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Article
Publication date: 2 November 2015

Seok-Hwan Huh, Sung-Ho Choi, An-Seob Shin, Gi-Ho Jeong, Suk-Jin Ham and Keun-Soo Kim

This study aims to elucidate the reaction mechanism of electroless NiP deposits on conductive but non-catalytic Cu films on the basis of their nucleation and growth without Pd…

Abstract

Purpose

This study aims to elucidate the reaction mechanism of electroless NiP deposits on conductive but non-catalytic Cu films on the basis of their nucleation and growth without Pd catalyst and to measure the deposition rate and activation energy of electroless NiP deposits on the non-catalytic Cu film at various deposition times (60, 120, 240 and 480 s) and temperatures (70, 80 and 90°C) at pH 4.6.

Design/methodology/approach

Specimens with and without Pd catalyst on Cu film were prepared as follows: the Pd catalyst was deposited on half of the Cu film using a deposition protector, and the specimen containing the Pd catalyst deposited on half of its area was immersed in electroless NiP solution. The growth of NiP on the Cu films with and without the Pd catalyst was observed.

Findings

The number of Pd nanoparticles increased with Pd activation time; the nucleation of Pd dominated over growth at 60 s. Lattice images show that the d-spacing of Ni nanoparticles doped with less than 10 at% P increased to 2.050 Å. Nucleation of NiP deposits occurred simultaneously in the specimens with and without the Pd catalyst, because electrons could be transferred via the conductive Cu. Therefore, the reaction mechanism of the electroless NiP deposited on Cu film appears to be electrochemical. The activation energies for NiP deposits (15 s Pd with catalytic Pd, 15 s Pd without catalytic Pd, 60 s Pd with catalytic Pd and 60 s Pd without catalytic Pd) on the Cu film are 65.8, 64.0, 64.3 and 58.1 kJ/mol, respectively. This demonstrates that, regardless of the volume and the presence of catalytic Pd, the activation energy of electroless NiP has a consistent value.

Research limitations/implications

It is necessary to study the relationship between the volume of Pd nanoparticles and the nucleation rate of NiP at an initial stage, as there are limited data regarding the effect of Pd volume on the nucleation rate of NiP.

Originality/value

The reaction mechanism of the electroless NiP deposited on conductive but non-catalytic Cu film involves electrochemical reactions because the nucleation of NiP deposits occurs on conductive Cu film regardless of the presence of the Pd catalyst.

Details

Circuit World, vol. 41 no. 4
Type: Research Article
ISSN: 0305-6120

Keywords

Article
Publication date: 17 October 2019

Muhammad Aamir, Riaz Muhammad, Majid Tolouei-Rad, Khaled Giasin and Vadim V. Silberschmidt

The research on lead-free solder alloys has increased in past decades due to awareness of the environmental impact of lead contents in soldering alloys. This has led to the…

Abstract

Purpose

The research on lead-free solder alloys has increased in past decades due to awareness of the environmental impact of lead contents in soldering alloys. This has led to the introduction and development of different grades of lead-free solder alloys in the global market. Tin-silver-copper is a lead-free alloy which has been acknowledged by different consortia as a good alternative to conventional tin-lead alloy. The purpose of this paper is to provide comprehensive knowledge about the tin-silver-copper series.

Design/methodology/approach

The approach of this study reviews the microstructure and some other properties of tin-silver-copper series after the addition of indium, titanium, iron, zinc, zirconium, bismuth, nickel, antimony, gallium, aluminium, cerium, lanthanum, yttrium, erbium, praseodymium, neodymium, ytterbium, nanoparticles of nickel, cobalt, silicon carbide, aluminium oxide, zinc oxide, titanium dioxide, cerium oxide, zirconium oxide and titanium diboride, as well as carbon nanotubes, nickel-coated carbon nanotubes, single-walled carbon nanotubes and graphene-nano-sheets.

Findings

The current paper presents a comprehensive review of the tin-silver-copper solder series with possible solutions for improving their microstructure, melting point, mechanical properties and wettability through the addition of different elements/nanoparticles and other materials.

Originality/value

This paper summarises the useful findings of the tin-silver-copper series comprehensively. This information will assist in future work for the design and development of novel lead-free solder alloys.

Details

Soldering & Surface Mount Technology, vol. 32 no. 2
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 18 December 2018

Fakhrozi Che Ani, Azman Jalar, Abdullah Aziz Saad, Chu Yee Khor, Mohamad Aizat Abas, Zuraihana Bachok and Norinsan Kamil Othman

This study aims to investigate the NiO nano-reinforced solder joint characteristics of ultra-fine electronic package.

Abstract

Purpose

This study aims to investigate the NiO nano-reinforced solder joint characteristics of ultra-fine electronic package.

Design/methodology/approach

Lead-free Sn-Ag-Cu (SAC) solder paste was mixed with various percentages of NiO nanoparticles to prepare the new form of nano-reinforced solder paste. The solder paste was applied to assemble the ultra-fine capacitor using the reflow soldering process. A focussed ion beam, high resolution transmission electron microscopy system equipped with energy dispersive X-ray spectroscopy (EDS) was used in this study. In addition, X-ray inspection system, field emission scanning electron microscopy coupled with EDS, X-ray photoelectron spectroscopy (XPS) and nanoindenter were used to analyse the solder void, microstructure, hardness and fillet height of the solder joint.

Findings

The experimental results revealed that the highest fillet height was obtained with the content of 0.01 Wt.% of nano-reinforced NiO, which fulfilled the reliability requirements of the international IPC standard. However, the presence of the NiO in the lead-free solder paste only slightly influenced the changes of the intermetallic layer with the increment of weighted percentage. Moreover, the simulation method was applied to observe the distribution of NiO nanoparticles in the solder joint.

Originality/value

The findings are expected to provide a profound understanding of nano-reinforced solder joint’s characteristics of the ultra-fine package.

Details

Soldering & Surface Mount Technology, vol. 31 no. 2
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 28 June 2011

M.M. Arafat, A.S.M.A. Haseeb and Mohd Rafie Johan

In electronic packaging, when solid copper comes in contact with liquid solder alloy, the former dissolves and intermetallic compounds (IMCs) form at the solid‐liquid interface…

Abstract

Purpose

In electronic packaging, when solid copper comes in contact with liquid solder alloy, the former dissolves and intermetallic compounds (IMCs) form at the solid‐liquid interface. The purpose of this paper is to study the effect of the presence of molybdenum nanoparticles on the dissolution of copper and the formation of interfacial IMC.

Design/methodology/approach

Cu wire having a diameter of 250 μm is immersed in liquid composite solders at 250°C up to 15 min. Composite solder was prepared by adding various amount of Mo nanoparticles into the Sn‐3.8Ag‐0.7Cu (SAC) solder paste. The dissolution behavior of Cu substrate is studied for SAC and Mo nanoparticles added SAC solders. The IMCs and its microstructure between the solder and substrate are analyzed by using conventional scanning electron microscope (SEM) and field emission SEM. The elemental analysis was done by using energy‐dispersive X‐ray spectroscopy.

Findings

Generally, the dissolution of the substrate increases with increasing immersion time but decreases with the increase of the content of Mo nanoparticles in the solder. The IMC thickness increases with increasing the reaction time but Mo nanoparticles can hinder the growth of IMC layer. The presence of Mo nanoparticle is found to be effective in reducing the dissolution of copper into SAC solder.

Originality/value

The paper shows that molybdenum nanoparticles in liquid SAC solders have a prominent effect on the substrate dissolution rate and the interfacial IMC between the SAC solder and copper substrate.

Details

Soldering & Surface Mount Technology, vol. 23 no. 3
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 8 February 2011

S.L. Tay, A.S.M.A. Haseeb and Mohd Rafie Johan

The purpose of this paper is to investigate the effects of addition Co nanoparticles on the characteristic properties of Sn‐3.8Ag‐0.7Cu solder.

Abstract

Purpose

The purpose of this paper is to investigate the effects of addition Co nanoparticles on the characteristic properties of Sn‐3.8Ag‐0.7Cu solder.

Design/methodology/approach

Cobalt (Co) nanoparticles were added to Sn‐Ag‐Cu solders by thoroughly blending various weight percentages (0‐2.0 wt%) of Co nanoparticles with near eutectic SAC387 solder paste. Blending was done mechanically for 30 min to ensure a homogeneous mixture. The paste mixture was then reflowed on a hot plate at 250°C for 45 s. The melting points of nanocomposite solder were determined by differential scanning calorimetry. Spreading rate of nanocomposite was calculated following the JIS Z3198‐3 standard. The wetting angle was measured after cross‐sectional metallographic preparation.

Findings

No significant change in melting point of the solder was observed as a result of Co nanoparticle addition. The wetting angles of the solder increased with the addition of nanoparticles, while the spreading rate decreased. Although the wetting angle increased, the values were still within the acceptable range. Scanning micrograph observations revealed that the as‐solidified microstructure of the composite solder was altered by the addition of Co nanoparticles. Microhardness of the solders slightly increased upon Co nanoparticles addition to SAC387.

Originality/value

The paper demonstrates that a simple process like paste mixing can be used to incorporate nanoparticles into solder.

Details

Soldering & Surface Mount Technology, vol. 23 no. 1
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 6 November 2017

A.U. Chaudhry, Vikas Mittal, M.I. Hashmi and Brajendra Mishra

Inorganic oxide addition can be synergistically beneficial in organic coatings if it can impart anti-corrosion properties and also act as an additive to enhance physical and/or…

Abstract

Purpose

Inorganic oxide addition can be synergistically beneficial in organic coatings if it can impart anti-corrosion properties and also act as an additive to enhance physical and/or chemical properties. The aim of this study was to evaluate the anti-corrosion benefits of nano nickel zinc ferrite (NZF) in the polymer film.

Design/methodology/approach

The time-dependent anti-corrosion ability of NZF (0.12-1.0 per cent w/w NZF/binder), applied on API 5L X-80 carbon steel, was characterized by electrochemical techniques such as open circuit potential, electrochemical impedance spectroscopy, linear polarization resistance and potentiodynamic. Characterization of corrosion layer was done by removing coatings after 216 h of immersion in 3.5 per cent w/v NaCl. Optical microscopy, field emission scanning electron microscopy and X-ray diffraction techniques were used to characterize the corroded surface.

Findings

Corrosion measurements confirm the electrochemical activity by metallic cations on the steel surface during corrosion process which results in improvement of anti-corrosion properties of steel. Moreover, surface techniques show compact corrosion layer coatings and presence of different metallic oxide phases for nanocomposite coatings.

Originality/value

The suggested protection mechanism was explained by the leaching and precipitation of metallic ion on the corroded surface which in turn slowed down the corrosion activity. Furthermore, improvement in barrier properties of rubber-based coatings was confirmed by the enhanced pore resistance. This work indicates that along with a wide range of applications of NZF, anti-corrosion properties can be taken as an addition.

Details

Anti-Corrosion Methods and Materials, vol. 64 no. 6
Type: Research Article
ISSN: 0003-5599

Keywords

Article
Publication date: 19 January 2015

Fatemeh Haghdoost, Vahid Mottaghitalab and Akbar Khodaparast Haghi

The purpose of the current study is to explore the potential possibility of acceleration in recognition, remedial process of heart disease and continuous electrocardiogram (ECG…

2563

Abstract

Purpose

The purpose of the current study is to explore the potential possibility of acceleration in recognition, remedial process of heart disease and continuous electrocardiogram (ECG) signal acquisition. The textile-based ECG electrode is prepared by inkjet printing of activator followed by electroless plating of nickel (Ni) particle.

Design/methodology/approach

The electrical resistance shows a range of around 0.1 Ω/sq, which sounds quite proper for ECG signal acquisition, as the potential difference according to heart activity on skin surface is in milivolt range. Surface modifications of Ni–phosphorus (P)-plated polyester fiber were studied by scanning electron microscopy, energy dispersive X-ray spectroscopy and X-ray diffractionmethods. The quality of the acquired signal from printed square-shaped sensors in two sizes with areas of 9 and 16 cm2 compared with the standard Ag/Agcl electrode using commercial ECG with the patient in the sitting position.

Findings

Comparison of these data led to the consideration of small fabric sensor for better performance and the least disturbance regarding homogeneity and attenuation in electric field scattering. Using these types of sensors in textile surface because of flexibility will provide more freedom of action to the user. Wearable ECG can be applied to solve the problems of the aging population, increasing demand for health services and lack of medical expert.

Originality/value

In the present research, a convenient, inexpensive and reproducible method for the patterning of Ni features on commercial polyester fabric was investigated. Printed designs with high electrical conductivity can be used as a cardiac receiving signals’ sensor.

Details

Sensor Review, vol. 35 no. 1
Type: Research Article
ISSN: 0260-2288

Keywords

Article
Publication date: 1 January 2024

Xingxing Li, Shixi You, Zengchang Fan, Guangjun Li and Li Fu

This review provides an overview of recent advances in electrochemical sensors for analyte detection in saliva, highlighting their potential applications in diagnostics and health…

Abstract

Purpose

This review provides an overview of recent advances in electrochemical sensors for analyte detection in saliva, highlighting their potential applications in diagnostics and health care. The purpose of this paper is to summarize the current state of the field, identify challenges and limitations and discuss future prospects for the development of saliva-based electrochemical sensors.

Design/methodology/approach

The paper reviews relevant literature and research articles to examine the latest developments in electrochemical sensing technologies for saliva analysis. It explores the use of various electrode materials, including carbon nanomaterial, metal nanoparticles and conducting polymers, as well as the integration of microfluidics, lab-on-a-chip (LOC) devices and wearable/implantable technologies. The design and fabrication methodologies used in these sensors are discussed, along with sample preparation techniques and biorecognition elements for enhancing sensor performance.

Findings

Electrochemical sensors for salivary analyte detection have demonstrated excellent potential for noninvasive, rapid and cost-effective diagnostics. Recent advancements have resulted in improved sensor selectivity, stability, sensitivity and compatibility with complex saliva samples. Integration with microfluidics and LOC technologies has shown promise in enhancing sensor efficiency and accuracy. In addition, wearable and implantable sensors enable continuous, real-time monitoring of salivary analytes, opening new avenues for personalized health care and disease management.

Originality/value

This review presents an up-to-date overview of electrochemical sensors for analyte detection in saliva, offering insights into their design, fabrication and performance. It highlights the originality and value of integrating electrochemical sensing with microfluidics, wearable/implantable technologies and point-of-care testing platforms. The review also identifies challenges and limitations, such as interference from other saliva components and the need for improved stability and reproducibility. Future prospects include the development of novel microfluidic devices, advanced materials and user-friendly diagnostic devices to unlock the full potential of saliva-based electrochemical sensing in clinical practice.

Details

Sensor Review, vol. 44 no. 1
Type: Research Article
ISSN: 0260-2288

Keywords

Article
Publication date: 5 January 2022

Thejas Ramakrishnaiah, Prasanna Gunderi Dhananjaya, Chaturmukha Vakwadi Sainagesh, Sathish Reddy, Swaroop Kumaraswamy and Naveen Chikkahanumajja Surendranatha

This paper aims to study the various developments taking place in the field of gas sensors made from polyaniline (PANI) nanocomposites, which leads to the development of…

Abstract

Purpose

This paper aims to study the various developments taking place in the field of gas sensors made from polyaniline (PANI) nanocomposites, which leads to the development of high-performance electrical and gas sensing materials operating at room temperature.

Design/methodology/approach

PANI/ferrite nanocomposites exhibit good electrical properties with lower dielectric losses. There are numerous reports on PANI and ferrite nanomaterial-based gas sensors which have good sensing response, feasible to operate at room temperature, requires less power and cost-effective.

Findings

This paper provides an overview of electrical and gas sensing properties of PANI/ferrite nanocomposites having improved selectivity, long-term stability and other sensing performance of sensors at room temperature.

Originality/value

The main purpose of this review paper is to focus on PANI/ferrite nanocomposite-based gas sensors operating at room temperature.

Details

Sensor Review, vol. 42 no. 1
Type: Research Article
ISSN: 0260-2288

Keywords

Article
Publication date: 8 May 2017

Mei Hyie Koay, Mohd Adham Akmal Tukiran, Siti Nur Amalina Mohd Halidi, Mardziah Che Murad, Zuraidah Salleh and Hamid Yusoff

The purpose of this study is to determine the effect of current density on the surface roughness and corrosion performance of electrodeposited Co–Ni–Fe-coated mild steel. Process…

Abstract

Purpose

The purpose of this study is to determine the effect of current density on the surface roughness and corrosion performance of electrodeposited Co–Ni–Fe-coated mild steel. Process variables are the key factor in controlling the electrodeposition process. It is important to study the processing parameter to optimize the mechanical and corrosion resistance performance of the coating substrate.

Design/methodology/approach

A low-cost electrodeposition method was used to the synthesize Co–Ni–Fe coating on the mild steel substrate. In the electrodeposition, electrochemistry concept was applied. The temperature of the process was controlled at 50 ± 5°C in an acidic environment. The influence of current density (11, 22 and 33 mA/cm2) and deposition time (15, 20 and 30 min) toward the surface roughness, hardness and corrosion rate was investigated.

Findings

The increases of time deposition and current density have improved the microhardness and corrosion resistance of Co–Ni–Fe-coated mild steel. The Co–Ni–Fe nanoparticles deposited at 30 min and current density of 33 mA/cm2 experienced the smallest surface roughness value (Ra). The same sample also obtained the highest Vickers microhardness of 122.6 HV and the lowest corrosion rate. This may be due to the homogenous and complete protection coating performed on the mild steel.

Practical implications

The findings from the study are important for future application of Co–Ni–Fe on the mild steel parts such as fasteners, car body panels, metal chains, wire ropes, engine parts, bicycle rims, nails and screws and various outdoor uses. The improvement of corrosion resistance using optimum electrodeposition parameters is essential for these applications to prolong the life span of the parts.

Originality/value

A new process which pertains to fabrication of Co–Ni–Fe as a protective coating on mild steel was proposed. The Co–Ni–Fe coating can enhance the corrosion protection and thus prolong the lifespan of the mild steel parts.

Details

Industrial Lubrication and Tribology, vol. 69 no. 3
Type: Research Article
ISSN: 0036-8792

Keywords

1 – 10 of 361