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The application of laser and optical technologies in the industry is wide and extensive; the development and application of laser and optical technologies have become a promising research domain. However, most existing studies have focused on the technical aspects or the application aspects; these studies have not highlighted the technology distribution and application development of laser and optical technologies from the big picture. Additionally, the manner in which the research and development (R&D) results of universities correspond to the needs of enterprises and industry has become a topic of concern for the public. Therefore, this study aims to adopt the academic patents as the basis for analysis and to construct a laser and optical technology network.

Therefore, in the current study, the researchers have analyzed relevant academic patent technology networks, using academic patents of laser and optical technologies as a basis of analysis.

The study results indicated that the key technologies mainly lie in nanostructures, metal-working, material analysis and semiconductor devices. Additionally, these technologies are mainly applied in industries, such as optics, medical technology, pharmaceuticals, biotechnology and organic fine chemistry; this indicated that a large proportion of academia’s R&D outcomes are applied in these industries.

In this study, the researchers have constructed a technology network model to explore the technical development direction of laser and optical technologies; the results of the current study could serve as a reference for universities and industry for allocation of R&D resources.

Roger Main gives a four‐part report on the optical technologies which are playing an increasingly important role in sensor development.

The paper describes a new electro‐optical board technology, based on the discrete wiring principle. Isolated copper wires are embedded in the circuit board to realise the electrical interconnections. Glass optical fibres are embedded to obtain optical interconnections. The technology allows for crossovers and for electrical and optical interconnections on one layer of interconnection. As the technology can be applied on the level of package or multichip module, circuit board and backpanel, it has the ability to offer a complete solution for chip to chip electrical and optical interconnections. The paper will describe the basic manufacturing technology of the boards. The benefits of the technology from a system designer's viewpoint will be addressed. The problem of coupling light in and out of the embedded optical fibres will be discussed and the realisation of a first on‐board optical link via embedded optical fibres will be described.

The closed loop galvanometer‐based optical scanners continues to be an advanced technology for the integration and enabling of a broader range of laser system applications and uses. Advances in the technology have provided major improvements in galvo positioning speed, accuracy, size and cost. This paper will introduce the benefits, operating ranges and recent advances in galvanometer technology for scanning applications along with some of the other components and issues related to system design for high performance scanning applications. Several different actuator and position detector technologies and designs will be presented including moving coil actuators, moving magnet actuators and patented capacitive and optical position detector designs that offer positioning speeds as fast as 100 μs and positioning repeatability to single microradians. The performance and system design trade‐offs that one should consider during the selection of the appropriate galvanometer technology and the optical systems design will be discussed along with a performance comparison of the galvanometer to other optical scanning technologies.

A review of integrated optical circuit technologies [OIC] and their relevance to potential OIC sensor application. Describes the manufacture of OICs and the varied range of material technologies used. Active Silicon Integrated Optical Circuits have been developed which may have applications for many optical sensor and fibre optic sensor systems. Concludes however that silicon integrated optics will not enjoy large‐scale success until their manufacturing costs have been dramatically reduced.

Seepage of the dam is an important safety problem, which may cause internal erosion of the structure. In the field of seepage monitoring in civil engineering, the distributed optical fiber sensing technology based on the temperature tracing method has been paid more attention due to its unique advantages of high sensitivity, good stability and high resolution. The purpose of this paper is to make a review of the existing related research, so as to facilitate the later scholars to understand and further study more systematically.

In this paper, three kinds of commonly used distributed fiber temperature measurement technologies are introduced. Based on the working principle, monitoring system, theoretical analysis, experimental research and engineering application of the fiber seepage monitoring technology, the present situation of dam seepage monitoring based on distributed fiber is reviewed in detail and their advantages and disadvantages are compared.

The thermal monitoring technology of seepage measurement depends on the accuracy of optical fiber temperature measurement (including the accuracy of the system and the rationality of the discrimination method), the correct installation of optical fiber and the quantitative analysis of temperature data. The accuracy of the current monitoring system can basically meet the existing measurement requirements, but the correct installation of optical fiber and the calibration of temperature data need to be further studied for different discrimination methods, and this field has great research value.

At present, there are many applications and research studies of optical fiber sensing in the field of structural health monitoring, and there are also reviews of related aspects. However, there is little or no review only in the field of seepage monitoring. This paper summarizes the research and application of optical fiber sensing in the field of seepage monitoring. The possibility of the gradient method to find its new prospect with the development of monitoring systems and the improvement of temperature resolution is discussed. The idea of extending the seepage monitoring method based on distributed optical fiber thermal monitoring technology to other monitoring fields is also given in the paper.

High density interconnect (HDI) printed circuits are now being designed in ever‐increasing quantities for very high‐speed applications. The challenge of opto‐electronics and integration of photonics into the printed circuit has started to take off. In the next 7 years, expectations are that photonic printed circuit boards will grow to a $2.5 billion industry. This paper looks at the issues, materials and current processes being researched by European, Japanese and North American organizations to create this integrated opto‐electronic circuit board. In addition to reviewing the global players in polymer photonics, this paper will review the current programs of four of the six groups globally, namely EOBC‐OptoFoil (University of Ulm, Fraunhafer Inst., Daimler‐Chrysler, Siemens), PolyGuide (Dupont, HP), TOPCat (NIST, 3M, Goodyear), Truemode™ (Terahertz), NTT and JIEP.

To review and explore optical fiber and carbon nanotube (CNT) as prospective alternatives to copper in VLSI interconnections.

As the technology moves to deep submicron level, the interconnect width also scales down. Increasing resistivity of copper with scaling and rising demands on current density drives the need for identifying new wiring solutions. This paper explores various alternatives to copper. Metallic CNTs, optical interconnects are promising candidates that can potentially address the challenges faced by copper.

Although, the theoretical aspects proves CNTs and optical interconnect to be better alternative against copper on the ground of performance parameters such as power dissipation, switching delay, crosstalk. But copper would last for coming decades on integration basis.

This paper reviews the state‐of‐the‐art in CNT interconnect and optical interconnect research; and discusses both the advantages and challenges of these emerging technologies.

Defining and validating a map of related technologies is critical for managers, investors and inventors. Because of the increase in the applications of and demand for semiconductor lasers, analyzing the technological position of developers has become increasingly critical. Therefore, the purpose of this study is to adopt the technological position analysis to identify mainstream technologies and developments relevant to semiconductor lasers.

Correspondence analysis and k-means cluster analysis, which are data mining techniques, are used to reveal strategic groups of major competitors in the semiconductor laser market according to their Patent Cooperation Treaty (PCT) patent applications.

The results of this study reveal that PCT patent applications are generally obtained for masers, optical elements, semiconductor devices and methods for measuring and that technology developers have varying technological positions.

Through position analysis, this study identifies the technological focuses of different manufacturers to obtain information that can guide the allocation of research and development resources.

This paper gives a brief overview of requirements within the aerospace market sector for which optical sensors are of potential benefit, and goes on to describe sensors currently under development at Lucas Electrical and Electronic Systems which are primarily intended to meet some of these requirements. These sensors, based on the combination of silicon micromachining and optical sensing technologies, are sufficiently robust to provide the capability of directly measuring on‐engine parameters such as pressure and temperature. In association with FADEC‐mounted interface units, to which the sensor heads are coupled via optical fibre links, the sensors have the potential to provide measurement data for a number of aero‐engine control requirements.