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Article
Publication date: 1 August 2005

114

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Microelectronics International, vol. 22 no. 2
Type: Research Article
ISSN: 1356-5362

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Article
Publication date: 1 April 1985

Kulicke & Soffa announce the promotion of Kevin Setters (28) to Technical Support Manager from Senior Service Engineer. He is responsible for special engineering applications and…

Abstract

Kulicke & Soffa announce the promotion of Kevin Setters (28) to Technical Support Manager from Senior Service Engineer. He is responsible for special engineering applications and field service in the UK and Ireland. He heads a team of ten specialist engineers.

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Microelectronics International, vol. 2 no. 4
Type: Research Article
ISSN: 1356-5362

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Article
Publication date: 1 April 2002

74

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Microelectronics International, vol. 19 no. 1
Type: Research Article
ISSN: 1356-5362

Article
Publication date: 1 February 1990

H. Binner, H.T. Law, N. Sinnadurai, G. Jones and P.E. Ongley

Following the discussion at our recent Annual General Meeting, a questionnaire was sent out to all members. Almost half of them replied despite the fact that the time allowed for…

Abstract

Following the discussion at our recent Annual General Meeting, a questionnaire was sent out to all members. Almost half of them replied despite the fact that the time allowed for returning the questionnaire had been kept very short. Some members even provided detailed comments.

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Microelectronics International, vol. 7 no. 2
Type: Research Article
ISSN: 1356-5362

Article
Publication date: 1 January 1994

Miloš Somora, A.P. Hilley, H. Binner, Gábor Hársanyi, M.S. Vijayaraghavan, Tao Sung Oh, T. Laine‐ Ylijoki, P. Collander, Boguslaw Herod, Peter Barnwell and David Lowrie

‘Soldering and Cleaning in Electronics’ international conference, including an exposition, took place in Brno on 12–13 October 1993. The conference was organised by SMT‐Info…

422

Abstract

‘Soldering and Cleaning in Electronics’ international conference, including an exposition, took place in Brno on 12–13 October 1993. The conference was organised by SMT‐Info, together with the ISHM‐Czech and Slovak Chapter. The purpose of this common action was to bring together the professionals in surface mount technology and thick film technology. In the framework of the conference, in which 130 home and foreign delegates participated, the annual meeting of the ISHM‐Czech and Slovak Chapter took place.

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Microelectronics International, vol. 11 no. 1
Type: Research Article
ISSN: 1356-5362

Article
Publication date: 1 March 1987

Bob Turnbull, Peter Barnwell, Paul Yates, Alan Fairbairn, Brian Waterfield and Mary Waterfield

The conference and exhibition got off to a good start with an official reception by the Mayor of Bournemouth on Tuesday evening where attendees could relax and chat—a pleasant way…

Abstract

The conference and exhibition got off to a good start with an official reception by the Mayor of Bournemouth on Tuesday evening where attendees could relax and chat—a pleasant way to meet old friends and to make new acquaintances.

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Microelectronics International, vol. 4 no. 3
Type: Research Article
ISSN: 1356-5362

Article
Publication date: 1 January 1992

Colin Lea and Bob Willis

The UK is a leader in the implementation of surface mount technology, and SMARTEX '91 sponsored by the SMART Group is one of only a few shows organised worldwide which is…

Abstract

The UK is a leader in the implementation of surface mount technology, and SMARTEX '91 sponsored by the SMART Group is one of only a few shows organised worldwide which is dedicated solely to this field. Perhaps it was not surprising then that this year's three‐day event proved a great success.

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Soldering & Surface Mount Technology, vol. 4 no. 1
Type: Research Article
ISSN: 0954-0911

Article
Publication date: 1 February 1987

The ISHM‐Benelux Chapter will organise a one‐day conference at the Antwerp Crest Hotel, on Thursday 29 October 1987. The conference will be aimed at applications of hybrid…

Abstract

The ISHM‐Benelux Chapter will organise a one‐day conference at the Antwerp Crest Hotel, on Thursday 29 October 1987. The conference will be aimed at applications of hybrid circuits rather than technology.

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Microelectronics International, vol. 4 no. 2
Type: Research Article
ISSN: 1356-5362

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164

Abstract

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Microelectronics International, vol. 16 no. 2
Type: Research Article
ISSN: 1356-5362

Article
Publication date: 1 April 2003

Zhengrong Tian, Charles Free, Colin Aitchison, Peter Barnwell and James Wood

The trend in wireless and mobile communications for broader bandwidth microwave circuitry, coupled with high packaging density and low cost fabrication has triggered…

Abstract

The trend in wireless and mobile communications for broader bandwidth microwave circuitry, coupled with high packaging density and low cost fabrication has triggered investigations of new circuit configurations and technologies that meet these requirements. We have addressed these issues through the study of multilayer microwave structures using advanced thick‐film technology. The techniques described employ several layers of metal sandwiched by thick‐film dielectric. This leads to an efficient solution for system miniaturisation. The significance of this work is that it shows the multilayer approach to microwave structures, coupled with new thick‐film technology, offers a viable and economic solution to achieve high‐density, high‐performance microwave circuits.

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Microelectronics International, vol. 20 no. 1
Type: Research Article
ISSN: 1356-5362

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