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The purpose of this paper is to explore and evaluate the performance comparison of carbon nanotubes (CNT) and nickel silicide (NiSi) nanowires interconnects as prospective alternatives to copper wire interconnects.

The increasing resistivity of the copper wire with scaling and rising demands on current density drives the need for identifying new wiring solutions. This paper explores the various alternatives to copper. The metallic bundle CNTs and NiSi nanowires are promising candidates that can potentially address the challenges faced by copper. This paper analyzes various electrical models of carbon nanotube and recently introduced novel interconnect solution using NiSi nanowires.

The theoretical studies proves CNTs and NiSi nanowires to be better alternatives against copper on the ground of performance parameters, such as effective current density, delay and power consumption. NiSi nanowire provides highest propagation speed for short wire length, and copper is the best for intermediate wire length, while bundle CNTs is faster for long wire length. NiSi nanowire has lowest power consumption than copper and CNTs.

This paper investigates, assess and compares the performance of carbon nanotubes (CNT) and NiSi nanowires interconnects as prospective alternatives to copper wire interconnects in future VLSI chips.

Advanced discrete wiring systems are being developed to produce state‐of‐the‐art circuit boards for packaging the next generation electronic systems. The demands placed on electronic interconnection by very high speed VLSI devices have created a need for large circuit boards that will support high interconnection density. At the same time these circuit boards must maintain the necessary transmission line parameters to transport signals with sub‐nanosecond rise times and retain signal fidelity.

This paper aims to present an innovative example of a master for teleoperation capable of moving in six degrees of freedom and of providing a force and torque feedback on the operator's hand.

After a brief overview of what the state of the art in teleoperation has to offer, the paper outlines the choice of an innovative structure in terms of both geometry and components, pointing out its main characteristics compared with traditional interfaces.

The master for teleoperation WiRo‐6.3 has been designed and constructed and is fully operative, thanks to the following theoretical analyses: positional and orientation workspace(s), forward and inverse kinematics, statics, overall control strategies. The mechanical details are also presented.

The WiRo‐6.3 is suitable to those applications in which human command is necessary but potentially harmful, and where a force‐feedback interface is preferred to obtain better control over the task to be accomplished. A possible field of interest could be the control of robot arms in dangerous environments, nuclear applications, uncomfortable climates, remote operations.

The master WiRo‐6.3 is a novel device both for its geometric structure and for the wire actuation choice; those characteristics provide very interesting results in terms of dexterity, force feedback performance and overall user‐friendliness.

Thermal flow sensors with a wide dynamic range are at present not available in spite of the large demand which exists for such sensors in practical fluid flow measurements. In this paper, it is shown that the velocity range of a “time‐of‐flight” thermal flowmeter for slowly changing flows can be increased by using wires (or other heating/sensing elements) with large thermal inertia (time constant) and heating the sending wire with a continuous sinusoidal current, instead of discrete, very short, square‐wave pulses as in the usual pulsed‐wire anemometer. The device described here uses two parallel wires of 12.5μm diameter and its usable speed range is 0.05 to 25m/s. Although the present thermal flowmeter can be applied as a point measurement device, the main applications are in pipe flow, especially at very low flow rates. The high sensitivity at low flow rates makes the device especially suitable for this purpose.

Increasing speeds combined with the level of integration that can be obtained with advanced IC technology has dramatically changed the interconnection requirements for high performance electronic systems. With much of today's circuitry being implemented in custom silicon, IC technology has allowed both a dramatic reduction in size and a tremendous increase in performance. However, in terms of the interconnection problem, the by‐product of advanced IC technology is a new generation of IC s that often require several hundred I/OS, exhibit rise times of 150 ps to 300 ps, and dissipate several watts per device. As demanding requirements are placed upon circuit boards, the complexity of the design task increases dramatically, since a working solution must simultaneously address interconnection density, signal integrity and thermal performance. This paper examines embedded discrete wiring technology as a high density solution that meets the requirements necessary for transporting high speed digital signals.

The purpose of this paper is to establish the relevant quantitative methods for the investigation of the eddy and meridian fields of the general systemic yoyo model.

On the basis of established systemic yoyo models for electrons and positrons, flows of negative yoyo charges are naturally identified with electric currents so that use of the well‐developed quantitative methods can be made in electromagnetic theory to investigate the relationship between eddy and meridian fields of the general systemic yoyo model.

A general method is established on how to compute the intensity of the magnetic yoyo fields accompanying a moving yoyo charge or a canal of yoyo flow. A quantitative representation for magnetic yoyo fields is provided. And, the well‐known Ampere's law of electricity is generalized to the case of general yoyo flows.

By establishing an adequate quantitative method for the general systemic yoyo model, it should be possible to know more about the yoyo model and gain additional potential to successfully employ this model in various areas of learning, as proposed by Lin.

A study was undertaken to evaluate the thermosonic gold‐wire bonding capability to Ti‐Pd‐Cu‐Ni‐Au thin film metallisation on newly developed polymer hybrid integrated circuits (POLYHICs). (The POLYHIC technology incorporates alternating layers of polymer and metal added to conventional Hybrid Integrated Circuits which provide for increased interconnection density.) Destructive wire‐pull strengths were measured as a function of varying wire‐bonding machine operating parameters of wedge bond force, wedge bond time, temperature, and ultrasonic energy. All data were evaluated and compared with wire bonding under similar conditions to thin film circuits on Al2O3 ceramic. The results for wedge‐bond associated failures indicated that machine operating parameters of wedge bond force, time and ultrasonic energy similarly affected the average wire‐pull strength for both the ceramic and POLYHIC circuits. Pull strengths for equivalent metallisation schemes and bonding parameters were generally slightly higher and more tightly distributed for bonds made to metal films on ceramic. A strong correlation was found to exist between wire‐pull strengths and surface topography (as measured by a profilometer technique) of the thin film metallisation for the POLYHICs which had both smooth and rough metallisation surfaces for metal films on top of the polymer. The results indicated that rough metallisation bonded more easily and yielded much higher wire‐pull strengths. Also, rougher films were shown to effectively increase the parameter‐operating windows for producing reliable wire bonds. A semi‐quantitative analysis was developed to help explain this correlation. Surface topography effects were also found to be a key factor when evaluating wire bondability as a function of substrate bonding temperature. Wedge‐bond strength was essentially independent of temperature for bonds made to rougher metallisation while a strong temperature dependency was found when wire bonds were made to smoother films.

Advantages claimed by the authors for this type of magnetic sensor for embedding in robot fingers are that it is independent of the rate of approach, it is reliable in hostile environments, and it yields output easily processed by digital electronics.

Computer users usually type at their own personal computer keyboards and look at their own display screens but, on occasion, every user needs to access a printer, or some other resource, even another computer.

This paper aims to investigate the equivalent relationship of accelerated corrosion and compilation method of environmental spectrum of corroded steel wires.

Based on Faraday’s law and the principle of equivalent corrosion damage, the method for compiling the equivalent environmental spectrum of accelerated corrosion was established. The equivalent conversion relationship of steel wire under different temperature and pH conditions and the relationship between corrosion factors and corrosion rate through the electrochemical tests were proposed.

The high temperature had a greater impact on the equivalent conversion coefficient than the low temperature. When the temperature increased from 15°C to 60°C, the equivalent conversion coefficient increased by about 3–6 times. The weak acid had a greater impact on equivalent conversion coefficient compared with strong acid. The effect of temperature on the equivalent conversion coefficient was much greater than that of pH value.

The compilation method of corrosion environment spectrum of bridge operation and the calculation method of corrosion depth proposed in this paper were reasonable, and the corrosion depth and service life of cable components could be predicted.