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Open Access
Article
Publication date: 2 April 2024

Margit Närvä, Jarmo Alarinta and Gun Wirtanen

The purpose of this study was to investigate amount of food waste and the number of food packages used in Finnish households with university students. The aim of the paper is to…

Abstract

Purpose

The purpose of this study was to investigate amount of food waste and the number of food packages used in Finnish households with university students. The aim of the paper is to answer the following research questions: How much avoidable food waste is generated in the participating various sized households? How much unavoidable food waste is generated in the participating various sized households? How many food packages are classified as deposit, municipal waste or recycled in the participating various sized households?

Design/methodology/approach

The data was collected among the students in Seinäjoki University of Applied Sciences. A total of results from 432 households with 890 persons are presented. The participating households weighed their unavoidable and avoidable food waste and calculated the food packages during one week. The results were analysed in Excel and the statistical significance assessed using a t-test.

Findings

The average avoidable and unavoidable food wastages were 498 g/week/person, i.e. 25.9 kg/year/person and 543 g/week/person, i.e. 28.3 kg/year/person, respectively. Single-person households generate more avoidable and unavoidable food waste as well as packages per person than other sized households. The results show that there is no correlation between the amount of avoidable food waste/person, unavoidable food waste/person or packages/person.

Originality/value

This kind of research has sparsely been reported. The food and package wastage definitions vary, and thus it is difficult to compare these results with other reported results.

Details

International Journal of Sustainability in Higher Education, vol. 25 no. 9
Type: Research Article
ISSN: 1467-6370

Keywords

Article
Publication date: 16 February 2023

ByongJin Kim, HyeongIl Jeon, GiJeong Kim, WonBae Bang and JinYoung Khim

The purpose of this study is to offer the advanced leadless leadframe package which achieve small form factor and high thermal and electrical performance, according to the…

Abstract

Purpose

The purpose of this study is to offer the advanced leadless leadframe package which achieve small form factor and high thermal and electrical performance, according to the continuous market requirement. Because of demand and trends, new package structures that can accommodate many pins (I/Os) while maintaining the excellent thermal and electrical properties of the leadframe package was studied. Different from conventional leadframe and laminate packages, it must have the large-exposed pad for thermal dissipation and design flexibility to deploy signal, ground and power selectively.

Design/methodology/approach

In this study, the routable molded leadframe (rtMLF®) package applying the pre-resin MLF substrate was introduced. The structural advantages, in terms of design flexibility, were checked by adopting the specific electrical feature. Also, the excellence of thermal and electrical performance was confirmed by simulation. The sample was manufactured, and its package robustness was validated by reliability test.

Findings

rtMLF package that enables one layer substrate but routable pattern on top layer differently from existing leadframe package was developed and studied if it overcome the limitations of leadframe and laminate products. Asymmetric land layout was designed and special features to keep electrical interference was applied to prove design flexibility. The thermal and electrical simulation has been executed to check the advantages. And key differentiations were identified. Finally, actual sample was manufactured, and structural robustness was validated by package level and board level reliability.

Originality/value

The differentiation of new semiconductor package was introduced and its excellence was verified by electrical and thermal simulation as well as reliability test. It is expected to be adopted for alternative solutions not covered by the existing products.

Details

Microelectronics International, vol. 40 no. 2
Type: Research Article
ISSN: 1356-5362

Keywords

Article
Publication date: 25 January 2024

Amna Farrukh and Aymen Sajjad

Manufacturing companies continue to encounter a diverse set of obstacles while embracing sustainable development goals. Accordingly, the purpose of this study is to explore…

Abstract

Purpose

Manufacturing companies continue to encounter a diverse set of obstacles while embracing sustainable development goals. Accordingly, the purpose of this study is to explore critical sustainable development-related barriers to flexible packaging manufacturing companies in the New Zealand context.

Design/methodology/approach

Drawing on a qualitative multiple case studies approach, the authors collected data from the New Zealand flexible packaging industry. Semistructured interviews were conducted with the senior corporate managers in two large flexible packaging companies. Following the thematic analysis approach, the authors analyzed the information collected from the participants and synthesized our findings under the key dimensions of internal and external barriers to sustainable development.

Findings

The findings revealed that internal barriers to sustainable flexible packaging are linked to economic, operational and technical issues. Conversely, external barriers include global crises and disruption, customer behavior and preferences and institutional and infrastructural-related aspects. Based on the analysis of empirical findings, the authors further identified the underlying reasons for sustainable flexible packaging barriers and recommended guidelines that could assist corporate managers and policymakers in addressing obstacles inhibiting the flexible packaging industry from adopting sustainable business practices.

Originality/value

The authors argue that this study is one of the early studies to consider inhibiting factors to incorporate sustainable development into the New Zealand flexible packaging industry context. Building on a range of theoretical perspectives, the authors extend the current body of knowledge seeking to advance the sustainable development agenda in the New Zealand flexible packaging industry and offer recommended pathways fostering sustainable development in a distinctive manufacturing context.

Details

Corporate Governance: The International Journal of Business in Society, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 1472-0701

Keywords

Article
Publication date: 9 February 2024

Choi-Meng Leong, Long She, Tze-Yin Lim and Ngiik Moi Wong

This study aims to examine the gender differences in purchase intention towards green packaging product. The paper extended the theory of planned behaviour by unravelling the…

Abstract

Purpose

This study aims to examine the gender differences in purchase intention towards green packaging product. The paper extended the theory of planned behaviour by unravelling the dynamics of quality, product attributes, and green packaging as part of strategic elements for the marketing mix.

Design/methodology/approach

A cross-sectional-survey-based questionnaire research design was used to collect data from a total of 212 adults from Malaysia. Partial least squares structural equation modelling was used to assess the measurement and the proposed research model.

Findings

The results showed that perceived quality and product attributes had a positive relationship with attitude towards green packing products without significant difference between female and male groups. Interestingly, this study found a significant difference between males and females in terms of the attitude and subjective norms towards intention to purchase green packaging product. Subjective norms had a positive relationship with attitude while perceived behavioural control had a positive relationship with purchase intention without significant gender differences.

Originality/value

The findings of this study contribute to the limited body of knowledge in the area of purchasing green packaging products and provide useful information to industry practitioners about gender differences in purchasing green packaging products. Also, the current study provided new insights to the academician by looking into the dimension of green marketing mix elements which influence consumer behaviour.

Peer review

The peer review history for this article is available at: https://publons.com/publon/10.1108/IJSE-04-2023-0249.

Details

International Journal of Social Economics, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 0306-8293

Keywords

Article
Publication date: 20 February 2024

Cortney L. Norris, Marissa Orlowski and Scott Taylor, Jr.

As a result of both shifting social concerns and stricter legislation, many companies are seeking innovative and sustainable solutions for both primary and secondary packaging

Abstract

Purpose

As a result of both shifting social concerns and stricter legislation, many companies are seeking innovative and sustainable solutions for both primary and secondary packaging. The craft beer industry has made the most notable advancements with a variety of alternatives to the traditional secondary packaging (e.g. plastic rings) used to link beer cans. Yet, despite the impact packaging has on consumer purchase behavior and the environment, secondary packaging has received far less attention in the literature. This study aims to understand consumer perceptions of craft beer secondary packaging on consumers’ willingness to buy via the underlying mechanisms of perceived packaging innovation and sustainability.

Design/methodology/approach

A single-factor between-subjects experiment with four conditions (secondary packaging format: Pak-Tech holder, Keel Clip holder, Glue-Pack holder, Biodegradable holder) was conducted with 354 participants to test the hypothesized serial mediation model.

Findings

The results demonstrate that none of the secondary packaging styles had a direct effect on willingness to buy, meaning that the package style alone does not influence a consumer’s purchase decisions. Critically, the results also revealed indirect effects; specifically, the Keel Clip and Glue-Pack six-pack can holders were perceived as more innovative than the Pak-Tech holder, which in turn positively influenced perceptions of packaging sustainability and subsequent willingness to buy.

Originality/value

The authors’ results extend the research on sustainable secondary packaging and aids craft breweries along with other beverage producers in making informed decisions as the push for sustainable packaging becomes more prominent.

Details

International Journal of Wine Business Research, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 1751-1062

Keywords

Article
Publication date: 31 May 2022

Shuo Huang, Yang Liu and Ke Li

The purpose of this paper is to compare the single-sided packaging structure and double-sided packaging structure of high-power module and study the overall heat dissipation…

Abstract

Purpose

The purpose of this paper is to compare the single-sided packaging structure and double-sided packaging structure of high-power module and study the overall heat dissipation performance and reliability of the module.

Design/methodology/approach

In this paper, the single-sided packaging structure and double-sided packaging structure of power module are designed based on Wolfspeed products. This paper is analyzed by finite element method. First, the heat dissipation performance of single-sided packaging structure and double-sided packaging structure is analyzed; second, the deformation and stress of single-sided packaging structure and double-sided packaging structure are compared and analyzed; and finally, the cumulative plastic deformation of single-sided packaging and double-sided packaging structures are compared and analyzed, and the fatigue life of the structure is calculated based on the plastic deformation.

Findings

In the heat transfer simulation, under the same power input, the heat dissipation performance of single-sided packaging structure is not as good as that of double-sided packaging structure. Under the reliability simulation of the same temperature cycle standard, the maximum equivalent stress of single-sided packaging structure is lower than that of double-sided packaging structure, but the fatigue life prediction based on plastic strain shows that the fatigue life of double-sided packaging structure is not different from that of single-sided packaging structure.

Originality/value

This paper creatively simulates the thermal characteristics and reliability of single-sided packaging structure and double-sided packaging structure and proves the advantages of double-sided packaging structure compared with single-sided packaging structure from the aspects of heat transfer performance and reliability.

Details

Soldering & Surface Mount Technology, vol. 35 no. 1
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 1 April 1996

A. Lefeuvre, M. Caplot, C. Stranieri and P. Massiot

Packages for multichip modules inmilitary airborne applications must hava some fundamental characteristics: highthermal conductivity, low density, good mechanical properties and a…

144

Abstract

Packages for multichip modules in military airborne applications must hava some fundamental characteristics: high thermal conductivity, low density, good mechanical properties and a coefficient of thermal expansion nearly equal to that of the microelectronic substrate installed in the package. In many cases, the substrate is alumina with a CTE of 6.5 ppm/°C. Materials such as aluminium, titanium or Kovar fulfil only part of the above requirements. This is critical when large packages are used, such as in electronic warfare systems where modules include wideband RF circuits with large alumina substrates next to dense digital circuits. The solution is then aluminium/ silicon carbide (Al/SiC). The aim of the paper is to present the development and qualification of large packages combining both RF and digital circuitry. The size taken into account in the study is 220 × 220 mm: it covers most of the electronic needs in terms of surface. Various aspects have been analysed from the perspective of the package manufacturer and the end‐user. The interest of Al/SiC is shown by a thermal analysis of a conduction cooled module with different core materials: the reduction in temperature gradient, which for some components reaches 20° C, has a strong effect on the module reliability. The different technological choices, for a first type of packages, are described: an Al/SiC baseplate with an iron‐nickel alloy for the ring and the lid, brazed feedthroughs (within the Al/SiC baseplate) and connectors, surface treatment, ring brazing material, lid welding technique. A second type of packages is also presented: the main difference lies in the interconnections. RF ceramic (HTCC) inserts are introduced in the ring frame. Various RF measurements show the interest of the different package technologies, especially the ceramic inserts with very good results up to 20 GHz.

Details

Microelectronics International, vol. 13 no. 1
Type: Research Article
ISSN: 1356-5362

Keywords

Article
Publication date: 18 May 2010

M.F.F. Poças, J.C. Oliveira, H.J. Pinto, M.E. Zacarias and T. Hogg

The purpose of this paper is to describe a pilot study characterizing the domestic usage of food packaging (amount and type) at the household level.

1255

Abstract

Purpose

The purpose of this paper is to describe a pilot study characterizing the domestic usage of food packaging (amount and type) at the household level.

Design/methodology/approach

Collection and detailed characterization is carried out, from a sample of Portuguese consumers, of packages used at home during a seven‐day period.

Findings

The daily intake of domestically consumed, packaged food ranged from 5 to 50 g/kgbw. The average intake value for children below 12 years old was 26 g/kgbw. Considering all packaging materials, package usage ranged from 0.1dm2/day.kgbw to 0.6dm2/day.kgbw. Packaging usage factors and food‐type distribution factors for each packaging material were estimated.

Research limitations/implications

The period of packaging collection and the size of the sample limit the degree of generalized conclusions that can be drawn.

Practical implications

The data collected are the base for the development of a framework and could make an important contribution to the assessment of consumer exposure to substances migrating from packages into food, in this case of the Portuguese consumer.

Originality/value

The results achieved are analysed in relation to the current assumptions made for the safety assessment of materials in the relevant European legislation. Furthermore, the results achieved can be used in a probabilistic approach to these assessments as the distributions of values, and not only the per capita values, are known.

Details

British Food Journal, vol. 112 no. 5
Type: Research Article
ISSN: 0007-070X

Keywords

Article
Publication date: 1 December 2000

Kang Zhang and Michael Pecht

Plastic ball grid array (PBGA) packages are non‐hermetic surface mount packages, designed in response to market demands for cost‐effective, high I/O count, small footprint, and…

Abstract

Plastic ball grid array (PBGA) packages are non‐hermetic surface mount packages, designed in response to market demands for cost‐effective, high I/O count, small footprint, and low profile components. Because of the materials and construction, PBGA packages can be vulnerable to failure mechanisms associated with exposure to temperature and humidity. In some applications, conformal coating has been used as a potential means to mitigate these problems by enhancing moisture ingress resistance. This study focused on the ability of two popular kinds of conformal coatings to protect PBGA packages from moisture‐induced failures. As part of the study, PBGA packages with and without conformal coatings were subjected to moisture ingress, moisture desorption and unbiased high temperature high humidity tests. The principal failure mechanisms observed were delamination and cracking in the packages. Although it was observed that parylene coating did slow down the moisture ingress, the high temperature high humidity tests did not demonstrate that two tested conformal coatings had significant protection against moisture‐induced failures for PBGA packages.

Details

Microelectronics International, vol. 17 no. 3
Type: Research Article
ISSN: 1356-5362

Keywords

Article
Publication date: 1 August 1990

Gordon L. Robertson

The 1990s will be the decade of environmentalawareness. Governments have introduced (or are aboutto introduce) eco‐labelling schemes for products andpackages. However, assessing…

2302

Abstract

The 1990s will be the decade of environmental awareness. Governments have introduced (or are about to introduce) eco‐labelling schemes for products and packages. However, assessing the environmental friendliness of packaging can be meaningful only if cognisance is taken of the six functions of packaging and the three environments where packaging has to perform. Categorising packaging as either good or bad based on whether or not it is recyclable or reusable is too simplistic an approach and could result in greater rather than fewer environmental problems.

Details

International Journal of Physical Distribution & Logistics Management, vol. 20 no. 8
Type: Research Article
ISSN: 0960-0035

Keywords

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