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This paper describes a new approach for the design of multilayer reinforcements of textile composite materials and products. We offer an alternative to multilayer complex fabrics for which the laminates of the composite reinforcement material consist of orthogonal woven fabrics with an original variable structure when each fabric layer is composed of alternating one‐ply (one warp and one weft) and one and‐ a‐half‐ply (one warp and two wefts) sections. Combination of these sections produces a “gearing” effect, preventing the delamination of textile composites in the process of their exploitation. An important aspect of the proposed method is a possibility to design woven fabrics in concurrence with the dimensions of the composite product and conditions of its exploitation; this leads to a substantial improvement of many properties of such composite product.

The purpose of this paper is to simulate and investigate the thermomechanical properties of graphene-reinforced nanocomposites.

The analysis proposed consists of two stages. In the first stage, the temperature-dependent mechanical properties of graphene are estimated while in the second stage, using the previously derived properties, the temperature-dependent properties of graphene-reinforced PMMA nanocomposites are investigated. In the first stage of the analysis, graphene is modeled discretely using molecular mechanics theory where the interatomic interactions are simulated by spring elements of temperature-dependent stiffness. The graphene sheets are composed of either one or more (up to five) monolayer graphene sheets connected via van der Waals interactions. However, in the second analysis stage, graphene is modeled equivalently as continuum medium and is positioned between two layers of PMMA. Also, the interphase between two materials is modeled as a medium with mechanical properties defined and bounded by the two materials.

The mechanical properties including Young’s modulus, shear modulus and Poisson’s ratio due to temperature changes are estimated. The numerical results show that the temperature rise and the multiplicity of graphene layers considered lead to a decrease of the mechanical properties.

The present analysis proposes an easy and accurate method for the estimation of the temperature-dependent mechanical properties of graphene-reinforced nanocomposites.

The purpose of this paper is to investigate the mechanical behavior of textile-reinforced concrete (TRC)-strengthened concrete columns with small eccentricity under chloride-wet-dry cycles.

A total of ten reinforced concrete (RC) columns were constructed and subjected to eccentric compression, and the effects of the slenderness ratio, a variable number of wet-dry cycles and the coupled effect of loading and a chloride environment were analyzed. One of the columns tested was unreinforced, whereas the remaining columns were strengthened laterally with TRC.

The results showed that a reduction in the slenderness ratio was conducive to the improvement of the bearing capacity of the reinforced column; however, the reinforcement effect of TRC tended to decrease with an increasing number of wet-dry cycles, and the coupled effect of loading and a chloride environment significantly degraded the compression performance of TRC-strengthened columns, with the damage becoming more serious with increase in the sustained load ratio.

In the next test, the duration of chloride-wet-dry cycles will be extended. In the same time, to obtain a clearer trend, the authors will also increase the number of specimens to obtain more data for drawing general conclusions.

The originality is to explore the feasibility of using cement-based materials (TRC) as a confinement technique in chloride environment. The investigations demonstrate that TRC has a good reinforcement effect on the concrete columns under chloride-wet-dry cycles. Finally, influence of each parameter is analyzed, which can be used as reference and foundation in actual application.

Emerging ‘chip‐size’ packages, and bare flip‐chips, require new substrate properties if high lead count chips are to be reliably interconnected on printed wiring boards and multichip modules at low cost. Blind via holes have been shown to increase interconnect density significantly without adding layers which contribute to high cost. Until recently, the use of blind vias has been limited to high‐end applications since standard fabrication methods, either sequential lamination or controlled depth drilling, are too slow and expensive for most high volume commercial applications. To maintain a low layer count while interconnecting higher I/O packages, commercial and consumer electronics require a substrate technology which supports high speed, micro‐via hole formation. This paper describes a process for fabricating high speed micro‐vias in dimensionally stable non‐woven Aramid reinforced laminates using laser ablation technology. Laser equipment capable of producing over 100 blind micro‐via holes per second is discussed. The process steps of hole cleaning and plating are reviewed, showing how existing PWB manufacturing technologies can be used. This process is compared with other methods of generating small holes and blind vias in printed wiring boards. In addition, requirements for flip‐chip and chip‐size packages, including a coefficient of thermal expansion of <10 ppm/°C and thin laminate dimensional stability of <0.03%, are explained.

The experience of using space apparatus type Shuttle testifies the unreliability of an applied design of a thermostable cover for flying apparatus made of separate tiles. To prevent burning through corps at branch and loss of separate heat-resistant termostable tiles when descending to earth from space, the technological idea of a continuous thermostable heat-resistant composite cover of flying apparatus for protection against dangerous effects of flame when landing on earth was introduced. The study also offers the idea of transformation of separate thermostable tiles in a continuous covering.

The purpose of this paper is to consider the static analysis of nanocomposite plates. Nanocomposites consist of a small amount of nanoscale reinforcements which can have an observable effect on the macroscale properties of the composites.

In the present study the reinforcements considered are non‐spherical, high aspect ratio fillers, in particular nanometer‐thin platelets (clays) and nanometer‐diameter cylinders (carbon nanotubes, CNTs). These plates are considered simply supported with a bi‐sinusoidal pressure applied at the top. These conditions allow the solving of the governing equations in a closed form. Four cases are investigated: a single layered plate with CNT reinforcements in elastomeric or thermoplastic polymers, a single layered plate with CNT reinforcements in a polymeric matrix embedding carbon fibers, a sandwich plate with external skins in aluminium alloy and an internal core in silicon foam filled with CNTs and a single layered plate with clay reinforcements in a polymeric matrix. A short review of the most important results in the literature is given to determine the elastic properties of the suggested nanocomposites which will be used in the proposed static analysis. The static response of the plates is obtained by using classical two‐dimensional models such as classical lamination theory (CLT) and first order shear deformation theory (FSDT), and an advanced mixed model based on the Carrera Unified Formulation (CUF) which makes use of a layer‐wise description for both displacement and transverse stress components.

The paper has two aims: to demonstrate that the use of classical theories, originally developed for traditional plates, is inappropriate to investigate the static response of nanocomposite plates and to quantify the beneficial effect of the nanoreinforcements in terms of static response (displacements and stresses).

In the literature these effects are usually given only in terms of elastic properties such as Young moduli, shear moduli and Poisson ratios, and not in terms of displacements and stresses.

Currently, the most widely used Printed Circuit Board (PCB) base material is the glass reinforced epoxy known as FR‐4. To improve the electrical or the thermomechanical performance of PCBs, there are two possibilities from a material standpoint: a modification or change of the resin system and a change of the reinforcement. Currently, there are a number of resins used for high performance PCB base materials. These resin systems offer higher Tgs and lower z‐axis‐expansions for improved through hole reliability. Non‐halogenated epoxy resin systems are offered for the production of green PCBs. In addition to new resins, new reinforcements are available for use in PCBs. Which can improve the electrical parameters of the base material and the x and y axis‐ thermal expansion also changes with the use of those reinforcements. This paper compares the thermomechanical and electrical parameters of some new high performance and green base materials with the glass reinforced epoxy materials commonly used in both high layer count boards and microvia applications.

This paper reviews some of the technology trends making it necessary to take the performance of laminate materials into account when designing and fabricating high speed PWBs. It also reviews the available materials for current matched impedance circuitry and discusses the various combinations of polymer resins and reinforcements used in these applications. Additionally, it provides a look at the new materials technologies being applied to high speed applications and what candidates hold most promise for achieving greater signal speeds via lowered dielectric constant while maintaining the compatibility with existing fabrication processes.

A new aramid base material for use in laminates to be applied to advanced surface mount technology was developed. A new fibre based on PPDETA (Poly‐p‐phenylene/3,4'‐diphenylether terephthalamide) was found to have negative thermal and hygroscopic expansion coefficients, low ionic impurities and high affinity to epoxy and polyimide resins. The fibre was processed into fabrics and papers to be used as a base material for printed circuit boards for advanced surface mount technology. Impregnation with a new epoxy resin with high purity and high temperature resistance implemented the development of a new laminate with minimal electromigration and high dimensional stability. Thus, a new laminate was developed to be used for LCCC, PGA, COB, TAB, Flip‐Chips and other advanced surface mount technologies. Reliability of the laminate to electromigration between surface conductors, between plated‐through barrels, and between opposed conductors was found to be one of the highest available today. These types of behaviour were related to the high purity and high temperature resistance of both the reinforcement material and the resin. The short life of through‐hole plating in thermal shock was improved by the application of a new plating technology. Application to multilayer boards and laminates with a low dielectric constant is also being investigated.

High demands are placed on base materials for present‐day printed circuits. The requirements for multilayer materials are examined including satisfying criteria regarding low dielectric constant, high glass transition temperature and dimensional stability. Comparisons are made involving different resin systems and reinforcement materials. Improvements in material characteristics are often accompanied by disadvantages in terms of processability, copper peel strength and price. The properties of a number of paper‐based laminates and their requirements are discussed. It is concluded that no ‘ideal’ base material is available which simultaneously fulfills all demands including price.