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This study aims to introduce a novel technique for nonlinear sensor time constant estimation and sensor dynamic compensation in hot-bar soldering using an extended Kalman filter (EKF) to estimate the temperature of the thermocouple.

Temperature optimal control is combined with a closed-loop proportional integral differential (PID) control method based on an EKF. Different control methods for measuring the temperature of the thermode in terms of temperature control, error and antidisturbance are studied. A soldering process in a semi-industrial environment is performed. The proposed control method was applied to the soldering of flexible printed circuits and circuit boards. An infrared camera was used to measure the top-surface temperature.

The proposed method can not only estimate the soldering temperature but also eliminate the noise of the system. The performance of this methodology was exemplary, characterized by rapid convergence and negligible error margins. Compared with the conventional control, the temperature variability of the proposed control is significantly attenuated.

An EKF was designed to estimate the temperature of the thermocouple during hot-bar soldering. Using the EKF and PID controller, the nonlinear properties of the system could be effectively overcome and the effects of disturbances and system noise could be decreased. The proposed method significantly enhanced the temperature control performance of hot-bar soldering, effectively suppressing overshoot and shortening the adjustment time, thereby achieving precise temperature control of the controlled object.

The purpose of this study is to propose a simplifying approach for modelling a reliability test. Modelling the reliability tests of printed circuit board (PCB)/microelectronic component assemblies requires the adoption of several simplifying assumptions. This study introduces and validates simplified assumptions for modeling a four-point bend test on a PCB/wafer-level chip scale packaging assembly.

In this study, simplifying assumptions were used. These involved substituting dynamic imposed displacement loading with an equivalent static loading, replacing the spherical shape of the interconnections with simplified shapes (cylindrical and cubic) and transitioning from a three-dimensional modelling approach to an equivalent two-dimensional model. The validity of these simplifications was confirmed through both quantitative and qualitative comparisons of the numerical results obtained. The maximum principal plastic strain in the solder balls and copper pads served as the criteria for comparison.

The simplified hypotheses were validated through quantitative and qualitative comparisons of the results from various models. Consequently, it was determined that the replacement of dynamic loading with equivalent static loading had no significant impact on the results. Similarly, substituting the spherical shape of interconnections with an equivalent shape and transitioning from a three-dimensional approach to a two-dimensional one did not substantially affect the precision of the obtained results.

This study serves as a valuable resource for researchers seeking to model accelerated reliability tests, particularly in the context of four-point bending tests. The results obtained in this study will assist other researchers in streamlining their numerical models, thereby reducing calculation costs through the utilization of the simplified hypotheses introduced and validated herein.

This paper aims to investigate the moisture diffusion behavior in a system-in-package module systematically by moisture-thermalmechanical-coupled finite element modeling with different structure parameters under increasingly harsh environment.

A finite element model for a system-in-package module was built with moisture-thermal-mechanical-coupled effects to study the subsequences of hygrothermal conditions.

It was found in this paper that the moisture diffusion path was mainly dominated by hygrothermal conditions, though structure parameters can affect the moisture distribution. At lower temperatures (30°C~85°C), the direction of moisture diffusion was from the periphery to the center of the module, which was commonly found in simulations and literatures. However, at relatively higher temperatures (125°C~220°C), the diffusion was from printed circuit board (PCB) to EMC due to the concentration gradient from PCB to EMC across the EMC/PCB interface. It was also found that there exists a critical thickness for EMC and PCB during the moisture diffusion. When the thickness of EMC or PCB increased to a certain value, the diffusion of moisture reached a stable state, and the concentration on the die surface in the packaging module hardly changed. A quantified correlation between the moisture diffusion coefficient and the critical thickness was then proposed for structure parameter optimization in the design of system-in-package module.

The different moisture diffusion behaviors at low and high temperatures have seldom been reported before. This work can facilitate the understanding of moisture diffusion within a package and offer some methods about minimizing its effect by design optimization.

This paper aims to concentrate on recent innovations in flexible wearable sensor technology tailored for monitoring vital signals within the contexts of wearable sensors and systems developed specifically for monitoring health and fitness metrics.

In recent decades, wearable sensors for monitoring vital signals in sports and health have advanced greatly. Vital signals include electrocardiogram, electroencephalogram, electromyography, inertial data, body motions, cardiac rate and bodily fluids like blood and sweating, making them a good choice for sensing devices.

This report reviewed reputable journal articles on wearable sensors for vital signal monitoring, focusing on multimode and integrated multi-dimensional capabilities like structure, accuracy and nature of the devices, which may offer a more versatile and comprehensive solution.

The paper provides essential information on the present obstacles and challenges in this domain and provide a glimpse into the future directions of wearable sensors for the detection of these crucial signals. Importantly, it is evident that the integration of modern fabricating techniques, stretchable electronic devices, the Internet of Things and the application of artificial intelligence algorithms has significantly improved the capacity to efficiently monitor and leverage these signals for human health monitoring, including disease prediction.

In 2022, the Baltimore professional development school (PDS) partner schools, John Ruhruh Elementary/Middle School (JREMS) and Notre Dame of Maryland University (NDMU) received funds through a Maryland Educational Emergency Revitalization (MEER) grant to determine (a) to what extent additional resources and professional development would increase JREMS teachers’ efficacy in technology integration and (b) to what extent NDMU professional development in the form of workshops and self-paced computer science modules would result in greater use of technology in the JREMS K-8 classrooms. Results indicated a statistically significant improvement in both teacher comfort with technology and integrated use of technology in instruction.

Survey data were collected on teacher-stated comfort with technology before and after grant implementation. Teachers’ use of technology was also measured by unannounced classroom visits by administration before and after the grant implementation and through artifacts teachers submitted during NDMU professional development modules.

Results showing significant increases in self-efficacy with technology along with teacher integration of technology exemplify the benefits of a PDS partnership.

This initiative was original in its approach to teacher development by replacing required teacher professional development with an invitation to participate and an incentive for participation (a personal MacBook) that met the stated needs of teachers. Teacher motivation was strong because teammates in a strong PDS partnership provided the necessary supports to induce changes in teacher self-efficacy.

The purpose of this paper is to illustrate the new technical demands and reliability challenges to printed circuit board (PCB) designs, materials and processes when the transmission frequency increases from Sub-6 GHz in previous generations to millimeter (mm) wave in fifth-generation (5G) communication technology.

The approach involves theoretical analysis and actual case study by various characterization techniques, such as a stereo microscope, metallographic microscope, scanning electron microscope, energy dispersive spectroscopy, focused ion beam, high-frequency structure simulator, stripline resonator and mechanical test.

To meet PCB signal integrity demands in mm-wave frequency bands, the improving proposals on copper profile, resin system, reinforcement fabric, filler, electromagnetic interference-reducing design, transmission line as well as via layout, surface treatment, drilling, desmear, laminating and electroplating were discussed. And the failure causes and effects of typical reliability issues, including complex permittivity fluctuation at different frequencies or environments, weakening of peel strength, conductive anodic filament, crack on microvias, the effect of solder joint void on signal transmission performance and soldering anomalies at ball grid array location on high-speed PCBs, were demonstrated.

The PCB reliability problem is the leading factor to cause failures of PCB assemblies concluded from statistical results on the failure cases sent to our laboratory. The PCB reliability level is very essential to guarantee the reliability of the entire equipment. In this paper, the summarized technical demands and reliability issues that are rarely reported in existing articles were discussed systematically with new perspectives, which will be very critical to identify potential reliability risks for PCB in 5G mm-wave applications and implement targeted improvements.

The purpose of this paper is to directly link information technology (IT) education with real-world phenomena.

The selected objectives are achieved by modeling line of sight (LOS) and nonline of sight (NLOS) mobile channels using corresponding distributions. Within the described experiments, students verify whether modeled generators generate random variables accordingly to the selected distribution. The results of observations are directly compared with theoretical expectations. The methodology was evaluated by students via questionnaires.

The results show that the proposed methodology can help graduate or undergraduate students better comprehend lectured material from mobile communications or mathematical statistics.

The hands on experience using the EMONA system make the approach original.

This study aims to focus on the surface mount technology (SMT) mass production process of Sn-9Zn-2.5Bi-1.5In solder. It explores it with some components that will provide theoretical support for the industrial SMT application of Sn-Zn solder.

This study evaluates the properties of solder pastes and selects a more appropriate reflow parameter by comparing the microstructure of solder joints with different reflow soldering profile parameters. The aim is to provide an economical and reliable process for SMT production in the industry.

Solder paste wettability and solder ball testing in a nitrogen environment with an oxygen content of 3,000 ppm meet the requirements of industrial production. The printing performance of the solder paste is good and can achieve a printing rate of 100–160 mm/s. When soldering with a traditional stepped reflow soldering profile, air bubbles are generated on the surface of the solder joint, and there are many voids and defects in the solder joint. A linear reflow soldering profile reduces the residence time below the melting point of the solder paste (approximately 110 s). This reduces the time the zinc is oxidized, reducing solder joint defects. The joint strength of tin-zinc joints soldered with the optimized reflow parameters is close to that of Sn-58Bi and SAC305, with high joint strength.

This study attempts to industrialize the application of Sn-Zn solder and solves the problem that Sn-Zn solder paste is prone to be oxidized in the application and obtains the SMT process parameters suitable for Sn-9Zn-2.5Bi-1.5In solder.

As data centres grow in size and complexity, traditional air-cooling methods are becoming less effective and more expensive. Immersion cooling, where servers are submerged in a dielectric fluid, has emerged as a promising alternative. Ensuring reliable operations in data centre applications requires the development of an effective control framework for immersion cooling systems, which necessitates the prediction of server temperature. While deep learning-based temperature prediction models have shown effectiveness, further enhancement is needed to improve their prediction accuracy. This study aims to develop a temperature prediction model using Long Short-Term Memory (LSTM) Networks based on recursive encoder-decoder architecture.

This paper explores the use of deep learning algorithms to predict the temperature of a heater in a two-phase immersion-cooled system using NOVEC 7100. The performance of recursive-long short-term memory-encoder-decoder (R-LSTM-ED), recursive-convolutional neural network-LSTM (R-CNN-LSTM) and R-LSTM approaches are compared using mean absolute error, root mean square error, mean absolute percentage error and coefficient of determination (R²) as performance metrics. The impact of window size, sampling period and noise within training data on the performance of the model is investigated.

The R-LSTM-ED consistently outperforms the R-LSTM model by 6%, 15.8% and 12.5%, and R-CNN-LSTM model by 4%, 11% and 12.3% in all forecast ranges of 10, 30 and 60 s, respectively, averaged across all the workloads considered in the study. The optimum sampling period based on the study is found to be 2 s and the window size to be 60 s. The performance of the model deteriorates significantly as the noise level reaches 10%.

The proposed models are currently trained on data collected from an experimental setup simulating data centre loads. Future research should seek to extend the applicability of the models by incorporating time series data from immersion-cooled servers.

The proposed multivariate-recursive-prediction models are trained and tested by using real Data Centre workload traces applied to the immersion-cooled system developed in the laboratory.

This paper aims to present a low-cost, edge-fed, windmill-shaped, notch-band eliminator, circular monopole antenna which is practically loaded with a complementary split ring resonator (CSRR) in the middle of the radiating conductor and also uses a partial ground to obtain wide-band performance.

To compensate for the reduced value of gain and reflection coefficient because of the full (complete) ground plane at the bottom of the substrate, the antenna is further loaded with a partial ground and a CSRR. The reduction in the length of ground near the feed line improves the impedance bandwidth, and introduced CSRR results in improved gain with an additional resonance spike. This results in a peak gain 3.895dBi at the designed frequency 2.45 GHz. The extending of three arms in the circular patch not only led to an increase of peak gain by 4.044dBi but also eliminated the notch band and improved the fractional bandwidth 1.65–2.92 GHz.

The work reports a –10dB bandwidth from 1.63 GHz to 2.91 GHz, which covers traditional coverage applications and new specific uses applications such as narrow LTE bands for future internet of things (NB-IoT) machine-to-machine communications 1.8/1.9/2.1/2.3/2.5/2.6 GHz, industry, automation and business-critical cases (2.1/2.3/2.6 GHz), industrial, society and medical applications such as Wi-MAX (3.5 GHz), Wi-Fi3 (2.45 GHz), GSM (1.9 GHz), public safety band, Bluetooth (2.40–2.485 GHz), Zigbee (2.40–2.48Ghz), industrial scientific medical (ISM) band (2.4–2.5 GHz), WCDMA (1.9, 2.1 GHz), 3 G (2.1 GHz), 4 G LTE (2.1–2.5 GHz) and other personal communication services applications. The estimated RLC electrical equivalent circuit is also presented at the end.

Because of full coverage of Bluetooth, Zigbee, WiFi3 and ISM band, the proposed fabricated antenna is suitable for low power, low data rate and wireless/wired short-range IoT-enabled medical applications.

The antenna is fabricated on a piece (66.4 mm × 66.4 mm × 1.6 mm) of low-cost low profile FR-4 epoxy substrate (0.54 λ_g × 0.54 λ_g) with a dielectric constant of 4.4, a loss tangent of 0.02 and a thickness of 1.6 mm. The antenna reflection coefficient, impedance and VSWR are tested on the Keysight technology (N9917A) vector network analyzer, and the radiation pattern is measured in an anechoic chamber.