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Article
Publication date: 18 November 2013

William Burr and Nick Pearne

– The purpose of this paper is to look at innovation and the tension which arises between proprietorship and standardization.

Abstract

Purpose

The purpose of this paper is to look at innovation and the tension which arises between proprietorship and standardization.

Design/methodology/approach

The paper presents an analysis of the learning curve theory in relation to the printed circuit board industry.

Findings

The measurable impact of the learning curve will be different depending on a number of factors commonly found in the printed circuit industry – degree of process maturity/automation, run lengths, and presence of customized elements requiring modifications to process flow, materials, or procedures.

Originality/value

There is no escape from continuing and inexorable downward price pressure from entrenched expectations and trends. A clear understanding of how these work will confer a competitive advantage to the strategist concerned with bringing innovative technologies to the marketplace.

Details

Circuit World, vol. 39 no. 4
Type: Research Article
ISSN: 0305-6120

Keywords

Article
Publication date: 1 February 2013

William Burr, Nick Pearne and Francesca Stern

The purpose of this paper is to a provide short introductory overview of metal in board (MiB) circuit technologies for use in thermal management applications.

Abstract

Purpose

The purpose of this paper is to a provide short introductory overview of metal in board (MiB) circuit technologies for use in thermal management applications.

Design/methodology/approach

The paper details the types of metal in printed circuit boards (PCBs) that are possible and the mix of key features each exhibits. These combinations offer a mix of capabilities in thermal management, current conduction, interconnect density, material usage and cost that can be chosen to suit a specific application. Examples of these board types and their uses are considered.

Findings

Metal core and insulated metal substrate (IMS) PCBs are categories of PCB technologies which provide enhanced thermal management and current carrying capability. MiB technologies are based on conventional printed circuit materials and processes. This gives MiB a range of thermal and current handling characteristics which are particularly suited to a number of key existing and emerging applications.

Research limitations/implications

Further research and development in materials, processes and designs will help broaden the applicability of these types of boards, enabling them to encompass even more thermal management applications.

Originality/value

The paper shows that with 15 different types of metal core and metal backed PCB technologies available to handle thermal dissipation in power electronics, there is one to suit almost every application. This current and emerging portfolio of MiB types offers solutions which can handle thermal loads associated with power densities from about 0.25 W/cm2 to 10‐15 W/cm2 and currents from 20 A up to approximately 1000 A.

Details

Circuit World, vol. 39 no. 1
Type: Research Article
ISSN: 0305-6120

Keywords

Article
Publication date: 1 April 1984

The two‐day programme of the 10th Annual Symposium on Circuit Technology held at Brunei University, Uxbridge, Middlesex was attended by approximately 70 delegates. At the opening…

Abstract

The two‐day programme of the 10th Annual Symposium on Circuit Technology held at Brunei University, Uxbridge, Middlesex was attended by approximately 70 delegates. At the opening session, Mr John Walker, a member of the Executive Council and the Institute's Publicity Officer, welcomed those present and introduced Mr Steve Jones as Chairman for the morning session.

Details

Circuit World, vol. 11 no. 1
Type: Research Article
ISSN: 0305-6120

Article
Publication date: 1 April 1985

Lyncolec Ltd of Leominster, Herefordshire, specialists in fast turnround small quantity PCB manufacturing, have announced the appointment of Graham Lee as Commercial Director. In…

Abstract

Lyncolec Ltd of Leominster, Herefordshire, specialists in fast turnround small quantity PCB manufacturing, have announced the appointment of Graham Lee as Commercial Director. In this position he will be responsible for co‐ordinating all matters relating to sales and marketing.

Details

Circuit World, vol. 12 no. 1
Type: Research Article
ISSN: 0305-6120

Content available

Abstract

Details

Soldering & Surface Mount Technology, vol. 19 no. 3
Type: Research Article
ISSN: 0954-0911

Article
Publication date: 1 January 1988

Lorna Cullen

Bepi Matrix Systems, Galashiels, Scotland, organised a Multiwire Conference held on 28th and 29th September 1987 which aimed to bring together current and potential Multiwire…

Abstract

Bepi Matrix Systems, Galashiels, Scotland, organised a Multiwire Conference held on 28th and 29th September 1987 which aimed to bring together current and potential Multiwire users to hear a number of presentations by speakers from the US, Japan and the UK. The papers given focused on Multiwire's technical advantages and the latest manufacturing techniques used with this discrete wiring technology.

Details

Circuit World, vol. 14 no. 2
Type: Research Article
ISSN: 0305-6120

Article
Publication date: 1 April 1987

Lorna Cullen

In this second part of the report on Printed Circuit World Convention IV held at the Tokyo Prince Hotel, Tokyo, from 3–5 June 1987, a general synopsis of the content of the papers…

Abstract

In this second part of the report on Printed Circuit World Convention IV held at the Tokyo Prince Hotel, Tokyo, from 3–5 June 1987, a general synopsis of the content of the papers presented in the eighteen technical sessions will be given. As three sessions were run in parallel throughout the 2½‐day conference, and therefore not all presentations were heard by those reporting on the technical programme, a number of them have been briefly summarised from the Convention Proceedings.

Details

Circuit World, vol. 14 no. 1
Type: Research Article
ISSN: 0305-6120

Article
Publication date: 1 March 1988

Through Circuit World's regular attendance at electronics‐related events worldwide, the faces of several of BPA's ‘personalities’ have over the years become very familiar…

Abstract

Through Circuit World's regular attendance at electronics‐related events worldwide, the faces of several of BPA's ‘personalities’ have over the years become very familiar. Featuring on international Conference programmes, and as guest speakers at seminars, symposia and workshops on a number of continents, the various members of the ‘team’ are very much in demand. Conference halls have been seen by the reporter to fill conspicuously for the BPA presentation, with a surreptitious trickle of delegates ‘escaping’ once the lecture is over.

Details

Circuit World, vol. 14 no. 4
Type: Research Article
ISSN: 0305-6120

Article
Publication date: 1 March 1986

Earl Moon of Viking Interconnect Systems addressed those present at the 21 May meeting on the subject of ‘Characterisation of Military SMT/MLB Requirements as a Function of the…

Abstract

Earl Moon of Viking Interconnect Systems addressed those present at the 21 May meeting on the subject of ‘Characterisation of Military SMT/MLB Requirements as a Function of the Total Package Concept’.

Details

Circuit World, vol. 12 no. 4
Type: Research Article
ISSN: 0305-6120

Article
Publication date: 1 March 1993

G. Ferrari

This paper, which will be published in two parts in consecutive issues of Circuit World, reproduces a chapter of the recently published book ‘Handbook of Printed Circuit…

Abstract

This paper, which will be published in two parts in consecutive issues of Circuit World, reproduces a chapter of the recently published book ‘Handbook of Printed Circuit Technology: New Processes, New Technologies’, edited by G. Herrmann and K. Egerer and published by Electrochemical Publications Ltd, Port Erin, Isle of Man.

Details

Circuit World, vol. 19 no. 4
Type: Research Article
ISSN: 0305-6120

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