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This paper aims to study the cross-modal correspondence between a visual stimulus (i.e. glossiness), haptic perception and consumers’ reactions (internal responses and behavioral intentions).

Using an experimental design, three experimental studies have been conducted to test the effect of a glossy (versus matte) packaging upon the perception of haptic features of a packaging (roughness, thickness and lightness), internal reactions (perceived product quality and product attractiveness) and behavioral intentions (purchase intention and willingness to pay).

This paper evidences the significant impact that glossiness bears on the haptic perception of a packaging material as well as upon internal reactions and behavioral intentions. A new conceptual framework combining the SOR model and the cross-modal correspondences is validated.

The results encourage further research to explore the wide range of potential cross-modal correspondences between visual stimuli and haptic perception.

The results highlight the critical influence of visual cues for managers, especially for online shopping or advertising. Even if consumers cannot touch the product, it is possible to induce haptic perception through visual cues and to influence the internal reactions and behavioral intentions.

This research demonstrates that the packaging texture and weight can be visually induced through glossiness.

The purpose of this study is to develop active package films using clove essential oil (CEO) and biodegradable polybutylene adipate terephthalate (PBAT) with varying weight percentages of SiO₂ nanoparticles (SiO₂NPs), as well as to investigate the mechanical, barrier, thermal, optical, surface hydrophobicity and antibacterial properties of PBAT incorporated with CEO as a natural plasticizer and SiO₂NPs as a nanofiller.

PBAT-based bio-composites films were fabricated with different weight percentage of CEO (5% and 10%) and nanosilica (1% and 3%) by solution casting method. The packaging performance was investigated using universal testing machine, spectrophotometer, contact angle goniometer, oxygen and water vapour permeability tester. The antibacterial properties of PBAT-based nanocomposite and composite films were investigated using the ISO 22196 by zone of inhibition method.

The mechanical results exhibited that the addition of 10 Wt.% of CEO into PBAT increases the percentage of elongation, whereas, the addition of 3 Wt.% of SiO2NPs increases the tensile strength of the composite film. The presence of CEO in PBAT exhibits a good barrier against water permeability and SiO2NPs in the PBAT matrix help to reduce the opacity and hydrophobicity. The antimicrobial and thermal results revealed that the inclusion of 10 Wt.% of CEO and 3 Wt.% of SiO₂NPs into PBAT polymer improved antimicrobial and thermal resistance properties.

A new PBAT-based active packaging film developed using natural plasticizers CEO and nanofiller SiO₂ with a wide range of applications in the active food packaging applications. Moreover, they have good surface hydrophobicity, thermal stability, mechanical, barrier and antibacterial properties.

Because they offer many properties favourable for IC package construction, ceramics have been in widespread use as an electronic package material since the early 1960s. In recent years, with trends towards higher speed semiconductors generating up to 30‐40 watts power, packaging materials must possess excellent thermal, electrical and mechanical properties. Aluminium nitride, with a thermal conductivity of 170 W/m.K., high fracture strength and a thermal coefficient of expansion match with silicon, has been used to manufacture multilayer LGA (land grid array) packages for high performance applications. A 725 AIN LGA has been manufactured and its performance characteristics have been compared with those of an alumina (with copper/tungsten slug) packaging alternative. Because of the high thermal conductivity of aluminium nitride, all designs can be made in a cavity‐up configuration, resulting in significant package body size reduction. The area under the cavity can be used for increasing I/O number and a ground plane can be inserted under the cavity, reducing simultaneous switching noise. Aluminium nitride is particularly beneficial for flip‐chip interconnection. Its close TCE match to silicon eliminates the stress reduction requirement for die underfill.

This review paper aims to provide a better understanding of formulation and processing of anisotropic conductive adhesive film (ACF) material and to summarize the significant research and development work for the mechanical properties of ACF material and joints, which helps to the development and application of ACF joints with better reliability in microelectronic packaging systems.

The ACF material was cured at high temperature of 190°C, and the cured ACF was tested by conducting the tensile experiments with uniaxial and cyclic loads. The ACF joint was obtained with process of pre-bonding and final bonding. The impact tests and shear tests of ACF joints were completed with different aging conditions such as high temperature, thermal cycling and hygrothermal aging.

The cured ACF exhibited unique time-, temperature- and loading rate-dependent behaviors and a strong memory of loading history. Prior stress cycling with higher mean stress or stress amplitude restrained the ratcheting strain in subsequent cycling with lower mean stress or stress amplitude. The impact strength and adhesive strength of ACF joints increased with increase of bonding temperature, but they decreased with increase of environment temperature. The adhesive strength and life of ACF joints decreased with hygrothermal aging, whereas increased firstly and then decreased with thermal cycling.

This study is to review the recent investigations on the mechanical properties of ACF material and joints in microelectronic packaging applications.

The purpose of this article is twofold. First, this study characterises the current state of the bio-packaging market's development. Second, it identifies key factors influencing and possible scenarios of the bio-packaging market transition to increase the market share of compostable packaging.

The results of 29 in-depth interviews (IDIs) with representatives of the key groups of bio-packaging supply chains' (SCs') stakeholders were the input for the consideration of the research problem.

The main economic, legal, social and technological enablers and barriers to the bio-packaging regime transition are recognised, and their impact at the market level is explained. The authors recognised the hybrid transition scenario towards an increase in the market share of compostable packaging related to the three traditional pathways of transformation, reconfiguration and technological substitution.

This study contributes to a better understanding of the socio-technical system theory by examining interdependencies between landscape (external environment), market regime (bio-packaging market) and niche innovations (compostable packaging) as well as system transition pathways. The findings and conclusions on bio-packaging market developments can be important lessons learnt to be applied in different countries due to the same current development stage of the compostable packaging lifecycle worldwide.

Utilizing data drawn from 18 in-depth case studies the authors explore in detail the factors shaping employment in a diverse range of Irish small- and medium-sized enterprises. Existing theory in HRM is deemed inadequate in capturing the complexity of HRM in SMEs especially as it treats organizations as hermetically sealed entities. In an effort to animate the criticism directed at normative models of HRM the authors use a conceptual framework with an emergent, open systems theoretical proposition to examine the parameters, dynamics and determining factors of HRM at each of the case study companies. The results show that the notion of a normative HRM model was not coherent in terms of actual practices but rather reactive, and emergent HRM-related processes were often imposed to meet legislative requirements or to reinforce owner–manager legitimacy and control. The authors conclude that an appreciation of the interaction between structural factors both inside and outside the immediate work milieu is crucial if the heterogeneity of HRM in SMEs is to be adequately accommodated and understood.

This explorative paper aims to identify the dimensions of recalled consumption experiences involving packaging by means of interpretive analysis. Scholarly interest towards experiential aspects of consumption started in the beginning of 1980s.

The memory-based research materials were collected from 97 Finnish consumers within a two-day weblog session. The consumers were asked to describe personally meaningful packaging-related experiences and to submit a photograph of the relevant packages. The analysis focused on common dimensions associated with the described meaningful experiences.

The authors built a conceptual framework incorporating “nostalgic” and “accessible” experiences. The dimensions of nostalgic experience, which although anchored in the present can be re-lived only in the memory, include the involvement of key persons; the places and physical spaces in which the experience happened; and actions or practices involving packaging during an experience. Accessible experiences include the following dimensions: lasting product and packaging encounters; individual personal experiences; culturally meaningful celebrations and rituals; and packaging that appeals to the senses. It is proposed that meaningful consumption experiences involving packaging may reflect both nostalgic and accessible dimensions.

Although there is a growing interest towards consumers’ role in the packaging value chain, their packaging experiences are addressed rarely. It is proposed that the consumption experiences involving packaging are a mix of nostalgic and accessible dimensions.

The choice of high pin count ASIC packages has a major impact on the total cost and performance of the whole packaging system. Six different types of ASIC packages have been compared with respect to production aspects, availability, reliability, thermal and electrical properties and cost. Recommendations for the proper choice of packages for different types of applications are given. All packages have been directly assembled to PWBs in order to study problems with handling, solder process, testing and repairability. Some of the assembled packages have been temperature cycled in order to test the solder joint reliability. The pin grid array packages are the most frequently used high pin count packages today. However, they are expensive and through‐hole mounting reduces the routing capability of the board. Pad area array packages are a hermetic alternative with a lower price for the package as well as very good thermal and electrical properties, but they need to be mounted on expensive PWBs. Another surface mountable package which is hermetic is the ceramic leaded chip carrier with fine lead pitch. This package is even more expensive than the pin grid array package and is difficult to handle. In the future, non‐hermetic alternatives will probably predominate. Plastic quad flat pack and TapePak can be used below 160–180 leads, while direct assembled TAB would be the best alternative for very high pin counts. Before one can use non‐hermetic packages in telecom products, a large qualification programme must be performed to evaluate the long‐term reliability.

The purpose of this paper is to review the recent trends in the development of active packaging (AP) for foods.

The most up‐to‐date and pertinent studies within the literature have been included and summated in this paper.

Fresh foods are widely consumed and are becoming a major component of the international food market. During the last decades, the social and scientific modernization, the boom in customer's needs and demands, along with the major changes in the way food products are manufactured, distributed and retailed, led to the development of alternative or novel methods for the production and preservation of food products. This review will present the most comprehensive and current overview of the widely available, scattered information about the different AP technologies for the control of various critical parameters responsible for the quality and shelf life of fresh foods with an interest to stimulate further research to optimize different quality parameters.

This paper offers a holistic view that would guide a reader to identify the recent developments in the field of AP.

This paper seeks to review recent advances in wire bonding, flip chip and lead‐free solder for advanced microelectronics packaging.

Of the 91 journal papers, 59 were published in 2005‐2007 and topics related to wire bonding, flip chip and lead‐free solder for advanced microelectronics packaging are reviewed.

Research on advanced wire bonding is continuously performed for advanced and complex applications such as stacked‐dies wire bonding, wire bonding of low‐k ultra‐fine‐pitch devices, and copper wire bonding. Owing to its many advantages, flip chip using adhesive has gained more popularity. Research on the reliability of lead‐free solder joints is being conducted world‐wide. The new challenges, solutions and new developments are discussed in this paper.

Because of page limitation of this review paper and the large number of the journal papers available, only a brief review is conducted. Further reading is needed for more details.

This review paper attempts to provide introduction to recent developments and the trends in terms of the topics for advanced microelectronics packaging. With the references provided, readers may explore more deeply, focusing on a particular issue.