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The purpose of this paper is to compare the single-sided packaging structure and double-sided packaging structure of high-power module and study the overall heat dissipation performance and reliability of the module.

In this paper, the single-sided packaging structure and double-sided packaging structure of power module are designed based on Wolfspeed products. This paper is analyzed by finite element method. First, the heat dissipation performance of single-sided packaging structure and double-sided packaging structure is analyzed; second, the deformation and stress of single-sided packaging structure and double-sided packaging structure are compared and analyzed; and finally, the cumulative plastic deformation of single-sided packaging and double-sided packaging structures are compared and analyzed, and the fatigue life of the structure is calculated based on the plastic deformation.

In the heat transfer simulation, under the same power input, the heat dissipation performance of single-sided packaging structure is not as good as that of double-sided packaging structure. Under the reliability simulation of the same temperature cycle standard, the maximum equivalent stress of single-sided packaging structure is lower than that of double-sided packaging structure, but the fatigue life prediction based on plastic strain shows that the fatigue life of double-sided packaging structure is not different from that of single-sided packaging structure.

This paper creatively simulates the thermal characteristics and reliability of single-sided packaging structure and double-sided packaging structure and proves the advantages of double-sided packaging structure compared with single-sided packaging structure from the aspects of heat transfer performance and reliability.

As the solution to improve fatigue life and mechanical reliability of packaging structure, the material selection in PCB stack-up and partitioning design on PCB to eliminate the electromagnetic interference by keeping all circuit functions separate are suggested to be optimized from the mechanical stress point of view.

The present paper investigated the effect of RO4350B and RT5880 printed circuit board (PCB) laminates on fatigue life of the QFN (quad flat no-lead) packaging structure for high-frequency applications. During accelerated thermal cycling between −50 °C and 100 °C, the mismatched coefficients of thermal expansion (CTE) between packaging and PCB materials, initial PCB warping deformation and locally concentrated stress states significantly affected the fatigue life of the packaging structure. The intermetallics layer and mechanical strength of solder joints were examined to ensure the satisfactorily soldering quality prior to the thermal cycling process. The failure mechanism was investigated by the metallographic observations using a scanning electron microscope.

Typical fatigue behavior was revealed by grain coarsening due to cyclic stress, while at critical locations of packaging structures, the crack propagations were confirmed to be accompanied with coarsened grains by dye penetration tests. It is confirmed that the cyclic stress induced fatigue deformation is dominant in the deformation history of both PCB laminates. Due to the greater CTE differences in the RT5880 PCB laminate with those of the packaging materials, the thermally induced strains among different layered materials were more mismatched and led to the initiation and propagation of fatigue cracks in solder joints subjected to more severe stress states.

In addition to the electrical insulation and thermal dissipation, electronic packaging structures play a key role in mechanical connections between IC chips and PCB.

This paper aims to present an integrated management model for packaging design.

This model is the result of research of the concepts of packaging, logistics and “packaging logistics”. With this approach in mind, the design and development of packaging are structured on four basic corner‐stones, i.e. the definition and understanding of design requirements (logistics, marketing and environmental aspects), the definition of an appropriate organizational structure, the application of “best practices”, and, finally, establishing a control system.

It was found that the management model developed provides companies with a useful quantitative tool to find the “trade‐off” between the logistics costs reduction and the differentiation capacity linked to packaging.

The model proposed is designed to fill a gap in the measurement systems for making an evaluation of the detailed impact on the overall operation of the supply chain in certain packaging design decisions.

The purpose of this paper is to examine the aspects of internal and external transformation that take place in each company along the supply chain when a “sustainable packaging logistics” approach is implemented. Before this can be achieved, it is necessary to identify and characterise the principal cornerstones and stages associated with this implementation.

In the paper the combination of “case study” and “action research” techniques have been chosen. It has been analysed the implementation of “sustainable packaging logistics” in the supply chain of Mercadona (one of the largest retailers in Spain), paying special attention to the implementation and evolution in one of its main food suppliers.

To adopt a “Sustainable Packaging Logistics” approach allows for a proactive integration of the efficiency and sustainability in supply chains. The proposal to implement “sustainable packaging logistics”, based on four cornerstones and three stages of evolution is particularly significant, while contributing to improved competitiveness. This implementation constitutes an evolutionary process which is conditioned by how each area, department or company along the supply chain interpret and assess different packaging features over time.

The model is based on a single supply chain analysis.

This paper may be of interest both for researchers and professionals, because the model can aid companies in improving their global vision of product and packaging design in order to jointly increase sustainability and efficiency in the supply chain.

The purpose of this paper is to have two main research goals: to identify and analyse the elements of dairy product packaging which influence customer purchase decisions, according to these elements’ compliance with their expectations; and to analyse the relations between final customers’ expectations towards elements of dairy product packaging and their three chosen demographic characteristics including age, gender and level of education.

The paper is theoretical and empirical in nature. In the theoretical part, the cognitive-critical analysis of the world’s literature on marketing and marketing management was applied. In the empirical part the following research methods were used: questionnaire survey for gathering primary data and statistical analysis (factor analysis and the Kruskal-Wallis independence test) for the analysis of the primary data and for statistical reasoning, which formed the basis for the final conclusions.

On the basis of the research, one can conclude that the analysed demographic characteristics of the respondents (age, gender, level of education) influence the structure of their expectations towards dairy product packaging, thereby determining their purchase decisions. The dependence does not exist only between the growth of pro-environmental expectations and the increase of the respondents’ level of education. However, this does not change the fact that level of education correlates with expectations related to other features of dairy product packaging, thus determining their structure.

The original contribution of this paper to theory is the identification of Polish customers’ expectations towards elements of dairy product packaging and the description of their structural diversity, depending on the recipients’ demographic characteristics in terms of their purchase decisions taken thanks to the fact that their expectations concerning the features of packaging are fulfilled. This knowledge can make it easier to effectively manage dairy product packaging as a tool of influencing on customers and properly shape their marketing potential by offerors. It determines the applicability of the research results and the conclusions drawn from them.

The purpose of this paper is to examine the influence of eco-designed packaging on consumers’ responses. It defines the concept of eco-designed packaging, and proposes a consumer-led taxonomy of its cues. Attitudinal and behavioral, positive and negative responses triggered by the perception of these signals are analyzed.

Results were reached through qualitative methods. A phenomenological approach consisting of eight in-depth interviews has been followed by a series of ten Zaltman Metaphor Elicitation Technique (ZMET) interviews. The synergy of these two methods is underlined.

The complexity of packaging ecological cues perception is outlined by expressing the differences in the nature of these cues. A taxonomy is then presented; ecological cues fall into three categories: structural cues, graphical/iconic cues and informational cues. Finally, consumers’ responses to the perception of eco-designed packaging are presented and perceived benefits and perceived sacrifices are revealed.

Packaging is of great importance in consumers’ purchase decision process, especially in situations of temporal pressure and hyperchoice environments. Since consumers take more and more into account the ethicality of the brand in their consumption, the understanding of their attitudes and behaviors toward eco-designed packaging may enable brands to build a competitive advantage.

The literature review reveals that there is no similar research available. The use of two qualitative methods enables to understand consumers’ deep-seated motivations, attitudes and behaviors toward eco-designed packaging. The results of this study can also be used by advertisers, for social marketing campaigns, to encourage consumers to reduce the global ecological footprint of packaging.

A new lass of sensors for thermal imaging and detection in the infra‐red band is emerging which exploits the pyroelectric effect in ferroelectric materials. These sensors, which are fabricated in the form of large linear or two‐dimensional arrays of detectors interfaced to a silicon readout circuit, do not require cooling for their operation, in contrast to the photon detection based thermal imagers. They thus have the potential for low cost thermal detection and imaging. This paper examines the design of these arrays and the technologies employed in their fabrication, with particular attention to their specialised packaging requirements, by reference to a range of linear and two‐dimensional pyroelectric array devices that have been fabricated in this laboratory.

This paper focuses on the fluid-structure interaction (FSI) analysis of moisture induced stress for the flip chip ball grid array (FCBGA) package with hydrophobic and hydrophilic materials during the reflow soldering process. The purpose of this paper is to analyze the influence of moisture concentration and FCBGA with hydrophobic material on induced pressure and stress in the package at varies times.

The present study analyzed the warpage deformation during the reflow process via visual inspection machine (complied to Joint Electron Device Engineering Council standard) and FSI simulation by using ANSYS/FLUENT package. The direct concentration approach is used to model moisture diffusion and ANSYS is used to predict the Von-Misses stress. Models of Test Vehicle 1 (similar to Xie et al., 2009b) and Test Vehicle 2 (FCBGA package) with the combination of hydrophobic and hydrophilic materials are performed. The simulation for different moisture concentrations with reflows process time has been conducted.

The results from the mechanical reliability study indicate that the FSI analysis is found to be in good agreement with the published study and acceptable agreement with the experimental result. The maximum Von-Misses stress induced by the moisture significantly increased on FCBGA with hydrophobic material compared to FCBGA with a hydrophilic material. The presence of hydrophobic material that hinders the moisture desorption process. The analysis also illustrated the moisture could very possibly reside in electronic packaging and developed beyond saturated vapor into superheated vapor or compressed liquid, which exposed electronic packaging to higher stresses.

The findings provide valuable guidelines and references to engineers and packaging designers during the reflow soldering process in the microelectronics industry.

Studies on the influence of moisture concentration and hydrophobic material are still limited and studies on FCBGA package warpage under reflow process involving the effect of hydrophobic and hydrophilic materials are rarely reported. Thus, this study is important to effectively bridge the research gap and yield appropriate guidelines in the microelectronics industry.

Concerning the radiation effects on the three-dimensional (3D) packaging in space environment, this study aims to investigate the influence of the total dose effect on the transmission characteristics of high-frequency electrical signals using experimental and simulation methods.

This work carries out the irradiation test of the specimens and measures their S21 parameters before and after irradiation. A simulation model describing the total dose effect was built based on the experimental test results. And, the radiation hardening design is evaluated by the simulation method.

The experimental results demonstrate that the S21 curve of the interconnection decreases with the increase of the irradiation dose, indicating that the total dose effect leads to the decline of its signal transmission characteristics. According to the simulation results, decreasing the height of the through silicon via (TSV), increasing the radius of the TSV, reducing the length of Si and increasing the number of grounded through silicon via have positive effects on improving the radiation resistance of the interconnection structure.

This work investigates the effect of radiation on the transmission characteristics of interconnection structures for 3D packaging and proposes the hardening design methods. It is meaningful for improving the reliability of 3D packaging in space applications.

The primary objective of this study is characterizing the anisotropic mechanical properties of corrugated cardboard and simultaneously simulating its drop cushioning dynamic effects under various drop conditions.

Static and dynamic tests were conducted on corrugated cardboard to obtain adequate experimental data in different directions. An effective anisotropic constitutive model is introduced by developing the honeycomb materials model in ANSYS LS-Dyna, and an effective approach is established toward effectively determining the material parameters from the test data obtained. The model is validated by comparing simulation results with experimental data from five drop conditions, including bottom drop, front drop, side drop, 30° side drop and edge drop. Additionally, simulations are conducted to study the cushioning performance of the packaging by dropping the corrugated cardboard at different heights.

The study establishes a fast and effective approach to simulating the drop cushioning performance of corrugated cardboard under various drop conditions, which demonstrates good agreement with experimental data.

This approach is of value for packaging protection and provides guidance for stacking of packaging during transportation.