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1 – 10 of over 1000Francois Brouard, Tyler Chamberlin, Jerome Doutriaux and John de la Mothe
The application of laser and optical technologies in the industry is wide and extensive; the development and application of laser and optical technologies have become a promising…
Abstract
Purpose
The application of laser and optical technologies in the industry is wide and extensive; the development and application of laser and optical technologies have become a promising research domain. However, most existing studies have focused on the technical aspects or the application aspects; these studies have not highlighted the technology distribution and application development of laser and optical technologies from the big picture. Additionally, the manner in which the research and development (R&D) results of universities correspond to the needs of enterprises and industry has become a topic of concern for the public. Therefore, this study aims to adopt the academic patents as the basis for analysis and to construct a laser and optical technology network.
Design/methodology/approach
Therefore, in the current study, the researchers have analyzed relevant academic patent technology networks, using academic patents of laser and optical technologies as a basis of analysis.
Findings
The study results indicated that the key technologies mainly lie in nanostructures, metal-working, material analysis and semiconductor devices. Additionally, these technologies are mainly applied in industries, such as optics, medical technology, pharmaceuticals, biotechnology and organic fine chemistry; this indicated that a large proportion of academia’s R&D outcomes are applied in these industries.
Originality/value
In this study, the researchers have constructed a technology network model to explore the technical development direction of laser and optical technologies; the results of the current study could serve as a reference for universities and industry for allocation of R&D resources.
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Liesbeth van Pieterson, Piet Bouten, Koen Kriege and Rabin Bhattacharya
Textiles are a ubiquitous part of human life. By combining them with electronics to create electronic textile systems, new application fields emerge. In this paper, technology and…
Abstract
Textiles are a ubiquitous part of human life. By combining them with electronics to create electronic textile systems, new application fields emerge. In this paper, technology and applications of light-emitting textile systems are presented: a fabric substrate is described for electronic textile with robust interwoven connections between the conductive yarns in it. The fabric robustness, as a function of the electrical reliability of its conductive yarn connections, is shown to hold over large deformations. This fabric is then used to create a light-emitting diode (LED) based photonic textile display. Finally, we will show an example of an application that could make use of such a photonic textile system.
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J. Heilala, K. Keränen, J.‐T. Mäkinen, O. Väätäinen, K. Kautio, P. Voho and P. Karioja
The aim of the research was to evaluate the concept that utilizes structured planar substrates based on low temperature co‐fired ceramics (LTCC) as a precision platform for the…
Abstract
Purpose
The aim of the research was to evaluate the concept that utilizes structured planar substrates based on low temperature co‐fired ceramics (LTCC) as a precision platform for the passive alignment of a multimode fiber and wide‐stripe diode laser.
Design/methodology/approach
Presents the manufacturing process for realisation of 3D precision structures, heat dissipation structures and a cooling channel into the LTCC substrate. The developed methodology for 3D modelling and simulation of the system was used to optimize structures, materials and components in order to achieve optimal performance for the final product and still maintain reasonably low fabrication costs. The simulated optical coupling efficiency and alignment tolerances were verified by prototype realization and characterization.
Findings
The achieved passive alignment accuracy allows high coupling efficiency realisations of multimode fiber pigtailed laser modules and is suitable for mass production.
Research limitations/implications
Provides guidance in the design of LTCC precision platforms for passive alignment and presents a hybrid simulation method for photonics module concept analysis.
Practical implications
The three‐dimensional shape of the laminated and fired ceramic substrate provides the necessary alignment structures including holes, grooves and cavities for the laser to fiber coupling. Thick‐film printing and via punching can be incorporated in order to integrate electronic assemblies directly into the opto‐mechanical platform.
Originality/value
Introduces the LTCC 3D precision structures for photonics modules enabling passive alignment of multimode fiber pigtailed laser with high efficiency optical coupling. Demonstrates the hybrid simulation methodology for concept analysis.
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Defining and validating a map of related technologies is critical for managers, investors and inventors. Because of the increase in the applications of and demand for…
Abstract
Purpose
Defining and validating a map of related technologies is critical for managers, investors and inventors. Because of the increase in the applications of and demand for semiconductor lasers, analyzing the technological position of developers has become increasingly critical. Therefore, the purpose of this study is to adopt the technological position analysis to identify mainstream technologies and developments relevant to semiconductor lasers.
Design/methodology/approach
Correspondence analysis and k-means cluster analysis, which are data mining techniques, are used to reveal strategic groups of major competitors in the semiconductor laser market according to their Patent Cooperation Treaty (PCT) patent applications.
Findings
The results of this study reveal that PCT patent applications are generally obtained for masers, optical elements, semiconductor devices and methods for measuring and that technology developers have varying technological positions.
Originality/value
Through position analysis, this study identifies the technological focuses of different manufacturers to obtain information that can guide the allocation of research and development resources.
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Eamon Cahill, Hector Hernández and Felix Bellido
Materials and materials technologies are recognized to be key underpinning and critically enabling areas of R&D. Most industrial sectors and fields of technology application…
Abstract
Materials and materials technologies are recognized to be key underpinning and critically enabling areas of R&D. Most industrial sectors and fields of technology application depend upon them. Materials research can provide new solutions capable of optimizing the application of current technologies, minimizing their negative side effects and reducing production costs. However, the long development time and slow return on materials research investments make industry reluctant to take on the associated risks. This alone suggests that policy initiatives to sustain long‐term research efforts are necessary. This article considers the policy findings of national foresight initiatives in the area of materials and material technologies.
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Abstract
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Fei Chu, Hongzhuan Chen, Zheng Zhou, Changlei Feng and Tao Zhang
This paper aims to investigate the bonding of the photonic integrated circuit (PIC) chip with the heat sink using the AlNi self-propagating soldering method.
Abstract
Purpose
This paper aims to investigate the bonding of the photonic integrated circuit (PIC) chip with the heat sink using the AlNi self-propagating soldering method.
Design/methodology/approach
Compared to industrial optical modules, optical modules for aerospace applications require better reliability and stability, which is hard to achieve via the dispensing adhesive process that is used for traditional industrial optical modules. In this paper, 25 µm SAC305 solder foils and the AlNi nanofoil heat source were used to bond the back of the PIC chip with the heat sink. The temperature field and temperature history were analyzed by the finite element analysis (FEA) method. The junction-to-case thermal resistance is 0.0353°C/W and reduced by 85% compared with the UV hybrid epoxy joint.
Findings
The self-propagating reaction ends within 2.82 ms. The maximum temperature in the PIC operating area during the process is 368.5°C. The maximum heating and cooling rates of the solder were 1.39 × 107°C/s and −5.15 × 106°C/s, respectively. The microstructure of SAC305 under self-propagating reaction heating is more refined than the microstructure of SAC305 under reflow. The porosity of the heat sink-SAC305-PIC chip self-propagating joint is only 4.7%. Several metastable phases appear as AuSn3.4 and AgSn3.
Originality/value
A new bonding technology was used to form the bonding between the PIC chip with the heat sink for the aerospace optical module. The reliability and thermal resistance of the joint are better than that of the UV hybrid epoxy joint.
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There can be little dispute that the UK, with its excellent science base, has the potential to take advantage of the opportunities arising from the increasing speed of scientific…
Abstract
There can be little dispute that the UK, with its excellent science base, has the potential to take advantage of the opportunities arising from the increasing speed of scientific and technological advance. However, especially in more recent decades, this potential has been consistently wasted. The fact is that despite an almost unparalleled track record on invention, the transfer from invention to innovation has often not been achieved by UK businesses with the result that the economy has failed to reap the commercial rewards from these discoveries.
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