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1 – 10 of 89
Content available
Article
Publication date: 1 August 2005

42

Abstract

Details

Microelectronics International, vol. 22 no. 2
Type: Research Article
ISSN: 1356-5362

Content available
Article
Publication date: 1 August 2005

37

Abstract

Details

Microelectronics International, vol. 22 no. 2
Type: Research Article
ISSN: 1356-5362

Content available
Article
Publication date: 1 June 2003

101

Abstract

Details

Sensor Review, vol. 23 no. 2
Type: Research Article
ISSN: 0260-2288

Keywords

Content available
Article
Publication date: 1 April 2002

74

Abstract

Details

Microelectronics International, vol. 19 no. 1
Type: Research Article
ISSN: 1356-5362

Keywords

Content available
Article
Publication date: 1 December 2000

Jack Hollingum

49

Abstract

Details

Industrial Robot: An International Journal, vol. 27 no. 6
Type: Research Article
ISSN: 0143-991X

Keywords

Content available
Article
Publication date: 1 August 2002

25

Abstract

Details

Microelectronics International, vol. 19 no. 2
Type: Research Article
ISSN: 1356-5362

Keywords

Open Access
Article
Publication date: 28 April 2022

Krzysztof Jakub Stojek, Jan Felba, Damian Nowak, Karol Malecha, Szymon Kaczmarek and Patryk Tomasz Tomasz Andrzejak

This paper aims to perform thermal and mechanical characterization for silver-based sintered thermal joints. Layer quality affects thermal and mechanical performance, and it is…

Abstract

Purpose

This paper aims to perform thermal and mechanical characterization for silver-based sintered thermal joints. Layer quality affects thermal and mechanical performance, and it is important to achieve information about how materials and process parameters influence them.

Design/methodology/approach

Thermal investigation of the thermal joints analysis method was focused on determination of thermal resistance, where temperature measurements were performed using infrared camera. They were performed in two modes: steady-state analysis and dynamic analysis. Mechanical analysis based on measurements of mechanical shear force. Additional characterizations based on X-ray image analysis (image thresholding), optical microscope of polished cross-section and scanning electron microscope image analysis were proposed.

Findings

Sample surface modification affects thermal resistance. Silver metallization exhibits the lowest thermal resistance and the highest mechanical strength compared to the pure Si surface. The type of dynamic analysis affects the results of the thermal resistance.

Originality/value

Investigation of the layer quality influence on mechanical and thermal performance provided information about different joint types.

Details

Soldering & Surface Mount Technology, vol. 35 no. 1
Type: Research Article
ISSN: 0954-0911

Keywords

Content available
Article
Publication date: 1 December 2000

Jack Hollingum

67

Abstract

Details

Sensor Review, vol. 20 no. 4
Type: Research Article
ISSN: 0260-2288

Keywords

Content available
Article
Publication date: 22 May 2007

74

Abstract

Details

Aircraft Engineering and Aerospace Technology, vol. 79 no. 3
Type: Research Article
ISSN: 0002-2667

Content available
Article
Publication date: 23 January 2009

117

Abstract

Details

Aircraft Engineering and Aerospace Technology, vol. 81 no. 2
Type: Research Article
ISSN: 0002-2667

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