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This paper aims to improve the life of the printed circuit boards (PCB) used in computers based on modal analysis by increasing the natural frequency of the PCB assembly.

In this work, through experiments and numerical simulations, an attempt has been made to increase the fundamental natural frequency of the PCB assembly as high as practically achievable so as to minimize the impacts of dynamic loads acting on it. An optimization tool in the finite element software (ANSYS) was used to search the specified design space for the optimal support location of the six fastening screws.

It is observed that by changing the support locations based on the optimization results the fundamental natural frequency can be raised up to 51.1% and the same is validated experimentally.

Manufacturers of PCBs used in computers fix the support locations based on symmetric feature of the board not on the dynamic behavior of the assembly. This work might lead manufacturers to redesign the location of other surface mount components.

This work provides guidelines for PCB manufacturers to finalize their support locating points which will improve the dynamic characteristics of the PCB assembly during its functioning.

This study provides a novel method to improve the life of PCB based on support locations optimization which includes majority of the surface mount components that contributes to the total mass the PCB assembly.

Based on the trait activation theory and social exchange theory, this study proposed a model of the impact of Machiavellian personality on organisational cynicism (OC) through the mediating effect of psychological contract breach (PCB) and the moderating role of leader-member exchange (LMX) quality in PCB and OC.

A three-time points survey involving 264 employees from China’s hotel industry was conducted using quantitative methods. Subsequently, a structural equation model was constructed.

The results revealed that Machiavellianism positively affects OC, and PCB plays a mediating role in this process. In addition, LMX quality can buffer the effect of the PCB on OC.

The study’s findings provide another insight into the relationship between Machiavellianism, PCB and OC. Managers must pay attention to the control of PCB and the establishment of LMX quality.

The study significantly contributes to hotel literature, as the Machiavellian personality subject has not been adequately investigated in the field to date.

Carpal tunnel syndrome (CTS) is a hand disease caused by the pressing of the median nerve present in the palmar side of the wrist. It causes severe pain in the wrist, triggering disturbance during sleep. Different products like splints, braces and gloves are available in the market to alleviate this disease but there was still a need to improve the wearability, comfort and cost of the product. This study was about designing a comfortable and cost-effective wearable system for mild-to-moderate CTS. Transcutaneous electrical nerve stimulation (TENS) therapy has been used to reduce the pain in the wrist.

After simulation by using Proteus software (which allowed the researchers to draw and simulate electrical circuits using ISIS, ARES and PCB design tools virtually), the circuit with optimum frequency, i.e. 33 Hz was selected, and the circuit was developed on a printed circuit board (PCB). The developed circuit was integrated successfully into the half glove structure.

The developed product had good thermophysiological comfort and hand properties as compared to the commercially available product of the same kind. In vivo testing (It involves the testing with living subjects like animals, plants or human beings) was performed which resulted in 85% confirmed viability of the product against CTS. A glove with an integrated circuit was developed successfully to accommodate various sizes without any sex specifications in a cost-effective way to mitigate the issue of CTS.

Industrial workers, individuals frequently using their hands or those diagnosed with CTS may wish to use this product as therapy. The attention could not be paid to the aesthetic or visual appeal of the developed product.

A very comfortable glove with integrated TENS electrodes was developed successfully to accommodate various sizes without any sex specifications in a cost-effective way to mitigate the issues of CTS.

Wireless sensor networks (WSN), as a solution for buried water pipe monitoring, face a new set of challenges compared to traditional application for above-ground infrastructure monitoring. One of the main challenges for underground WSN deployment is the limited range (less than 3 m) at which reliable wireless underground communication can be achieved using radio signal propagation through the soil. To overcome this challenge, the purpose of this paper is to investigate a new approach for wireless underground communication using acoustic signal propagation along a buried water pipe.

An acoustic communication system was developed based on the requirements of low cost (tens of pounds at most), low power supply capacity (in the order of 1 W-h) and miniature (centimetre scale) size for a wireless communication node. The developed system was further tested along a buried steel pipe in poorly graded SAND and a buried medium density polyethylene (MDPE) pipe in well graded SAND.

With predicted acoustic attenuation of 1.3 dB/m and 2.1 dB/m along the buried steel and MDPE pipes, respectively, reliable acoustic communication is possible up to 17 m for the buried steel pipe and 11 m for the buried MDPE pipe.

Although an important first step, more research is needed to validate the acoustic communication system along a wider water distribution pipe network.

This paper shows the possibility of achieving reliable wireless underground communication along a buried water pipe (especially non-metallic material ones) using low-frequency acoustic propagation along the pipe wall.

The purpose of this study is to propose a simplifying approach for modelling a reliability test. Modelling the reliability tests of printed circuit board (PCB)/microelectronic component assemblies requires the adoption of several simplifying assumptions. This study introduces and validates simplified assumptions for modeling a four-point bend test on a PCB/wafer-level chip scale packaging assembly.

In this study, simplifying assumptions were used. These involved substituting dynamic imposed displacement loading with an equivalent static loading, replacing the spherical shape of the interconnections with simplified shapes (cylindrical and cubic) and transitioning from a three-dimensional modelling approach to an equivalent two-dimensional model. The validity of these simplifications was confirmed through both quantitative and qualitative comparisons of the numerical results obtained. The maximum principal plastic strain in the solder balls and copper pads served as the criteria for comparison.

The simplified hypotheses were validated through quantitative and qualitative comparisons of the results from various models. Consequently, it was determined that the replacement of dynamic loading with equivalent static loading had no significant impact on the results. Similarly, substituting the spherical shape of interconnections with an equivalent shape and transitioning from a three-dimensional approach to a two-dimensional one did not substantially affect the precision of the obtained results.

This study serves as a valuable resource for researchers seeking to model accelerated reliability tests, particularly in the context of four-point bending tests. The results obtained in this study will assist other researchers in streamlining their numerical models, thereby reducing calculation costs through the utilization of the simplified hypotheses introduced and validated herein.

This paper aims to present two Anand’s model parameter sets for the multilayer silver–tin (AgSn) transient liquid phase (TLP) foils.

The AgSn TLP test samples are manufactured using pre-defined optimized TLP bonding process parameters. Consequently, tensile and creep tests are conducted at various loading temperatures to generate stress–strain and creep data to accurately determine the elastic properties and two sets of Anand model creep coefficients. The resultant tensile- and creep-based constitutive models are subsequently used in extensive finite element simulations to precisely survey the mechanical response of the AgSn TLP bonds in power electronics due to different thermal loads.

The response of both models is thoroughly addressed in terms of stress–strain relationships, inelastic strain energy densities and equivalent plastic strains. The simulation results revealed that the testing conditions and parameters can significantly influence the values of the fitted Anand coefficients and consequently affect the resultant FEA-computed mechanical response of the TLP bonds. Therefore, this paper suggests that extreme care has to be taken when planning experiments for the estimation of creep parameters of the AgSn TLP joints.

In literature, there is no constitutive modeling data on the AgSn TLP bonds.

This paper aims to concentrate on recent innovations in flexible wearable sensor technology tailored for monitoring vital signals within the contexts of wearable sensors and systems developed specifically for monitoring health and fitness metrics.

In recent decades, wearable sensors for monitoring vital signals in sports and health have advanced greatly. Vital signals include electrocardiogram, electroencephalogram, electromyography, inertial data, body motions, cardiac rate and bodily fluids like blood and sweating, making them a good choice for sensing devices.

This report reviewed reputable journal articles on wearable sensors for vital signal monitoring, focusing on multimode and integrated multi-dimensional capabilities like structure, accuracy and nature of the devices, which may offer a more versatile and comprehensive solution.

The paper provides essential information on the present obstacles and challenges in this domain and provide a glimpse into the future directions of wearable sensors for the detection of these crucial signals. Importantly, it is evident that the integration of modern fabricating techniques, stretchable electronic devices, the Internet of Things and the application of artificial intelligence algorithms has significantly improved the capacity to efficiently monitor and leverage these signals for human health monitoring, including disease prediction.

This study aims to focus on the surface mount technology (SMT) mass production process of Sn-9Zn-2.5Bi-1.5In solder. It explores it with some components that will provide theoretical support for the industrial SMT application of Sn-Zn solder.

This study evaluates the properties of solder pastes and selects a more appropriate reflow parameter by comparing the microstructure of solder joints with different reflow soldering profile parameters. The aim is to provide an economical and reliable process for SMT production in the industry.

Solder paste wettability and solder ball testing in a nitrogen environment with an oxygen content of 3,000 ppm meet the requirements of industrial production. The printing performance of the solder paste is good and can achieve a printing rate of 100–160 mm/s. When soldering with a traditional stepped reflow soldering profile, air bubbles are generated on the surface of the solder joint, and there are many voids and defects in the solder joint. A linear reflow soldering profile reduces the residence time below the melting point of the solder paste (approximately 110 s). This reduces the time the zinc is oxidized, reducing solder joint defects. The joint strength of tin-zinc joints soldered with the optimized reflow parameters is close to that of Sn-58Bi and SAC305, with high joint strength.

This study attempts to industrialize the application of Sn-Zn solder and solves the problem that Sn-Zn solder paste is prone to be oxidized in the application and obtains the SMT process parameters suitable for Sn-9Zn-2.5Bi-1.5In solder.

Within the umbrella of technology and vocational education (TVET), technology or technical education in higher institutions of learning is obligated to produce the required manpower needed in the industry. Thus, it is pertinent to explore the interaction between the industry and higher education students. Drawing on the tenets of theory of planned behavior (TPB), this study offers valuable insights into the nomological networks of work-integrated learning (WIL), perceived behavioral control (PBC), subjective norm (SBN), personal attitude (PAT) and job search intention (JSI).

The study applied a structurally hypothesized model that was drawn from the TPB to collect data for the constructs. Using a cross-sectional survey after the WIL experiences of the students, we collected data from technology education undergraduates (N = 214) in their final academic year from universities in Nigeria.

With structural equation modeling, the study found that WIL is directly associated with JSI, PBC, SBN and PAT. In line with the tenets of the TPB, simple mediation models were supported about the influence of WIL on JSI via PBC and PAT discretely but not via SBN. Further, the results support two paths of serial mediation models, indicating sequential indirect links between WIL and JSI via SBN and PBC, as well as via SBN and PAT.

Our findings have implications for higher education practitioners, industry experts and employers of labor.

Although extant literature has relatively shown that WIL impacts employability skills, this study has remarkably shown the WIL-JSI nexuses within the variables of TPB.

The purpose of this paper is to develop a prototype of a wearable medical device in the form of a bandage with a real-time data monitoring platform, which can be used domestically for diabetic patients to identify the possibility of foot ulceration at the early stage.

The prototype can measure blood volumetric change and temperature variation in the forefoot area simultaneously. The waveform extracted using a pulsatile-blood-flow signal was used to assess blood perfusion-related information, and hence, predict ischemic ulcers. The temperature difference between ulcerated and the reference was used to predict neuropathic ulcers. The medical device can be used as a bandage during the application wherein the sensory module is placed inside the hollow pocket of the bandage. A platform was developed through a mobile application where doctors can extract real-time information, and hence, determine the possibility of ulceration.

The height of the peaks in the pulsatile-blood-flow signal measured from the subject with foot ischemic ulcers is significantly less than that of the subject without ischemic ulcers. In the presence of ischemic ulcers, the captured waveform flattens. Therefore, the blood perfusion from arteries to the tissue of the forefoot is considerably low for the subject with ischemic ulcers. According to the temperature difference data measured over 25 consecutive days, the temperature difference of the subject with neuropathic ulcers occasionally exceeded the 4 °F range but mostly had higher values closer to the 4 °F range. However, the temperature difference of the subject who had no complications of neuropathic ulcers did not exceed the 4 °F range, and the majority of the measurements occupy a narrow range from −2°F to 2 °F.

The proposed prototype of wearable medical apparatus can monitor both temperature variation and pulsatile-blood-flow signal on the forefoot simultaneously and thereby predict both ischemic and neuropathic diabetes using a single device. Most importantly, the wearable medical device can be used domestically without clinical assistance with a real-time data monitoring platform to predict the possibility of ulceration and the course of action thereof.