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Article
Publication date: 1 December 1999

O. Svelto and D.C. Hanna

193

Abstract

Details

Sensor Review, vol. 19 no. 4
Type: Research Article
ISSN: 0260-2288

Article
Publication date: 22 June 2012

Necdet Geren, Çağdaş Sarıgül and Melih Bayramoğlu

The purpose of this paper is to apply the developed systematic mechanical design methodologies, that are obtained in part I, to investigate their success in designing…

Abstract

Purpose

The purpose of this paper is to apply the developed systematic mechanical design methodologies, that are obtained in part I, to investigate their success in designing mechanics of a flexible printed circuit board assembly (PCBA) rework cell.

Design/methodology/approach

The decision of soldering and desoldering tool, which is the most critical function of a PCBA rework or remanufacturing cell, significantly influences overall design concept. Therefore, the paper starts by applying the design methodology to the soldering and desoldering function. The same study is repeated for the rest of the sub‐functions but only the results are provided.

Findings

An application of rework machine design methodology for the design of a PCBA rework cell has been made available. In addition to this, the embedded knowledge, such as the requirements list, the function structure, the function/means tree, the weighted objective tree and evaluation chart for the soldering and desoldering function are provided.

Practical implications

The paper is the first work providing both embedded knowledge and the application of the systematic design methodology for the design of a fully automated flexible PCBA rework cell. The methodology leads rework machine designers in a well‐controlled and structured design environment.

Originality/value

The design methodology can be applied to all functions or targeted on key weighted areas to ensure that the designed rework machine meets the key areas of concerns. Furthermore, the methodology is generic and may be used to develop other complex manufacturing sytems.

Article
Publication date: 1 January 1987

Eighty‐five participants attended the 4th ISHM Display meeting at the Jaarbeurs Congress Centre in Utrecht on 16 October, 1986. The programme of the day started with the…

Abstract

Eighty‐five participants attended the 4th ISHM Display meeting at the Jaarbeurs Congress Centre in Utrecht on 16 October, 1986. The programme of the day started with the annual general membership meeting of the Benelux Chapter. The chairman, Mr T. Kwikkers, gave a short review of the state of affairs of ISHM‐Benelux and of the activities of the last year. He mentioned the temporary enlargement of the executive committee to give a new generation a chance to gain experience in the ISHM organisation and to take up some new activities. In order to raise publicity for ISHM and Hybrid Circuits a new brochure has been designed and a set of material for demonstration purposes was collected. With the material every member of the chapter can easily set up a presentation for schools or customers. This year ISHM‐Benelux has grown from 85 to 100 members and enjoys a healthy financial situation. Next year again emphasis will be put on public relations. Professor R. Govaerts signified that he was no longer available for a position in the executive committee. As Prof. Govaerts has been very active and stimulating for the ISHM‐Benelux Chapter from its foundation in 1976 up to now, the general membership meeting decided to appoint him as (the first) honorary member of this chapter. Except for Professor Govaerts, the sitting executive committee, consisting of 15 members, was re‐elected for another year. After the European conferences in Bournemouth and Hamburg the ISHM‐Benelux chapter is asked to organise the 1991 Conference. The executive committee is already looking out for candidates for a function in the organising committee, which must be formed in the coming year.

Details

Microelectronics International, vol. 4 no. 1
Type: Research Article
ISSN: 1356-5362

Article
Publication date: 26 January 2010

Amiza Rasmi, Arjuna Marzuki, Mohd Nizam Osman, Ahmad Ismat Abdul Rahim, Mohamed Razman Yahya and Abdul Fatah Awang Mat

The purpose of this paper is to discuss medium‐power amplifier (MPA) design using parasitic‐aware core‐based approach.

Abstract

Purpose

The purpose of this paper is to discuss medium‐power amplifier (MPA) design using parasitic‐aware core‐based approach.

Design/methodology/approach

This paper discusses a core‐based design approach, which can also deliver multi‐band radio frequency integrated circuit.

Findings

A fabricated 3.5 GHz MPA achieved a P1dB of 16.81 dBm, power‐added efficiency (PAE) of 16.74 percent and gain of 6.81 dB at the 10 dBm of input power under a low‐power supply of 3 V. The maximum current, Imax is 80.7 mA and the power consumption of the device is 242.10 mW. A fabricated 2.4 GHz MPA achieved a P1dB of 14.83 dBm, PAE of 11.73 percent and gain of 9.83 dB at the 5.0 dBm of input power under a low‐power supply of 3.0 V. The maximum current, Imax is 84.4 mA and the power consumption for this device is 253.20 mW.

Originality/value

This paper shows the merits of the parasitic‐aware design methods used in designing the core circuit.

Details

Microelectronics International, vol. 27 no. 1
Type: Research Article
ISSN: 1356-5362

Keywords

Article
Publication date: 7 August 2017

Qian Lin, Haifeng Wu and Xi Li

The purpose of this paper is to investigate the temperature reliability for a parallel high-efficiency class-E power amplifier (PA).

Abstract

Purpose

The purpose of this paper is to investigate the temperature reliability for a parallel high-efficiency class-E power amplifier (PA).

Design/methodology/approach

To explore the relationship between temperature and direct current (DC) characteristics, output power, S parameters and efficiency of the PA quantitatively, a series of reliability experiments have been designed and conducted to study the temperature reliability for this PA.

Findings

From the results, the prominent performance degradation even failure is found during the testing. Furthermore, the thermal shock test can cause permanent failure, which is a great threat for PA.

Research limitations/implications

Therefore, to ensure the good performance, the influence of temperature on PA reliability should be carefully considered during the stage of PA design.

Practical implications

All these can provide important guidance for the reliability design of PA.

Social implications

All these can give some important guidance for PA application.

Originality/value

In addition, PA is usually designed according to the electrical properties at the room temperature. From the results above, it can be concluded that it may be unable to satisfy the performance requirement at high temperature. In turn, if it is designed according to the electrical properties at low temperature, the transistor often works in the super-saturated state, the reliability of PA will become the new problem. Therefore, to ensure the good performance, the influence of temperature on PA reliability should be carefully considered during the design.

Details

Circuit World, vol. 43 no. 3
Type: Research Article
ISSN: 0305-6120

Keywords

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