Search results

This paper aims to investigate the effect of solder composition and roughness on early wetting behavior and interfacial reaction under atmospheric conditions.

High-speed photography is used to observe the early wetting and spreading process of the solder on the substrate in real time. The morphology of intermetallic compounds (IMCs) was observed by scanning electron microscopy, and the composition of IMCs micro bumps was determined by energy dispersive spectroscopy.

With a roughness range of 0.320–0.539 µm, the solder is distributed in an elliptical trilinear pattern along the grinding direction. With a roughness range of 0.029–0.031 µm, the solder spreads in the direction of grinding and perpendicular, forming a perfect circle (except in the case of Sn63Pb37 solder). The effect of three types of solder on early wettability is Sn63Pb37 > Sn96.5Ag3Cu0.5 > Sn. The wetting behavior is consistent with the Rn∼t model. The rapid spreading stage (Stage I) is controlled by the interfacial reaction with n1 values between 2.4 and 4. The slow spreading stage (stage II) is controlled by diffusion with n2 values between 4 and 6.7. The size of Cu6Sn5 formed on a rough substrate is greater than that produced on a smooth substrate.

Investigating the effect of solder composition and roughness on early wettability. This will provide a powerful guide in the field of soft brazing.

Due to the miniaturization of electronic devices, the increased current density through solder joints leads to the occurrence of electromigration failure, thereby reducing the reliability of electronic devices. The purpose of this study is to propose a finite element-artificial neural network method for the prediction of temperature and current density of solder joints, and thus provide reference information for the reliability evaluation of solder joints.

The temperature distribution and current density distribution of the interconnect structure of electronic devices were investigated through finite element simulations. During the experimental process, the actual temperature of the solder joints was measured and was used to optimize the finite element model. A large amount of simulation data was obtained to analyze the neural network by varying the height of solder joints, the diameter of solder pads and the magnitude of current loads. The constructed neural network was trained, tested and optimized using this data.

Based on the finite element simulation results, the current is more concentrated in the corners of the solder joints, generating a significant amount of Joule heating, which leads to localized temperature rise. The constructed neural network is trained, tested and optimized using the simulation results. The ANN 1, used for predicting solder joint temperature, achieves a prediction accuracy of 96.9%, while the ANN 2, used for predicting solder joint current density, achieves a prediction accuracy of 93.4%.

The proposed method can effectively improve the estimation efficiency of temperature and current density in the packaging structure. This method prevails in the field of packaging, and other factors that affect the thermal, mechanical and electrical properties of the packaging structure can be introduced into the model.

Porosity is a commonly analyzed defect in the laser-based additive manufacturing processes owing to the enormous thermal gradient caused by repeated melting and solidification. Currently, the porosity estimation is limited to powder bed fusion. The porosity estimation needs to be explored in the laser melting deposition (LMD) process, particularly analytical models that provide cost- and time-effective solutions compared to finite element analysis. For this purpose, this study aims to formulate two mathematical models for deposited layer dimensions and corresponding porosity in the LMD process.

In this study, analytical models have been proposed. Initially, deposited layer dimensions, including layer height, width and depth, were calculated based on the operating parameters. These outputs were introduced in the second model to estimate the part porosity. The models were validated with experimental data for Ti6Al4V depositions on Ti6Al4V substrate. A calibration curve (CC) was also developed for Ti6Al4V material and characterized using X-ray computed tomography. The models were also validated with the experimental results adopted from literature. The validated models were linked with the deep neural network (DNN) for its training and testing using a total of 6,703 computations with 1,500 iterations. Here, laser power, laser scanning speed and powder feeding rate were selected inputs, whereas porosity was set as an output.

The computations indicate that owing to the simultaneous inclusion of powder particulates, the powder elements use a substantial percentage of the laser beam energy for their melting, resulting in laser beam energy attenuation and reducing thermal value at the substrate. The primary operating parameters are directly correlated with the number of layers and total height in CC. Through X-ray computed tomography analyses, the number of layers showed a straightforward correlation with mean sphericity, while a converse relation was identified with the number, mean volume and mean diameter of pores. DNN and analytical models showed 2%–3% and 7%–9% mean absolute deviations, respectively, compared to the experimental results.

This research provides a unique solution for LMD porosity estimation by linking the developed analytical computational models with artificial neural networking. The presented framework predicts the porosity in the LMD-ed parts efficiently.

This study aims to characterize the mechanical properties of sintered nano-silver under various sintering processes by nano-indentation tests.

Through microstructure observations and characterization, the influences of sintering process on the microstructure evolutions of sintered nano-silver were presented. And, the indentation load, indentation displacement curves of sintered silver under various sintering processes were measured by using nano-indentation test. Based on the nano-indentation test, a reverse analysis of the finite element calculation was used to determine the yielding stress and hardening exponent.

The porosity decreases with the increase of the sintering temperature, while the average particle size of sintered nano-silver increases with the increase of sintering temperature and sintering time. In addition, the porosity reduced from 34.88%, 30.52%, to 25.04% if the ramp rate was decreased from 25°C/min, 15°C/min, to 5°C/min, respectively. The particle size appears more frequently within 1 µm and 2 µm under the lower ramp rate. With reverse analysis, the strain hardening exponent gradually heightened with the increase of temperature, while the yielding stress value decreased significantly with the increase of temperature. When the sintering time increased, the strain hardening exponent increased slightly.

The mechanical properties of sintered nano-silver under different sintering processes are clearly understood.

This paper could provide a novel perspective on understanding the sintering process effects on the mechanical properties of sintered nano-silver.