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Article
Publication date: 5 September 2008

Paul Conway

Digital content is a common denominator that underlies all discussions on scholarly communication, digital preservation, and asset management. This past decade has seen a…

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Abstract

Purpose

Digital content is a common denominator that underlies all discussions on scholarly communication, digital preservation, and asset management. This past decade has seen a distinctive evolution in thinking among stakeholders on how to assemble, care for, deliver, and ultimately preserve digital resources in a college and university environment. At first, institutional repositories promised both a technical infrastructure and a policy framework for the active management of scholarly publications. Now other approaches that take a broader view of digital content hold sway, the result being confusion rather than clarity about where digital content originates, who the stakeholders are, and how to establish and adjust asset management priorities. This article seeks to present a model for plotting the range of digital content that might be amenable to management as digital assets in higher education.

Design/methodology/approach

The article reviews differing perspectives on digital content, outlines a generalized model, and suggests how the model could be used for examining the distribution of campus digital assets and fostering dialog on management priorities across stakeholder communities.

Findings

A multivariate model of digital content provides a rich framework for analyzing asset management priorities in a university setting. The model should be applied and tested in a variety of university settings.

Practical implications

The model is a tool for establishing asset management priorities across campus units that produce digital content.

Originality/value

The paper offers an original model for evaluating the asset values of digital content produced or acquired in a university context.

Details

Library Hi Tech, vol. 26 no. 3
Type: Research Article
ISSN: 0737-8831

Keywords

Content available
Article
Publication date: 1 May 2006

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57

Abstract

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Circuit World, vol. 32 no. 2
Type: Research Article
ISSN: 0305-6120

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Article
Publication date: 1 April 1998

Paul Conway, David Whalley, Michelle Wilkinson and S.M. Hyslop

This paper describes a technique for the monitoring and control of the reflow soldering process. The technique combines state‐of‐the‐art infra‐red (IR) sensor technology…

Abstract

This paper describes a technique for the monitoring and control of the reflow soldering process. The technique combines state‐of‐the‐art infra‐red (IR) sensor technology, coupled with application‐specific process monitoring and control software, providing a unique capability both to monitor product temperatures during processing and to modify the process settings. The development of techniques to allow variation of the heat transfer from the oven to the in‐process printed circuit assemblies (PCAs) provides the means to adjust the soldering oven’s process settings for each individual PCA. This automatic profiling ensures consistent thermal histories and optimises oven energy consumption. Archiving of the reflow profiles along with temperatures recorded for each PCA provides full traceability to the reflow process settings for each individual PCA. The incorporation of IR sensing technology also provides a means to monitor the performance of the process.

Details

Soldering & Surface Mount Technology, vol. 10 no. 1
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 8 March 2011

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121

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Library Hi Tech News, vol. 28 no. 1
Type: Research Article
ISSN: 0741-9058

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Book part
Publication date: 21 November 2015

Eline Vanassche, Frances Rust, Paul F. Conway, Kari Smith, Hanne Tack and Ruben Vanderlinde

This chapter is contributed by InFo-TED, the International Forum for Teacher Educator Development. This newly established community brings together people from across the…

Abstract

This chapter is contributed by InFo-TED, the International Forum for Teacher Educator Development. This newly established community brings together people from across the world to exchange research, policy, and practice related to teacher educators’ professional learning and development. We define teacher educators broadly as those who are professionally involved and engaged in the initial and on-going education of teachers. Our contention is that while there is general agreement about the important role played by teacher educators, their professional education is under-studied and under-supported. Here, we elaborate the rationale for this initiative, delineate our conceptual framework, and provide examples of steps taken in Belgium, Ireland, and Norway to develop the professional identities and knowledge bases of those who educate and support teachers, and conclude with implications for a implications for a scholarly study agenda having to do with research, policy, and practice relating to teacher educators’ professional development.

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Article
Publication date: 15 June 2010

Devan Ray Donaldson and Paul Conway

The purpose of this case study is to describe and interpret the PREservation Metadata: Implementation Strategies (PREMIS) implementation process, to gain more insight into…

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2337

Abstract

Purpose

The purpose of this case study is to describe and interpret the PREservation Metadata: Implementation Strategies (PREMIS) implementation process, to gain more insight into why barriers to the adoption of PREMIS exist as well as how to overcome them.

Design/methodology/approach

This qualitative case study analysis highlights the Florida Digital Archive as an exemplar of an organization in the throes of deciding just how to implement the PREMIS metadata model in a working repository system.

Findings

Findings from this study suggest that use of PREMIS requires adaptation in which an organization must make changes in order to use PREMIS, and vice versa. Findings also suggest that there are clearly defined steps involved in the PREMIS implementation process, and that the nature of this process is iterative.

Research limitations/implications

This study is limited by a short data collection period. It is also limited by investigating only one institution during its implementation process. Future studies could test the validity of the model proposed in this study and include multiple institutions.

Practical implications

By providing context for the implementation process, this paper can help cultural heritage institutions interested in fully adopting PREMIS.

Originality/value

Exploring PREMIS implementation using DOI/MIS literature is novel in the digital preservation community and is proposed as particularly useful to digital preservationists who are considering adopting PREMIS. The paper suggests that seemingly innocuous decisions by developers have real implications for preservation.

Details

Library Hi Tech, vol. 28 no. 2
Type: Research Article
ISSN: 0737-8831

Keywords

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Article
Publication date: 18 May 2010

Axel Bindel, Paul Conway, Laura Justham and Andrew West

The purpose of this paper is to present an update of and the latest results from work on a project aimed at monitoring electronic products during the whole life cycle with…

Abstract

Purpose

The purpose of this paper is to present an update of and the latest results from work on a project aimed at monitoring electronic products during the whole life cycle with embedded wireless components.

Design/methodology/approach

Business processes of the electronic manufacturing supply chain were analysed. A business case and the system opportunities for life cycle monitoring, based on embedded wireless components system were developed. Radio frequency identification (RFID) assembly technology was adapted for the integration of components into a multi‐layer printed circuit board (PCB).

Findings

By storing product‐related information into electronic products, tracing of components, monitoring of processes, operations and costs, environmentally optimised recycling can be enhanced.

Research limitations/implications

The research undertaken so far relates to the embedding of RFID tags into PCBs. Wireless components with more processing power will be used in the next project phase.

Originality/value

The paper details how wireless components can be embedded into multi‐layer PCBs and how a business case for a life cycle monitoring system can be established.

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Article
Publication date: 1 March 2003

Fida Mohammad and Paul Conway

Presents an overview of the justice and law enforcement systems which prevailed in Afghanistan under the Taliban, incorporating personal views of some Afghan intellectuals…

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1041

Abstract

Presents an overview of the justice and law enforcement systems which prevailed in Afghanistan under the Taliban, incorporating personal views of some Afghan intellectuals and Pakistani intelligence officials who had close contact with Taliban personnel. Summarizes the historical background and notes the historic strong, informal social controls with retributive elements of tribal societies; the failed attempt to introduce a Soviet‐style criminal justice system after the Communist coup of 1978; the ensuing period of general chaos and anarchy, brought to an end by the emergence of the Taliban on Afghanistan’s political and military scene by the mid‐1990s, which established some sort of civil order, ruthlessly enforced according to the Taliban’s own interpretation of Islamic justice. Describes the hierarchies within the country’s administrative system and methods of solving civil and criminal disputes. Concludes that it is too early to predict whether a new viable legal order will emerge in the future, particularly when warlords control significant regions beyond the Karzai‐administered city of Kabul.

Details

Policing: An International Journal of Police Strategies & Management, vol. 26 no. 1
Type: Research Article
ISSN: 1363-951X

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Article
Publication date: 11 September 2009

Dennis Patrick Webb, Benedikt Knauf, Chanqing Liu, David Hutt and Paul Conway

Microfluidic or “lab‐on‐a‐chip” technology is seen as a key enabler in the rapidly expanding market for medical point‐of‐care and other kinds of portable diagnostic…

Abstract

Purpose

Microfluidic or “lab‐on‐a‐chip” technology is seen as a key enabler in the rapidly expanding market for medical point‐of‐care and other kinds of portable diagnostic device. The purpose of this paper is to discuss two proposed packaging processes for large‐scale manufacture of microfluidic systems.

Design/methodology/approach

In the first packaging process, polymer overmoulding of a microfluidic chip is used to form a fluidic manifold integrated with the device in a single step. The anticipated advantages of the proposed method of packaging are ease of assembly and low part count. The second process involves the use of low‐frequency induction heating (LFIH) for the sealing of polymer microfluidics. The method requires no chamber, and provides fast and selective heating to the interface to be joined.

Findings

Initial work with glass microfluidics demonstrates feasibility for overmoulding through two separate sealing principles. One uses the overmould as a physical support structure and providing sealing using a compliant ferrule. The other relies on adhesion between the material of the overmould and the microfluidic device to provide a seal. As regards LFIH work on selection and structuring of susceptor materials is reported, together with analysis of the dimensions of the heat‐affected zone. Acrylic plates are joined using a thin (<10 μm) nickel susceptor providing a fluid seal that withstands a pressure of 590 kPa.

Originality/value

Microfluidic chips have until now been produced in relatively small numbers. To scale‐up from laboratory systems to the production volumes required for mass markets, packaging methods need to be adapted to mass manufacture.

Details

Sensor Review, vol. 29 no. 4
Type: Research Article
ISSN: 0260-2288

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Article
Publication date: 1 September 2005

Dezhi Li, Changqing Liu and Paul P. Conway

To study the influence of storage time and environment on the solderability of electroless nickel plated samples with Sn‐3.8Ag‐0.7Cu and Sn‐3.5Ag lead‐free solders and to…

Abstract

Purpose

To study the influence of storage time and environment on the solderability of electroless nickel plated samples with Sn‐3.8Ag‐0.7Cu and Sn‐3.5Ag lead‐free solders and to provide criteria for the use of an electroless nickel (Ni‐P) under bump metallization (UBM) without immersion gold protection.

Design/methodology/approach

Electroless nickel coatings were deposited onto pure aluminium foil through a procedure developed for the UBM of wafers prior to flip chip bumping. Their solderability with lead‐free solders was studied using the wetting balance technique. Samples stored in different environments for different periods of time were tested to study the dependence of the solderability of Ni‐P coatings on the storage time and temperature. The degree of oxidation of the Ni‐P coatings was examined by means of X‐ray photoelectron spectroscopy and the surface microstructure and roughness of the coatings were analyzed by scanning electron microscopy and atomic force microscopy.

Findings

It was found that the Ni‐P coatings were unacceptable for direct soldering without the assistance of a flux, due to poor wettability, even when using a freshly prepared Ni‐P coating. Therefore, a suitable flux with nitrogen inerting had to be applied to assist the soldering process. The results also show that the solderability of Ni‐P coatings was affected by the phosphorus content, and the Ni‐P coating with high phosphorus content had a good solderability. The storage time and temperature did not influence the wettability significantly with the assistance of strong flux.

Research limitations/implications

The stability of the plating solution and the consistence of the phosphorus content in the coating are not easily controlled. This has resulted in implications for surface analysis and wetting testing. Ni‐P coatings with different levels of phosphorus content are being investigated in detail.

Originality/value

The value of the paper lies in its study on the solderability of lead‐free solders to Ni‐P coating after storage in different environments and for different periods, which can provide some criteria for the use of Ni‐P UBM without immersion gold protection.

Details

Circuit World, vol. 31 no. 3
Type: Research Article
ISSN: 0305-6120

Keywords

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