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This paper presents a novel printed circuit board (PCB) film image alignment method based on distance context of image components, which can be directly used for PCB film inspection. PCB film inspection plays a very important role in PCB production.

First, image components of reference film image and inspected film image are extracted. Then, local distance context (LDC) and global distance context (GDC) are computed for each image component. Using LDC and GDC, the similarity of each pair of components between the reference film image and the inspected film image are computed, the component correspondences can be established accordingly and the parameters for aligning these two images can be eventually estimated.

LDC and GDC act as the local spatial distribution descriptor and the global relative position descriptor of the current component, and they are invariant to translation, rotating and scale. Experimental results on aligning real PCB film images against various rotations and scaling transformation show that the proposed algorithm is fast and accurate and is very suitable for PCB film inspection.

The proposed algorithm is suitable for aligning those images that have some isolated connected components, such as the PCB film images. It is not suitable for general image alignment.

We put forward to use LDC and GDC as the local descriptor and global descriptor of an image component, and designed a PCB film image alignment algorithm that can overcome the shortcomings of that image alignment algorithm that was based on local feature descriptors such as Fourier descriptor.

Currently, adhesive films are replacing glue in many applications in semiconductor packaging and microelectronic assembly. When adhesive films are used to mount components on a PCB, the success of the automatic joining operation depends on many different things. Manufacturers of adhesives use three main values when they are discussing processing parameters in their data sheets. The paper describes in detail the concept of the developed assembly environment for making test joints of miniature and MEMS components using adhesive films.

Quality of the film set used for PCB manufacture and care in handling are of vital importance. Reference is made to the need for proper nomenclature and the stability, size and registration requirements. Production PCB films can be generated by reduction from oversize master artworks, or directly at one to one scale on a photo‐plotter. Plotted films; cut and strip master films; manual artwork; two colour artwork; single pad, multiple track sheet artworks; and hybrid artworks are discussed. Special attention is given to planes and solder resist films, photo‐reduction, phototools and film processing.

The paper describes the results obtained by the integration of Polymer Thick Film and Printed Circuit Technologies. Polymer Thick Film (PTF) Technology, applied to PCB manufacturing, helps the designer's task considerably and offers an interesting way to achieve time and cost reduction. The use of conductive and dielectric materials to generate cross‐overs and low interconnection density multilayers on epoxy‐glass substrates is shown and basic design rules are discussed. The performances of PTF conductive materials from two different suppliers are investigated in terms of conductivity, current carrying capacity and contact resistance with the copper‐clad layer. Surface and bulk insulation resistance, capacitance, loss factor and breakdown voltage are studied for dielectric materials from two different suppliers. The effects of environmental tests, i.e., thermal shocks, high temperature storage and temperature‐humidity‐bias test, on the performances of dielectric and conductive PTF are investigated by means of suitable test patterns. Application examples of Transmission System boards are discussed in terms of design and manufacturing times and costs.

Whatever one may feel is the importance of particular interconnection and assembly technologies with which one is associated, Thin Film or Thick Film Hybrid, PCB Through Hole, Surface Mounting, etc., the driving force in electronics is the high degree of low cost functionality brought by semiconductor technology. However, semiconductor science cannot provide systems solutions on its own and needs to be combined with suitable interconnection and assembly technologies to bring its potential processing power to fulfilment. Hybrid technology holds a key role in the use of silicon in overall system integration. On hybrid substrates semiconductors can be applied in any of the forms available, from bare dice to encapsulated, tested and burnt‐in complex functions in LSI. Over the years hybrids have developed, needing semiconductors as the active elements in providing functional modules. The relationship between the technologies has been close but not always in perfect harmony at the commercial interfaces. The first part of this paper reviews development of semiconductors in relation to the forms of packaging available for application in hybrid assembly including the emergent means being adopted to tackle the problems of ever increasing lead counts that will be with us for some time until the dream of total self‐sufficiency on silicon becomes a reality. The second part of the paper reviews silicon design options with the emphasis on the relevance of combining silicon implementation with hybrid methods.

Screen printing is widely used in electronics production and is the characteristic process of thick film manufacture. The correct choice of screen is most important if good quality prints of the correct thickness are to be achieved. Mesh and emulsion characteristics and the screen imaging process are discussed.

A very common method to predict the reliability of components soldered on printed circuit board (PCB) or substrates is by bending tests and temperature cycle tests, for instance between ‐55°C and 125°C (up to 2,000 cycles at 1h cycle period). Sensitive SMD constructions such as chips with ball grid array mounting or multilayer chip capacitors (MLCC) are often a major issue due to their “flex cracking” problems. This paper describes the real behaviour of deformation at temperature cycling and PCB bending of chip components (body size 0603). By using the piezoresistive effect in thick film resistors the effects of stress on the alumina body can be determined and described for the whole temperature range of interest. The complete system of component, PCB/substrate and solder joint will be discussed and different influences will be isolated. It will be shown that CTE‐matching of the component and substrate does not lead to an optimum situation. The influence of the solder joint plays an important part. Optimization potentials and design rules for the whole system will be given. The basis of this paper is a quite unusual “measurement tool” the effect of piezoresistivity. The investigation into that phenomenon will be described very thoroughly first.

The purpose of this paper is to investigate the thermal behaviour of thin- and thick-film resistor with different dimensions and contacts embedded into printed circuit board (PCB) and compare them to the similar constructions of discrete chip resistors assembled to standard PCBs.

In investigations the thin- and thick-film embedded resistors with the bar form in different dimensions and configurations of contacts as well as rectangular chip resistors in package 0603 and 0402 were used. In tests were carried out the measurements of dissipated power in temperature of resistor about 40°C, 70°C and 155°C. The power dissipation was calculated as a multiplying of electrical current flowing through the resistor with voltage across the resistor. The dissipation of heat generated by electrical current flowing through resistors was examined by means of the FLIR A320 thermographic camera with lens Closeup×2 and the power source.

The results show that, in case of chip resistors, the intensity of heat radiation strongly depends on dimensions of copper contact lands and also depends on the dimensions of the resistor. In case of embedded resistors, with comparable dimensions to chip resistors, they have lower ability to power dissipation, as well as the copper contact lands dimensions have lower influence. The thermal radiation through resin material is not as effective as it is in case of resistors assembled on PCB. However, the embedded thick-film resistors, especially made of paste Minico M2010, have already the similar parameters to 0402 chip resistors.

Research shows that embedded resistors can be used interchangeably with SMD resistors it allows to open up space on the surface of PCB, but it should be taken into account the lower energy dissipation capabilities. It is suggested that further studies are necessary for accurately determining the thermal effects and investigate the structures of embedded passive components that allow for better heat management.

Thermal stability of embedded resistors during operation is a critical factor of success of embedded resistor technology. The way of power dissipation and heat resistance are one of the important operating parameters of these components. The results provide information about the power and the energy dissipation of embedded thin- and thick-film resistors compared to the standard surface mount technology.

This paper deals with the design of PCBs, using the dielectric properties of solder mask as an insulation layer to protect boards and components; the elimination of selective solder filling of component holes; the protection of via holes during soldering, and the preparation of artwork, with particular attention to design tolerances using dry film solder mask. Future prospects in PCB design, employing dry film solder mask, are also discussed.

The purpose of this paper is to investigate the influence of parameters of embedded resistive elements manufacturing process as well as the influence of environmental factors on their electrical resistance. The investigations were made in comparison to the similar constructions of discrete chip resistors assembled to standard printed circuit boards (PCBs).

The investigations were based on the thin-film resistors made of NiP alloy, thick-film resistors made of carbon or carbon-silver inks as well as chip resistors in 0402 and 0603 packages. The polymer thick-film resistive films were screen-printed on the several types finishing materials of contact terminations such as copper, silver, and gold. To determine the sensitivity of embedded resistors versus standard assembled chip resistors on environmental exposure, the climatic chamber was used. The measurements of resistance were carried out periodically during the tests, and after the exposure cycles.

The results show that the change of electrical resistance of embedded resistors, in dependence of construction and base material, is different and mainly not exceed the range of 3 per cent. The achieved results in reference to thin-film resistors are comparable with results for standard chip resistors. However, the results that were obtained for thick-film resistors with Ag and Ni/Au contacts are similar. It was not found the big differences between resistors with and without conformal coating.

The studies show that embedded resistors can be used interchangeably with chip resistors. It allows to save the area on the surface of PCB, occupied by these passive elements, for assembly of active elements (ICs) and thus enable to miniaturization of electronic devices. But embedding of passive elements into PCB requires to tackle the effect of each forming process steps on the operational properties.

The technique of passive elements embedding into PCB is generally known; however, there are no detailed reports on the impact of individual process steps and environmental conditions on the stability of their electrical resistance. The studies allow to understand the importance of each factor process and the mechanisms of operational properties changes depending on the used materials.