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Long life and high hydrogen sensitivity are the crucial performance parameters for an optical fiber hydrogen sensing membrane, and these are the fundamental areas of study for an optical fiber hydrogen sensor. Considering that a traditional optical fiber hydrogen sensor based on pure palladium cannot meet the expectations for long life and rapid sensitivity simultaneously, the experiment in this paper designed a kind of reflective optical fiber bundle hydrogen gas sensor based on a Pd_0.75–Ag_0.25 alloy to achieve a hydrogen sensing system. This paper aims to discuss the issues with this system.

A reflective optical fiber bundle hydrogen sensor was made up of an optical fiber bundle and a Pd_0.75–Ag_0.25 alloy hydrogen membrane. A combination of optical fiber light intensity measurements and the reference calculation method were used to extract the hydrogen concentration information from within the optical fiber, and the relationship between the hydrogen concentration changes and the reflective light intensity in the optical fiber was established.

The reflective optical fiber bundle hydrogen gas sensor based on a Pd–Ag alloy membrane was shown to provide an effective way to detect hydrogen concentrations. The experimental results showed that a 20-30-nm-thick Pd_0.75–Ag_0.25 alloy membrane could reach high hydrogen absorption and sensitivity. Key preparation parameters which included sputtering time and substrate temperature were used to prepare the hydrogen membrane during the DC sputtering process, and the reflectivity of the Pd–Ag alloy membrane was enough to meet the requirements of long life and high hydrogen sensitivity for the optical fiber hydrogen sensor.

This paper seeks to establish a foundation for optimizing and testing the performance of the Pd–Ag alloy hydrogen sensing membrane for an optical fiber bundle hydrogen sensor. To this end, the optimal thickness and key preparation parameters for the Pd–Ag alloy hydrogen sensing membrane were discussed. The results of this research have proved that the reflective optical fiber hydrogen sensor based on a Pd_0.75–Ag_0.25 alloy is an effective approach and precisely enough for hydrogen gas monitoring in practical engineering measurements.

On 20 April ISHM‐Benelux held its 1988 Spring meeting at the Grand Hotel Heerlen. This meeting was totally devoted to implantable devices, in particular to the technologies used for these high reliability, extremely demanding devices. For this meeting ISHM‐Benelux was the guest of the Kerkrade facility of Medtronic. Medtronic (headquartered in Minneapolis, USA) is the world's leading manufacturer of implantable electronic devices. Apart from the assembly of pacemakers and heart‐wires, the Kerkrade facility acts as a manufacturing technology centre for Medtronic's European facilities.

Dates: 29–31 May 1991 Venue: De Doelen Conference Centre, Rotterdam, The Netherlands The Benelux Chapter of the International Society for Hybrid Microelectronics will be organising the 8th European Microelectronics Conference. The event will take place at ‘De Doelen’, Rotterdam, The Netherlands, from 29 to 31 May 1991.

The Benelux chapter has made a habit of organising meetings with a scientific and commercial accent more or less alternately. This approach has proven to be successful in the past three years. The 1986 Autumn meeting will be another display meeting. A number of papers will be presented by suppliers of materials and equipment for the hybrid and surface mounting industry. In a 300 m2 exhibition room about 25 companies will display their products. The programme of the day leaves ample opportunity for meeting colleagues and suppliers. The meeting will be held in the ‘Jaarbeurs Vergadercentrum’ in Utrecht on 16 October from 9.30–17.00. The annual ISHM‐Benelux general membership meeting will precede the lectures.

ISHM‐Benelux held its 1987 Autumn Conference on 29 October, at the Antwerp Crest Hotel. This one‐day meeting focused on applications of hybrid circuit technology in various fields of electronic and related industries.

The International Society for Hybrid Microelectronics invites the submission of technical papers for presentation at the above event. All original unpublished papers on microelectronics related topics are welcomed.

Electroloid Limited, the Aylesbury based manufacturer of metal finishing plant and equipment, have announced two new appointments to their sales and marketing team.

Two die attach adhesive products, manufactured by Furane Products Co., claim to meet the military specification for epoxy electronic adhesives (MIL‐STD‐883C, Method 5011) without exception. The products are EPIBOND 7002 which is a thermally conductive adhesive and EPIBOND 7200, an electrically and thermally conductive die attach adhesive. Both are 100% solids and contain no solvents or diluents. Consequently, the likelihood of outgassing and void formation is greatly reduced. Both are extremely high purity systems, and have a hot die‐shear strength of over 6,000 N/M2 at 150°C. Both materials are screen printable and undergo virtually no bleed‐out during processing.

Corrosion of steel plates of hulls and superstructures and in the tanks of oil tankers is one of the major problems facing the shipping industry. Epoxy resin‐based coatings are increasingly being used to counter corrosion in shipping, two recent examples being the hull coatings of the S.S. Oriana and the S.S. Canberra. The special requirements of the automobile industry for improved primers can also be met with the new formulations that are now possible. This article reviews some of the results obtained from the new formulations based on Epikote resins.

This study aims to investigate the options for additive rapid prototyping methods in microelectromechanical systems (MEMS) technology. Additive rapid prototyping technologies, such as stereolithography (SLA), fused deposition modeling (FDM) and selective laser sintering (SLS), all commonly known as three-dimensional (3D) printing methods, are reviewed and compared with the resolution requirements of the traditional MEMS fabrication methods.

In the 3D print approach, the entire assembly, parts and prototypes are built using various plastic and metal materials directly from the software file input, completely bypassing any additional processing steps. The review highlights their potential place in the overall process flow to reduce the complexity of traditional microfabrication and long processing cycles needed to test multiple prototypes before the final design is set.

Additive manufacturing (AM) is a promising manufacturing technique in micro-device technology.

In the current state of 3D printing, microfluidic and lab-on-a-chip devices for fluid handling and manipulation appear to be the most compatible with the 3D print methods, given their fairly coarse minimum feature size of 50-500 μm. Future directions in the 3D materials and method development are identified, such as adhesion and material compatibility studies of the 3D print materials, wafer-level printing and conductive materials development. One of the most important goals should be the drive toward finer resolution and layer thickness (1-10 μm) to stimulate the use of the 3D printing in a wider array of MEMS devices.

The review combines two discrete disciplines, microfabrication and AM, and shows how microfabrication and micro-device commercialization may benefit from employing methods developed by the AM community.