lubricating component MoS₂ was to suppress the formation of transfer film, thus resulting in increase in friction coefficients.

The transfer film was rather thin, with thickness of 1-2 µm for most friction materials. That hindered the examination of mechanical properties of the transfer film, such as hardness.

This research explained the surroundings for transfer film formation, and its effect on friction coefficients. The research suggests to suppress the formation of transfer film to make friction materials with high friction coefficient, and the lubricating component MoS₂ can be used for the purpose.

Development of high-friction-brake materials conventionally depends on the use of strong abrasive components, which may induce attacking of counterpart disks. The enhancement of friction coefficients with addition of MoS₂ content is expected to open a new prospect in development of high-performance friction materials, which can be applicable to brake pads for racing cars.

The study is in pursuit of the transfer film formation in successive friction stages, which revealed the conditions for transfer film generation and removal. Specimen preparation for SEM observation of cross section of friction surface was painstaking to not damage the developed friction surface. The study revealed the effect of different abrasive components on transfer film formation and the effect of lubrication contents of MoS₂ on transfer film formation and friction coefficients.