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Article
Publication date: 1 December 2002

30

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Circuit World, vol. 28 no. 4
Type: Research Article
ISSN: 0305-6120

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Article
Publication date: 1 March 1999

92

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Circuit World, vol. 25 no. 1
Type: Research Article
ISSN: 0305-6120

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Article
Publication date: 1 March 2003

57

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Circuit World, vol. 29 no. 1
Type: Research Article
ISSN: 0305-6120

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Article
Publication date: 1 April 1988

M. Eliacin and F. Scaraglino

This paper describes the use of the EE‐1 process for making high‐reliability multilayer boards. The EE‐1 process eliminates the need for flash electroless copper for…

Abstract

This paper describes the use of the EE‐1 process for making high‐reliability multilayer boards. The EE‐1 process eliminates the need for flash electroless copper for plated‐through holes. With this process, copper is directly electrodeposited onto an activated through‐hole. In addition to eliminating electroless deposition, the EE‐1 process claims to simplify process control, provide excellent copper‐to‐copper adhesion, and total backlight PTH coverage. Production experience with the process is extensive as it has been used at Photocircuits, Atlanta, since January 1986 in the fabrication of double‐sided boards. Test data of joint reliability and physical properties of copper in PTHs of multilayer boards obtained through this unique approach are presented. A special test, which directly measures the bond strength between through‐hole deposited copper and inner foil of multilayers, is also discussed.

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Circuit World, vol. 15 no. 1
Type: Research Article
ISSN: 0305-6120

Article
Publication date: 1 February 1984

M.E. Pole‐Baker

Multilayer boards development. The American Tinkertoy and Micromodule programmes had shown that layers of etched circuits could be built up to provide a complete unit, and high…

Abstract

Multilayer boards development. The American Tinkertoy and Micromodule programmes had shown that layers of etched circuits could be built up to provide a complete unit, and high densities could be achieved. The Hazeltine Corporation in America perfected a technique in which three or more layers with coincident holes were bonded together with insulating sheets and the layers connected through by using the existing plated‐through hole technique. Their ‘Multiplanar’ process was disclosed in 1961, and is the only accepted method of making multilayer boards today, and the one on which all existing specifications are based.

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Circuit World, vol. 10 no. 3
Type: Research Article
ISSN: 0305-6120

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Article
Publication date: 1 December 1999

36

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Circuit World, vol. 25 no. 4
Type: Research Article
ISSN: 0305-6120

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Article
Publication date: 1 March 1994

Trevor Galbraith

During the first half of this year the Association has continued to expand its exhibition programme by increasing its presence at overseas shows. Two DTI sponsored joint venture…

Abstract

During the first half of this year the Association has continued to expand its exhibition programme by increasing its presence at overseas shows. Two DTI sponsored joint venture groups have been formed, one to Nepcon West, the other to Nepcon Beijing. Anaheim saw the biggest UK group for over 10 years, with CEMA taking three separate blocks in different sectors of the show. There is no doubt from the reception we received that CEMA is now firmly established at Nepcon West. We enjoyed tremendous support from both the British Consulate and the British‐American Chamber of Commerce with their President making several visits to the CEMA booth.

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Circuit World, vol. 20 no. 4
Type: Research Article
ISSN: 0305-6120

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Article
Publication date: 1 September 2005

Brian Ellis

61

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Circuit World, vol. 31 no. 3
Type: Research Article
ISSN: 0305-6120

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Article
Publication date: 1 December 2000

29

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Circuit World, vol. 26 no. 4
Type: Research Article
ISSN: 0305-6120

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Article
Publication date: 1 April 2003

30

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Soldering & Surface Mount Technology, vol. 15 no. 1
Type: Research Article
ISSN: 0954-0911

Keywords

1 – 10 of 29