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Trace Instruments have announced that Mr Tony Battaglia has been named central regional sales manager.

TDS Circuits plc, the Blackburn based high‐technology manufacturer of multilayer printed circuit boards, has made two new senior management appointments. John W. Whybrow has been appointed Managing Director, and David Dickson becomes the new Sales and Marketing Manager.

Appointments Leitron GmbH In strengthening its Sales Division, Leitron GmbH of Schwäbisch‐Gmünd has appointed Mr Heinz Schunk to be responsible for General Management of Sales and Marketing.

Circuit Technology, now in its fourth year, is still an event concentrating exclusively on PCB technology, production equipment and processes. Nevertheless, the organisers believe that Circuit Technology '86 will derive great benefit from participation in the UK's largest electronics gathering, The British Electronics Week.

In August 2007, the European Institute of Printed Circuits produced a Technology Roadmap for the industry for the period 2007‐2017. The purpose of this paper is to give details of the roadmap, the aim of which is to provide information which underpins the aims of the EU‐funded ProSurf project, which are to strengthen European small‐to‐medium enterprises (SME) competitiveness in both the medium‐ and long‐term through increasing knowledge and awareness of high‐tech methods in these industries.

The approach is an outline of the ProSurf project which will enable SMEs to have a clear view of the trends that will affect their businesses in the coming decade, and be delivered in a way that is readily comprehensible.

The summary highlights the present market, the market characteristics, and the position of the European PCB industry today. General factors which influence market trends are listed, within which the demands for miniaturisation and weight reduction, and higher data transmission rates are notable. There are specific requirements of each market sector, viz military, consumer, and automotive electronics, and here the roadmap looks at design rules and manufacturing capabilities. Towards the end of the roadmap attention is paid to the environmental considerations.

The ProSurf technology roadmap is a unique document without peer, and is specific to the European PCB industry whilst having considerable influence in other global areas as the technology demands within Europe impact upon production elsewhere.

PMD have appointed David H. Ormerod to the position of printed circuits products manager as part of their marketing organisation.

W. Canning Materials Ltd have announced the appointment of Mr W. E. I. Galloway as Managing Director with effect from 1st January, 1985. The Company is a leading manufacturer and supplier of industrial and speciality chemicals for the surface finishing industry.

OMI International (GB) have announced that Allan Murray, one of the leading UK technologists in the field of plating through hole systems for the printed circuit industry, has recently joined the Company.

Technical Director Appointed at Mommers Print Service. From January 1 1990, Mr A. F. J. G. van der Kruijs B.Eng. has been appointed Technical Director of Mommers Print Service BV in the Netherlands. From 1981 onwards Mr van der Kruijs has been Quality Manager at this Dutch high‐tech printed circuit board manufacturing plant.

This paper describes some recent innovations in design, process and materials in printed circuit laminate technology, which can lead to significant paradigm shifts in the design and application of electronic products. The traditional roles for printed circuit cards and boards have been to provide wiring interconnection capacity, and a robust mechanical structure for the more delicate and costly chips and modules. The advent of surface mount technology eliminated the need for plated‐through holes as anchors for pinned components. The proliferation of light, high performance, multifunction electronic products will lead to light weight, small, low profile printed circuit assemblies. Adding a redistribution layer to the traditional card surface allows flip‐chip‐on‐board and MCM‐L packages as a low‐cost alternative to traditional high density MCM packages, particularly in applications where size, shape and weight are as important as density and performance. Concurrent with the deliberate evolution of traditional printed circuit technology, some important new materials and process innovations have brought about a new generation of laminate capabilities that are particularly important for the future high I/O requirements predicted for the second part of this decade.