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Article
Publication date: 1 January 1986

R. Rocchelli and A. Simonetta

Assembly techniques for power semiconductor devices destined for automotive applications are examined. Attention has been paid to materials or their combinations showing an…

Abstract

Assembly techniques for power semiconductor devices destined for automotive applications are examined. Attention has been paid to materials or their combinations showing an acceptable compromise between good thermal conductivity and low cost. Extensive work has been carried out on type and/or thickness of same to minimise the strains dependent on different TCEs. Measurements and tests on thermal resistance have been performed. Rth measurements, together with thermal fatigue cycle and cycled life test, have confirmed themselves as a very suitable way to study and optimise the assembly technique for power devices.

Details

Microelectronics International, vol. 3 no. 1
Type: Research Article
ISSN: 1356-5362

Article
Publication date: 1 April 1985

Marc Monneraye, Panizza, Brian Waterfield, John Knowles and P.L. Bainbridge

A month or so after the Stresa meeting, the French ISHM chapter, organising a session on ‘Gallic inks’ (!), summoned me to deliver some comments on the 5th European Hybrid…

Abstract

A month or so after the Stresa meeting, the French ISHM chapter, organising a session on ‘Gallic inks’ (!), summoned me to deliver some comments on the 5th European Hybrid Microelectronics Conference. Although it was only a matter of interlude during this technical session, I felt the task quite a difficult one. It became a hazardous project when Brian C. Waterfield kindly asked me to let what is in fact a personal opinion—my personal opinion, standing back from my daily work—appear in Hybrid Circuits. I'll do my best.

Details

Microelectronics International, vol. 2 no. 4
Type: Research Article
ISSN: 1356-5362

Open Access
Article
Publication date: 14 March 2022

Elisabetta Marzano, Paolo Piselli and Roberta Rubinacci

The purpose of this paper is to provide a dating system for the Italian residential real estate market from 1927 to 2019 and investigate its interaction with credit and business…

Abstract

Purpose

The purpose of this paper is to provide a dating system for the Italian residential real estate market from 1927 to 2019 and investigate its interaction with credit and business cycles.

Design/methodology/approach

To detect the local turning point of the Italian residential real estate market, the authors apply the honeycomb cycle developed by Janssen et al. (1994) based on the joint analysis of house prices and the number of transactions. To this end, the authors use a unique historical reconstruction of house price levels by Baffigi and Piselli (2019) in addition to data on transactions.

Findings

This study confirms the validity of the honeycomb model for the last four decades of the Italian housing market. In addition, the results show that the severe downsizing of the housing market is largely associated with business and credit contraction, certainly contributing to exacerbating the severity of the recession. Finally, preliminary evidence suggests that whenever a price bubble occurs, it is coincident with the start of phase 2 of the honeycomb cycle.

Originality/value

To the best of the authors’ knowledge, this is the first time that the honeycomb approach has been tested over such a long historical period and compared to the cyclic features of financial and real aggregates. In addition, even if the honeycomb cycle is not a model for detecting booms and busts in the housing market, the preliminary evidence might suggest a role for volume/transactions in detecting housing market bubbles.

Details

Journal of European Real Estate Research, vol. 16 no. 1
Type: Research Article
ISSN: 1753-9269

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