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The purpose of this paper is to reduce the torque ripple but not to decrease the average torque of synchronous reluctance machines by using one step or more than two axially laminated rotors with asymmetric flux-barrier.

A 24-slot four-pole synchronous reluctance machine with overlapping windings and asymmetric flux-barrier in the rotor is, first, described and designed by finite element (FE) method for maximizing average torque. The dimensions of asymmetric flux-barrier including the pole span angle and flux-barrier angle will be optimized to minimize the torque ripple and its influence on the average torque is also investigated by FE analysis. The impact of current angle on the average torque and torque ripple are also analysed. The step laminations together with the asymmetric flux-barrier are employed for further torque ripple reduction which can consider the both rotation directions.

The torque ripple of synchronous reluctance machine can be significantly reduced by employing asymmetric flux-barrier but the average torque is not reduced.

The purely sinusoidal currents are applied in this analysis and the effects of harmonics in the current on torque ripple are not considered in this application. The 24-slot/four-pole synchronous reluctance machine with single-layer flux-barrier has been employed in this analysis, but this work can be continued to investigate the synchronous reluctance machine with multilayer flux-barrier. This asymmetric flux-barrier can be easily applied to permanent magnet (PM)-assisted synchronous reluctance machine and the interior PM machine with flux-barrier in the rotor, since the space which is used for PM insertion is the same as the SynRM machines.

This paper has analysed the torque ripple and average torque of synchronous reluctance machines with asymmetric flux-barrier and step laminations with asymmetric flux-barrier. The torque ripple can be reduced by this flux-barrier arrangement. The difference of this technique with the other techniques such as stator/rotor skew is that the average torque can be improved.

This paper aims to further improve the efficiency of multi-objective optimization design of synchronous reluctance motors (SynRMs) using the level set (LS) method, which has the advantage of obtaining a practical shape. The solutions obtained by gradient methods tend to be local ones due to the multi-modality of the objective function, especially when multiple objective functions. A huge number of trial calculations are required to obtain a high-quality and broadly distributed Pareto front. Therefore, it is indispensable to effectively get out of the local solutions in the optimization process with the LS method.

The authors propose a novel method appropriately switching multiple objective functions with high independence of sensitivity information. The authors adopt highly independent mathematical expressions for the objective functions of the average torque and torque ripple. In addition, the authors repeatedly perform the optimization while appropriately selecting the sensitivity information of one objective function from multiple ones, which enables the authors to effectively break out of local solutions in the optimization process.

The proposed method was applied to the shape optimization of SynRM flux barriers and successfully searched a more extensive and advanced Pareto front in comparison with the conventional method.

The proposed method adopts search spaces with mathematical high independence for average torque and torque ripple. In the optimization process, when the solution search is judged to get stuck by several criteria, the search space is alternately switched to effectively get out of local solutions.

The purpose of this paper is to measure the thermal insulation of protective clothing with multilayer gaps in low-level heat exposures.

Nine different combinations of protective clothing systems with multiple air gaps are used to measure the thermal insulation by a self-designed bench-scale test apparatus in different levels of an external thermal radiation of 2-10 kW/m2. The outside and inside surface temperatures of each fabric layer are also measured to calculate the local thermal insulation of each fabric layer and each air gap.

The results show that the total thermal insulation of protective clothing under thermal radiation is less than that in normal environments, and the exposed thermal radiation will worsen the total thermal insulation of the multilayer fabric systems. Air gap plays a positive role in the total thermal insulation, and thus provides the enhanced thermal protection. It is also suggested that the local resistance of the air gap closer to the external thermal radiation is more easily affected by the thermal radiation, due to the different heat transfer ways in the fabric system and the external thermal radiation.

Effects of air gap on the thermal insulation of protective clothing, and contribution of the local thermal resistance of each fabric layer and each air gap to the total thermal insulation.

Nickel, as a barrier to the dissolution of termination materials, requires a solderable coating to prevent nickel oxidation and preserve solderability of surface mount devices. Most multilayer capacitors (MLCs) are supplied with tin or tin/lead coatings electrodeposited over the nickel barrier layer. There is general disagreement in the electronics industry about preferred solderable finishes and solderability test methods of component leads. Tin and tin/lead finishes have typically been compared on leaded devices. The results of these studies are not necessarily applicable to leadless surface mount chip components. This study compares 100% tin and 60/40 tin/lead electroplated coatings on nickel barrier terminated, multilayer chip capacitors (MLCs). Various thicknesses of tin and tin/lead were compared for solderability after steam‐age, solder joint strength, and chemical and physical composition of the reflowed termination surface. The results show no significant difference between the solderability and joint strength under vapour phase reflow conditions using 60/40 solder paste. The termination surfaces were reflowed at 215°C in the case of both pure tin and 60/40 tin/lead. The tin/lead finish reflowed to a composition of 60% tin/40% lead. The 100% tin finish reflowed to a composition of 90% tin/10% lead. Reflow was caused by diffusion of lead and tin.

This paper gives a bibliographical review of the finite element methods (FEMs) applied to the analysis of ceramics and glass materials. The bibliography at the end of the paper contains references to papers, conference proceedings and theses/dissertations on the subject that were published between 1977‐1998. The following topics are included: ceramics – material and mechanical properties in general, ceramic coatings and joining problems, ceramic composites, ferrites, piezoceramics, ceramic tools and machining, material processing simulations, fracture mechanics and damage, applications of ceramic/composites in engineering; glass – material and mechanical properties in general, glass fiber composites, material processing simulations, fracture mechanics and damage, and applications of glasses in engineering.

PCB manufacturers are switching from the use of RMA fluxes in their soldering and rework processes to low residue type (i.e., ‘no‐clean’) fluxes. Unfortunately, successful changeover is not simply a matter of substituting a no‐clean into an existing RMA process. Soldering process parameters must change, necessitating an understanding of the interplay between flux chemistry and heat delivery. Higher temperatures can result in an effective decrease in the concentration of the active fluxing agents. Also, data show a decrease in the inherent wetting force of a no‐clean flux with increasing temperature. These two factors reduce fluxing action below the rate of oxidation occurring at the solder connection and the soldering iron tip. These can lead to incomplete surface cleaning and inefficient heat transfer, resulting in poorly soldered connections. Lower solder joint defect rates are obtained with no‐clean solders and fluxes when soldering temperatures are reduced to a minimum.

The purpose of this paper is to study the combined effects of moisture and radiation on thermal protective performance of protective clothing exposed to low level radiation.

Using a sweating manikin, the effect of radiation and moisture on heat and moisture transfer was initially analyzed under the dry manikin with sweating rate of 100 g/(m2h) exposed to 2.5 kW/m2, and then studied at 200 and 300 g/(m2h) exposed to 2 and 3 kW/m2, respectively. Finally, the combined effects of thermal radiation and moisture were predicted by fitting the relationships among heat loss and wet skin surface temperature, with the sweating rate and radiation intensity.

The results show that the heat loss and the wet skin surface temperature are affected by the combined effects of moisture and radiation, with two distinctly different trends. Heat loss from the manikin is increasing with the sweating rate, and decreasing with thermal radiation intensity. However, the wet skin surface temperature has an opposite situation.

Two filling equations are given to present the relationships among heat loss and wet skin surface temperature, with the sweating rate and radiation intensity. With these two equations, the heat loss and the wet skin surface temperature when exposed to radiation can be predicted by only measuring the mean radiant and ambient temperatures and controlling the sweating rate.

The paper aims to present the advanced mathematical and numerical models of conjugated heat and mass transfer in a multi-layer protective clothing, human skin and muscle subjected to incident external radiative heat flux.

The garment was made of three layers of porous fabric separated by the air gaps, whereas in the tissue, four skin sublayers and muscle layer were distinguished. The mathematical model accounted for the coupled heat transfer by conduction and thermal radiation with the associated phase transition of the bound water in the fabric fibres and diffusion of the water vapour in the clothing layers and air gaps. The skin and muscle were modelled with two equation model which accounted for heat transfer in the tissue and arterial blood. Complex thermal and mass transfer conditions at the internal or external boundaries between the fabric layers, air gaps and skin were assumed. Special attention was paid to modelling of thermal radiation emitted by external heat source, for example, a fire, penetrating through the protective clothing and being absorbed by the skin and muscle.

Temporal and spatial variations of temperature in the protective garment, skin and muscle, as well as volume fractions of the water vapour and bound water in the clothing, were calculated for various intensity of incident radiative heat flux. The results of numerical simulation were used to estimate the risk of the first-, second- and third-degree burns.

Because of the small thickness of the considered system in comparison to its lateral dimensions, the presented model was limited to 1D heat and moisture transfer. The convective heat transfer through the clothing was neglected.

The model may be applied for design of the new protective clothing and for assessment of thermal performance of the various types of protective garments. Additionally, the proposed approach may be used in the medicine for estimation of degree of thermal destruction of the tissue during treatment of burns.

The novel advanced thermal model of the multi-layer protective garment, skin and muscle layer was developed. For the first time, non-grey optical properties and various optical phenomena at the internal or external boundaries between the fabric layers, air gaps and skin were accounted for during simulation of thermal interactions between the external heat source (e.g. a fire), protective clothing and human skin.

This paper aims to present an interior permanent magnet synchronous machine (IPMSM) with double-layer PMs used for electric vehicles, of which the integrated simulation of electromagnetic field, stress field and temperature field are analyzed.

Some electromagnetic characteristics including iron loss, efficiency and flux linkage are obtained by finite element analysis. The mechanical strength of rotor at the maximum speed and the temperature rise at the rated load are calculated by three-dimensional finite element analysis (FEA).

The results show that the presented IPMSM can work with sufficient mechanical strength, machine temperature rise and high efficiency during field-weakening operation. The experiments were carried out to verify the FEA, and acceptable results can be achieved.

This paper proposed a novel IPMSM with the double-layer permanent magnets, which is designed and checked by the multi-physics fields, and the high efficiency in all operational regions can be achieved for this machine.

The electronics assembly industry has fortunately rediscovered conductive adhesives as the search for lead‐free joining materials and improved performance intensifies. Although these intrinsically clean bonding agents are often first sought for their favourable environmental attributes, many are surprised to find that conductive adhesives can solve old and new problems. Today, new polymer solders for SMT allow low temperature processing, finer pitch assembly and wider processing latitude while providing compatibility with a very much larger range of materials than solder. State‐of‐the‐art adhesives are oxide‐tolerant and absolutely no fluxing or cleaning is required. Adhesives work where solder cannot be used. What's more, polymer‐based solder alternatives can run on existing SMT lines — no new equipment is needed. Z‐axis, or anisotropic, bonding agents are uni‐directional conductive materials that solve fine pitch interconnect problems in several areas. The anisotropics now dominate the flat panel interconnect field. Nearly every LCD and other flat panel display is connected with a polymer adhesive. The Z‐axis adhesives are also beginning to enable high density multilayer circuits and MCMs to be built more effectively. Finally, Z‐axis appears to offer the simplest and most cost‐effective means for flip chip bonding. However, special equipment is required. The paper compares the metallurgical solder joint, the present de facto standard, with the polymer composite bond to highlight similarities and important differences. All types of conductive adhesives are discussed including the latest — Area Array Z‐axis types. Bonding materials, assembly processes and performance are also covered.