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1 – 10 of 134
Open Access
Article
Publication date: 12 May 2020

Barbara Dziurdzia, Maciej Sobolewski, Janusz Mikołajek and Sebastian Wroński

This paper aims to investigate voiding phenomena in solder joints under thermal pads of light-emitting diodes (LEDs) assembled in mass production environment by reflow soldering…

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Abstract

Purpose

This paper aims to investigate voiding phenomena in solder joints under thermal pads of light-emitting diodes (LEDs) assembled in mass production environment by reflow soldering by using seven low-voiding lead-free solder pastes.

Design/methodology/approach

The solder pastes investigated are of SAC305 type, Innolot type or they are especially formulated by the manufacturers on the base of (SnAgCu) alloys with addition of some alloying elements such as Bi, In, Sb and Ti to provide low-void contents. The SnPb solder paste – OM5100 – was used as a benchmark. The solder paste coverage of LED solder pads was chosen as a measure of void contents in solder joints because of common usage of this parameter in industry practice.

Findings

It was found that the highest coverage and, related to it, the least void contents are in solder joints formed with the pastes LMPA-Q and REL61, which are characterized by the coverage of mean value 93.13% [standard deviation (SD) = 2.72%] and 92.93% (SD = 2.77%), respectively. The void diameters reach the mean value equal to 0.061 mm (SD = 0.044 mm) for LMPA-Q and 0.074 mm (SD = 0.052 mm) for REL61. The results are presented in the form of histograms, plot boxes and X-ray images. Some selected solder joints were observed with 3D computer tomography.

Originality/value

The statistical analyses are carried out on the basis of 2D X-ray images with using Origin software. They enable to compare features of various solder pastes recommended by manufacturers as low voiding. The results might be useful for solder paste manufacturers or electronic manufacturing services.

Details

Soldering & Surface Mount Technology, vol. 32 no. 4
Type: Research Article
ISSN: 0954-0911

Keywords

Open Access
Article
Publication date: 13 October 2022

Marcin Myśliwiec, Ryszard Kisiel and Mirosław J. Kruszewski

The purpose of this paper is to develop and test the thermal interface materials (TIM) for application in assembly of semiconductor chips to package. Good adhesion properties…

Abstract

Purpose

The purpose of this paper is to develop and test the thermal interface materials (TIM) for application in assembly of semiconductor chips to package. Good adhesion properties (>5 MPa shear strength) and low thermal interface resistance (better than for SAC solders) are the goal of this research.

Design/methodology/approach

Mechanical and thermal properties of TIM joints between gold plated contacts of chip and substrate were investigated. Sintering technique based on Ag pastes was applied for purpose of this study. Performance properties were assessed by shear force tests and thermal measurements. Scanning electron microscopy was used for microstructural observations of cross-section of formed joints.

Findings

It was concluded that the best properties are achieved for pastes containing spherical Ag particles of dozens of micrometer size with flake shaped Ag particles of few micrometers size. Sintering temperature at 230°C and application of 1 MPa force on the chip during sintering gave the higher adhesion and the lowest thermal interface resistance.

Originality/value

The new material based on Ag paste containing mixtures of Ag particles of different size (form nanometer to dozens of microns) and shape (spherical, flake) suspended in resin was proposed. Joints prepared using sintering technique and Ag pastes at 230°C with applied pressure shows better mechanical and thermal than other TIM materials such as thermal grease, thermal gel or thermally conductive adhesive. Those material could enable electronic device operation at temperatures above 200°C, currently unavailable for Si-based power electronics.

Details

Microelectronics International, vol. 39 no. 4
Type: Research Article
ISSN: 1356-5362

Keywords

Open Access
Article
Publication date: 16 July 2020

Tomasz Matusiak, Arkadiusz Dabrowski and Leszek Golonka

The purpose of this paper is to present the properties of thick-film resistors made of novel pastes prepared from glass and graphite.

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Abstract

Purpose

The purpose of this paper is to present the properties of thick-film resistors made of novel pastes prepared from glass and graphite.

Design/methodology/approach

Graphite-based resistors were made of thick-film pastes with different graphite-to-glass mass fraction were prepared and examined. Sheet resistance, temperature coefficient of resistance, impact of humidity and short-term overload were investigated. The properties of the layers fired in atmospheres of air at 550°C and nitrogen at 875°C were compared.

Findings

Graphite-based resistors with various graphite-to-glass ratios made possible to obtain a wide range of sheet resistance from single O/square to few kO/square. These values were dependent on firing atmosphere, paste composition and the number of screen-printed layers. The samples made of paste with 1:1 graphite-to-glass ratio exhibited the temperature coefficient of resistance of about −1,000 ppm/°C, almost independently on the firing atmosphere and presence of a top coating. The resistors fired in the air after coating with overglaze, exhibited significantly lower sheet resistance, reduced impact of humidity and improved power capabilities.

Originality/value

In this paper, graphite-based resistors for applications in typical high-temperature cermet thick-film circuits were presented, whereas typical graphite-based resistors were fabricated in polymer thick-film technology. Owing to very low cost of the graphite, the material is suitable for low-power passive circuits, where components are not subjected into high temperature, above the typical temperature of operation of standard electronic components.

Details

Circuit World, vol. 47 no. 2
Type: Research Article
ISSN: 0305-6120

Keywords

Open Access
Article
Publication date: 28 January 2022

Kiranmai Uppuluri and Dorota Szwagierczak

The purpose of this work was to characterize NiMn2O4 spinel-based thermistor powder, to use it in screen printing technology to fabricate temperature sensors, to study their…

1066

Abstract

Purpose

The purpose of this work was to characterize NiMn2O4 spinel-based thermistor powder, to use it in screen printing technology to fabricate temperature sensors, to study their performance for different sintering temperatures of thermistor layer, with and without insulative cover, as well as to investigate stability of the fabricated thermistors and their applicability in water quality monitoring.

Design/methodology/approach

After the characterization of starting NiMn2O4 spinel-based thermistor powder, it was converted to thick film paste which was screen printed on alumina substrate. Thermistor layers were sintered at four different sintering temperatures: 980°C, 1050°C, 1150°C and 1290°C. An interdigitated pattern of Ag-Pd conductive layer was used to reduce the resistance. Temperature-resistance characteristics were investigated in air and water, with and without insulative cover atop the thermistor layer. Stability of the fabricated thermistors after aging at 120°C for 300 h was also examined.

Findings

Thick film NiMn2O4 spinel thermistors, prepared by screen printing and sintering in the temperature range 980°C–1290°C, exhibited good negative temperature coefficient (NTC) characteristics in the temperature range −30°C to 145°C, including high temperature coefficient of resistance, good stability and applicability in water.

Originality/value

This study explores the range of sintering temperature that can be applied for NiMn2O4 thermistor thick films without compromising on the temperature sensing performance in air and water, as well as stability of the thermistors after aging at elevated temperatures.

Details

Sensor Review, vol. 42 no. 2
Type: Research Article
ISSN: 0260-2288

Keywords

Open Access
Article
Publication date: 28 April 2022

Krzysztof Jakub Stojek, Jan Felba, Damian Nowak, Karol Malecha, Szymon Kaczmarek and Patryk Tomasz Tomasz Andrzejak

This paper aims to perform thermal and mechanical characterization for silver-based sintered thermal joints. Layer quality affects thermal and mechanical performance, and it is…

Abstract

Purpose

This paper aims to perform thermal and mechanical characterization for silver-based sintered thermal joints. Layer quality affects thermal and mechanical performance, and it is important to achieve information about how materials and process parameters influence them.

Design/methodology/approach

Thermal investigation of the thermal joints analysis method was focused on determination of thermal resistance, where temperature measurements were performed using infrared camera. They were performed in two modes: steady-state analysis and dynamic analysis. Mechanical analysis based on measurements of mechanical shear force. Additional characterizations based on X-ray image analysis (image thresholding), optical microscope of polished cross-section and scanning electron microscope image analysis were proposed.

Findings

Sample surface modification affects thermal resistance. Silver metallization exhibits the lowest thermal resistance and the highest mechanical strength compared to the pure Si surface. The type of dynamic analysis affects the results of the thermal resistance.

Originality/value

Investigation of the layer quality influence on mechanical and thermal performance provided information about different joint types.

Details

Soldering & Surface Mount Technology, vol. 35 no. 1
Type: Research Article
ISSN: 0954-0911

Keywords

Open Access
Article
Publication date: 16 October 2017

Vahid Shokri Kahi, Saeed Yousefi, Hadi Shabanpour and Reza Farzipoor Saen

The purpose of this paper is to develop a novel network and dynamic data envelopment analysis (DEA) model for evaluating sustainability of supply chains. In the proposed model…

4577

Abstract

Purpose

The purpose of this paper is to develop a novel network and dynamic data envelopment analysis (DEA) model for evaluating sustainability of supply chains. In the proposed model, all links can be considered in calculation of efficiency score.

Design/methodology/approach

A dynamic DEA model to evaluate sustainable supply chains in which networks have series structure is proposed. Nature of free links is defined and subsequently applied in calculating relative efficiency of supply chains. An additive network DEA model is developed to evaluate sustainability of supply chains in several periods. A case study demonstrates applicability of proposed approach.

Findings

This paper assists managers to identify inefficient supply chains and take proper remedial actions for performance optimization. Besides, overall efficiency scores of supply chains have less fluctuation. By utilizing the proposed model and determining dual-role factors, managers can plan their supply chains properly and more accurately.

Research limitations/implications

In real world, managers face with big data. Therefore, we need to develop an approach to deal with big data.

Practical implications

The proposed model offers useful managerial implications along with means for managers to monitor and measure efficiency of their production processes. The proposed model can be applied in real world problems in which decision makers are faced with multi-stage processes such as supply chains, production systems, etc.

Originality/value

For the first time, the authors present additive model of network-dynamic DEA. For the first time, the authors outline the links in a way that carry-overs of networks are connected in different periods and not in different stages.

Details

Industrial Management & Data Systems, vol. 117 no. 9
Type: Research Article
ISSN: 0263-5577

Keywords

Open Access
Article
Publication date: 17 December 2018

Khavhatondwi Rinah Netshiheni, Mpho Edward Mashau and Afam Israel Obiefuna Jideani

White maize-based porridge is a staple food for about 80 per cent consumers in South Africa and in other sub-Saharan African countries contributing significantly to the diet of…

5049

Abstract

Purpose

White maize-based porridge is a staple food for about 80 per cent consumers in South Africa and in other sub-Saharan African countries contributing significantly to the diet of rural population in developing countries. White maize is deficient in some amino acids and over-dependency on its porridge may lead to high prevalence of malnutrition-related health conditions. Moringa oleifera (MO) and termite (Macrotermes falciger) are known to contain substantial amount of protein. The purpose of this study was to determine the effect of powders from MO leaves and termite on the nutritional and sensory properties of instant maize porridge.

Design/methodology/approach

Inclusion of MO and termite powder in instant maize porridge, using different treatments were considered using a completely randomised design. Factor levels were control (maize flour) cooked, blanched and uncooked MO samples. Data were analysed using SPSS version 23.

Findings

Protein content of fortified instant maize porridge (FMP) significantly increased from 10.0 to 21.2 per cent compared to unfortified porridge, and this could be attributed to the substitution effect, as fresh uncooked MO leaves are reported to be high in protein. Mineral content of FMP was higher in zinc, iron, calcium and magnesium. Calcium values of FMP were higher (276.8 mg/100 g) compared to unfortified porridge (7.1 mg/100 g). Upon the addition of MO leaves and termite powder, the zinc content increased from 3.4 mg/100to 7.6 mg/100 g. Higher iron values (27.9-36.9 mg/100 g) were observed among fortified samples. The sensory result showed that control sample had higher acceptance than the fortified samples (p = 0.02). Sensory analysis showed that among fortified porridges, blanched sample was rated high for colour and texture, cooked sample was higher in taste and uncooked sample was higher for aroma. Control sample had higher acceptance than fortified porridges for taste. The results of this study showed that the addition of MO leaves and termite powder to instant maize porridge has led to a substantial increase in the nutritional value of FMP.

Originality/value

This study was carried out to develop instant maize porridge fortified with MO leaves and termite powder suitable for infants, pregnant mothers and other maize consumers. The author aimed at improving the nutritional content of instant maize porridge by combining it with MO leaves and termite powders. The results showed that the addition of MO leaves and termite powders to instant maize porridge has led to a substantial increase in the nutritional value of FMP. Therefore, powder from MO leaves and termites could be used in complementary foods to increase protein and mineral contents.

Details

Nutrition & Food Science, vol. 49 no. 4
Type: Research Article
ISSN: 0034-6659

Keywords

Open Access
Article
Publication date: 18 April 2018

Nisachon Bubpa and Khanitta Nuntaboot

Due to the increasing population and diverse lifestyles of aging people in Thailand, close examination of their needs and health care problems is required. Availability and…

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Abstract

Purpose

Due to the increasing population and diverse lifestyles of aging people in Thailand, close examination of their needs and health care problems is required. Availability and accessibility of food affects the health and well-being of aging people in the community; therefore, to enhance their quality of life, community nurses and health care personnel must understand the variety of foods in their diet, in order to provide suitable and culturally acceptable nutrition for the elderly. The purpose of this paper is to explore the diversity of foods eaten by older people and the social, economic, environmental, and cultural contexts in which they live in the Northern region of Thailand. This is a part of a larger research project of community food management systems for the care of older people.

Design/methodology/approach

Critical ethnographic research was employed during the study. The data were collected from 41 primary elderly informants and family members. The researcher collected data by conducting individual in-depth interviews, observation of activities, and focus group discussions. The text data were analyzed by content analysis.

Findings

Information gathered from this research reveal nine categories of food which older people are associated with and which include: favorite foods; food provided by others; foodstuffs which should be eaten due to chronic diseases (recommended by doctor); foods to be avoided; snacks; food eaten with others (eating when socializing); food for festivals and cultural traditions; food offered for making merit; and food donated to others.

Originality/value

Utilization of health data, specifically regarding individual dietary diversity, can guide community nurses and health care personnel to provide and promote health that will suit individuals and their families. Community nurses and health care personnel should be aware of the variety of older persons’ diets and the importance of being able to manage and sustain their own nutritional needs. Appropriate nutrition, which is one of the social determinants of health, could improve the quality of the well-being of aging members in the community.

Details

Journal of Health Research, vol. 32 no. 1
Type: Research Article
ISSN: 2586-940X

Keywords

Open Access
Article
Publication date: 31 July 2023

Christiaan Ernst (Riaan) Heyman

This study aims to, firstly, develop a red flag checklist for cryptocurrency Ponzi schemes and, secondly, to test this red flag checklist against publicly available marketing…

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Abstract

Purpose

This study aims to, firstly, develop a red flag checklist for cryptocurrency Ponzi schemes and, secondly, to test this red flag checklist against publicly available marketing material for Mirror Trading International (MTI). The red flag checklist test seeks to establish if MTI’s marketing material posted on YouTube® (in the form of a live video presentation) exhibits any of the red flags from the checklist.

Design/methodology/approach

The study uses a structured literature review and qualitative analysis of red flags for Ponzi and cryptocurrency Ponzi schemes.

Findings

A research lacuna was discovered with regard to cryptocurrency Ponzi scheme red flags. By means of a structured literature review, journal papers were identified that listed and discussed Ponzi scheme red flags. The red flags from the identified journal papers were subsequently used in a qualitative analysis. The analyses and syntheses resulted in the development of a red flag checklist for cryptocurrency Ponzi schemes, with five red flag categories, containing 18 associated red flags. The red flag checklist was then tested against MTI’s marketing material (a transcription of a live YouTube presentation). The test resulted in MTI’s marketing material exhibiting 88% of the red flags contained within the checklist.

Research limitations/implications

The inherent limitations in the design of using a structured literature review and the lack of research regarding the cryptocurrency Ponzi scheme red flags.

Practical implications

The study provides a red flag checklist for cryptocurrency Ponzi schemes. The red flag checklist can be applied to a cryptocurrency investment scheme’s marketing material to establish if it exhibits any of these red flags.

Social implications

The red flag checklist can be applied to a cryptocurrency investment scheme’s marketing material to establish if it exhibits any of these red flags.

Originality/value

The study provides a red flag checklist for cryptocurrency Ponzi schemes.

Details

Journal of Financial Crime, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 1359-0790

Keywords

Open Access
Article
Publication date: 17 January 2023

Xing Ying

The purpose of this paper investigates dynamic ease distributions of clothes at bust and waist lines with different body surface angle by using a Qualisys three-dimensional motion…

Abstract

Purpose

The purpose of this paper investigates dynamic ease distributions of clothes at bust and waist lines with different body surface angle by using a Qualisys three-dimensional motion capture system (3DMCS).

Design/methodology/approach

The current method first obtain the specific markers of participants and their clothes along the bust and waist lines through 3DMCS, then using the least square method and four piecewise polynomial fitting participants and their clothes' bust and waist curves. The coordinates of the markers were tracked by the 3DMCS, while the participants under different body surface angle walked on a treadmill calculated the distances of markers coordinates to the participants' bust and waist curves. Finally, the data of samples were analyzed. It was found that the dynamic ease distributions showed different patterns at different body surface angle.

Findings

The results revealed the bust convex angle is 26.53 degrees (Specification:X3) and back slope angle is 13.96 degrees (Specification: Y1), the fluctuation of participant ease distributions on bust section was most obvious, and the maximum fluctuation value was ±20 mm and ±25 mm. The ease distributions of participant waist section fluctuated most obviously when the bust convex angle is 28.10 degrees (Specification: X5) and the back slope angle is 13.96 degrees (Specification: Y1), and the maximum fluctuation was ±30 mm and ±20 mm. The bust convex angle has the greatest influence on 1# garment, and the back slope angle has the greatest influence on 2# garment.

Originality/value

Currently, there is little information in the literature about dynamic ease distributions of garment on a different body types. This paper takes different body surface angles as the research objects to analyze the ease distributions of different clothes, the conclusion can provide reference data for 3D garment modeling and improve the authenticity of virtual garment fitting.

Details

International Journal of Clothing Science and Technology, vol. 35 no. 2
Type: Research Article
ISSN: 0955-6222

Keywords

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