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In recent years, additive manufacturing (AM) technology has been acknowledged as an efficient method for producing geometrical complex objects with a wide range of applications. However, dimensional inaccuracies and presence of defects hinder the broad adaption of AM procedures. These factors arouse concerns regarding the quality of the products produced with AM and the utilization of quality control (QC) techniques constitutes a must to further support this emerging technology. This paper aims to assist researchers to obtain a clear sight of what are the trends and what has been inspected so far concerning non-destructive testing (NDT) QC methods in AM.

In this paper, a survey on research advances on non-destructive QC procedures used in AM technology has been conducted. The paper is organized as follows: Section 2 discusses the existing NDT methods applied for the examination of the feedstock material, i.e. incoming quality control (IQC). Section 3 outlines the inspection methods for in situ QC, while Section 4 presents the methods of NDT applied after the manufacturing process i.e. outgoing QC methods. In Section 5, statistical QC methods used in AM technologies are documented. Future trends and challenges are included in Section 6 and conclusions are drawn in Section 7.

The primary scope of the study is to present the available and reliable NDT methods applied in every AM technology and all stages of the process. Most of the developed techniques so far are concentrated mainly in the inspection of the manufactured part during and post the AM process, compared to prior to the procedure. Moreover, material extrusion, direct energy deposition and powder bed processes are the focal points of the research in NDT methods applied in AM.

This literature review paper is the first to collect the latest and the most compatible techniques to evaluate the quality of parts produced by the main AM processes prior, during and after the manufacturing procedure.

Tape automated bonding (TAB) is one technology which is becoming widely adopted for interconnecting integrated circuits to a substrate or package. Both destructive and non‐destructive test methods for evaluation of TAB bonds are analysed and criticised. The key parameters and general guidelines of a destructive beampull test set‐up are identified and presented. The key features of four different non‐destructive test methods are described and discussed. It is found that no universal solution exists for non‐destructive evaluation of TAB bonds although some methods may be more useful than others under certain conditions and constraints. Data and experimental procedure are presented for correlation of scanning laser acoustic microscopy and beampull data.

Photoacoustic Imaging (also known as thermal wave imaging) is a novel non‐destructive testing technique which is capable of providing three‐dimensional information concerning the structure and characteristics of thin solid samples by the analysis of optically induced heat flows in such materials. A particular advantage of photoacoustic imaging is its ability to obtain depth related information about sub‐surface structures in both transparent and opaque samples. The spatial variations in optical and thermal properties of suitable materials are related to such physical phenomena as cracks, discontinuities, impurities and inclusions both on and below the surface. Since the laser used to generate the heat flows is focussed to around 30 microns diameter good spatial resolution is achieved and as the image may be easily manipulated and enlarged electronically, it is easy to appreciate the alternative names — photoacoustic microscopy.

The purpose of this paper is to provide an insight into the techniques used for the non‐destructive testing (NDT) of non‐metallic structural materials, notably polymer and ceramic composites.

Following a short introduction, this paper first considers methods for testing carbon fibre‐ and glass fibre‐reinforced polymer composites. It then discusses the role of NDT in wind and wave power systems and some of the techniques used to test ceramics and ceramic composites. Brief conclusions are drawn.

This shows that the growing use of non‐metallic engineering materials in critical applications has highlighted the need for a range of advanced NDT methods. While some traditional techniques can be adapted to test these materials, in several instances novel methods are required. These include a range of thermal, ultrasonic, electromagnetic, radiographic and laser‐based technologies.

The paper provides a review of the techniques used and being developed for the non‐destructive testing of non‐metallic engineering materials.

The utilisation of emerging technologies for the inspection of bridges has remarkably increased. In particular, non-destructive testing (NDT) technologies are deemed a potential alternative for costly, labour-intensive, subjective and unsafe conventional bridge inspection regimes. This paper aims to develop a framework to overcome conventional inspection regimes' limitations by deploying multiple NDT technologies to carry out digital visual inspections of masonry railway bridges.

This research adopts an exploratory case study approach, and the empirical data is collected through exploratory workshops, interviews and document reviews. The framework is implemented and refined in five masonry bridges as part of the UK railway infrastructure. Four NDT technologies, namely, terrestrial laser scanner, infrared thermography, 360-degree imaging and unmanned aerial vehicles, are used in this study.

A digitally enhanced visual inspection framework is developed by using complementary optical methods. Compared to the conventional inspection regimes, the new approach requires fewer subjective interpretations due to the additional qualitative and quantitative analysis. Also, it is safer and needs fewer operators on site, as the actual inspection can be carried out remotely.

This research is a step towards digitalising the inspection of bridges, and it is of particular interest to transport agencies and bridge inspectors and can potentially result in revolutionising the bridge inspection regimes and guidelines.

The challenge presented by advanced package development in the past five years has further accentuated the constant need for package quality and reliability monitoring through extensive laboratory testing and evaluation. As pin counts and chip geometries have continued to increase, there has been additional pressure from the military and commercial sectors to improve interconnect designs for packaged chips, including chips directly attached to the printed wiring board (PWB). One of the options employed has been tape automated bonding (TAB). However, this assembly technique also presents new standardisation, qualification and reliability problems. Therefore, at Rome Air Development Center (RADC), there is regular assessment (through in‐house failure analysis studies) of parts destined for military and space systems. In addition, Department of Defense (DoD) high tech development programmes, such as very high speed integrated circuits (VHSIC), have utilised all present screening methods for package evaluation, and have addressed the need for development of more definitive non‐destructive tests. To answer this need, two RADC contractual efforts were awarded on laser thermal and ultrasonic inspection techniques. Through these package evaluations, a number of potential reliability problems are identified and the results provided to the specific contractors for corrective action implementation. Typical problems uncovered are lid material and pin corrosion, damage to external components and adhesion problems between copper leads and polyimide supports, hermeticity failures, high moisture content in sealed packages and particle impact noise detection (PIND) test failures (internal particles). Further tests uncover bond strength failures, bond placement irregularities, voids in die attach material (potential heat dissipation problems), and die surface defects such as scratches and cracks. This presentation will review the specific package level physical test methods that are employed as a means of evaluating reliable package performance. Many of the tests, especially the environmental tests—e.g., salt atmosphere and moisture resistance—provide accelerated forms of anticipated conditions and are therefore applied as destructive tests to assess package quality and reliability in field use. In addition to a manufacturer's compliance with designated qualification procedures, the key to package quality lies in utilising good materials and well‐controlled assembly techniques. This practice, along with effective package screen tests, will ensure reliable operation of very large scale integration (VLSI) devices in severe military and commercial environment applications.

Maintenance is one of the most critical and expensive operations during the life cycle of metallic structures, in particular in the aeronautic industry. However, early detection of fatigue cracks is one of the most demanding operations in global maintenance procedures. In this context, non-destructive testing using image techniques may represent one of the best solutions in such situations, especially thermal stress analyses (TSA) using infrared thermography. The purpose of this paper is to access and characterize the main stress profile calculated through temperature variation, for different load frequencies.

In this paper, a cyclic load is applied to an aluminum sample component while infrared thermal image is being acquired. According to the literature and experiments, a cyclic load applied to a material results in cyclic temperature variation.

Frequency has been shown to be an important parameter in TSA evaluations, increasing the measured stress profile amplitude. The loading stimulation frequency and the maximum stress recorded show a good correlation (R² higher than 0.995). It was verified that further tests and modeling should be performed to fully comprehend the influence of load frequency and to create a standard to conduct thermal stress tests.

This work revealed that the current infrared technology is capable of reaching far more detailed thermal and spatial resolution than the one used in the development of TSA models. Thus, for the first time the influence of mechanical load frequency in the thermal profiles of TSA is visible and consequentially the measured mechanical stress.

AlSi10Mg alloy is commonly used in laser powder bed fusion due to its printability, relatively high thermal conductivity, low density and good mechanical properties. However, the thermal conductivity of as-built materials as a function of processing (energy density, laser power, laser scanning speed, support structure) and build orientation, are not well explored in the literature. This study aims to elucidate the relationship between processing, microstructure, and thermal conductivity.

The thermal conductivity of laser powder bed fusion (L-PBF) AlSi10Mg samples are investigated by the flash diffusivity and frequency domain thermoreflectance (FDTR) techniques. Thermal conductivities are linked to the microstructure of L-PBF AlSi10Mg, which changes with processing conditions. The through-plane exceeded the in-plane thermal conductivity for all energy densities. A co-located thermal conductivity map by frequency domain thermoreflectance (FDTR) and crystallographic grain orientation map by electron backscattered diffraction (EBSD) was used to investigate the effect of microstructure on thermal conductivity.

The highest through-plane thermal conductivity (136 ± 2 W/m-K) was achieved at 59 J/mm³ and exceeded the values reported previously. The in-plane thermal conductivity peaked at 117 ± 2 W/m-K at 50 J/mm³. The trend of thermal conductivity reducing with energy density at similar porosity was primarily due to the reduced grain size producing more Al-Si interfaces that pose thermal resistance. At these interfaces, thermal energy must convert from electrons in the aluminum to phonons in the silicon. The co-located thermal conductivity and crystallographic grain orientation maps confirmed that larger colonies of columnar grains have higher thermal conductivity compared to smaller columnar grains.

The thermal properties of AlSi10Mg are crucial to heat transfer applications including additively manufactured heatsinks, cold plates, vapor chambers, heat pipes, enclosures and heat exchangers. Additionally, thermal-based nondestructive testing methods require these properties for applications such as defect detection and simulation of L-PBF processes. Industrial standards for L-PBF processes and components can use the data for thermal applications.

To the best of the authors’ knowledge, this paper is the first to make coupled thermal conductivity maps that were matched to microstructure for L-PBF AlSi10Mg aluminum alloy. This was achieved by a unique in-house thermal conductivity mapping setup and relating the data to local SEM EBSD maps. This provides the first conclusive proof that larger grain sizes can achieve higher thermal conductivity for this processing method and material system. This study also shows that control of the solidification can result in higher thermal conductivity. It was also the first to find that the build substrate (with or without support) has a large effect on thermal conductivity.

The major problem that limits the widespread use of WAAM technology is the forming quality. However, most of the current research focuses on post-process detections that are time-consuming, expensive and destructive. This paper aims to achieve the on-line detection and classification of the common defects, including hump, deposition collapse, deviation, internal pore and surface slag inclusion.

This paper proposes an in-process multi-feature data fusion nondestructive testing method based on the temperature field of the WAAM process. A thermal imager is used to collect the temperature data of the deposition layer in real-time. Efficient processing methods are proposed in this paper, such as the temperature stack algorithm, width extraction algorithm and a classification model based on a residual neural network. Some features closely related to the forming quality were extracted, containing the profile image and width curve of the deposition layer and abnormal temperature features in longitudinal and cross-sections. These features are used to achieve the detection and classification of defects.

Thermal non-destructive testing is a potentially superior technology for in-process detection in the industrial field. Based on the temperature field, extracting the most relevant features of the defect information is crucial. This paper pushes current infrared (IR) monitoring methods toward real-time detection and proposes an in-process multi-feature data fusion non-destructive testing method based on the temperature field of the WAAM process.

In this paper, the single-layer and multi-layer WAAM samples are preset with various defects, such as hump, deposition collapse, deviation, pore and slag inclusion. A multi-feature nondestructive testing methodology is proposed to realize the in-process detection and classification of the defects. A temperature stack algorithm is proposed, which improves the detection accuracy of profile change and solves the problem of uneven temperature from arc striking to arc extinguishing. The combination of residual neural network greatly improves the accuracy and efficiency of detection.