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Due to the miniaturization of electronic devices, the increased current density through solder joints leads to the occurrence of electromigration failure, thereby reducing the reliability of electronic devices. The purpose of this study is to propose a finite element-artificial neural network method for the prediction of temperature and current density of solder joints, and thus provide reference information for the reliability evaluation of solder joints.

The temperature distribution and current density distribution of the interconnect structure of electronic devices were investigated through finite element simulations. During the experimental process, the actual temperature of the solder joints was measured and was used to optimize the finite element model. A large amount of simulation data was obtained to analyze the neural network by varying the height of solder joints, the diameter of solder pads and the magnitude of current loads. The constructed neural network was trained, tested and optimized using this data.

Based on the finite element simulation results, the current is more concentrated in the corners of the solder joints, generating a significant amount of Joule heating, which leads to localized temperature rise. The constructed neural network is trained, tested and optimized using the simulation results. The ANN 1, used for predicting solder joint temperature, achieves a prediction accuracy of 96.9%, while the ANN 2, used for predicting solder joint current density, achieves a prediction accuracy of 93.4%.

The proposed method can effectively improve the estimation efficiency of temperature and current density in the packaging structure. This method prevails in the field of packaging, and other factors that affect the thermal, mechanical and electrical properties of the packaging structure can be introduced into the model.

This study aims to discuss the state-of-the-art digital factory (DF) development combining digital twins (DTs), sensing devices, laser additive manufacturing (LAM) and subtractive manufacturing (SM) processes. The current shortcomings and outlook of the DF also have been highlighted. A DF is a state-of-the-art manufacturing facility that uses innovative technologies, including automation, artificial intelligence (AI), the Internet of Things, additive manufacturing (AM), SM, hybrid manufacturing (HM), sensors for real-time feedback and control, and a DT, to streamline and improve manufacturing operations.

This study presents a novel perspective on DF development using laser-based AM, SM, sensors and DTs. Recent developments in laser-based AM, SM, sensors and DTs have been compiled. This study has been developed using systematic reviews and meta-analyses (PRISMA) guidelines, discussing literature on the DTs for laser-based AM, particularly laser powder bed fusion and direct energy deposition, in-situ monitoring and control equipment, SM and HM. The principal goal of this study is to highlight the aspects of DF and its development using existing techniques.

A comprehensive literature review finds a substantial lack of complete techniques that incorporate cyber-physical systems, advanced data analytics, AI, standardized interoperability, human–machine cooperation and scalable adaptability. The suggested DF effectively fills this void by integrating cyber-physical system components, including DT, AM, SM and sensors into the manufacturing process. Using sophisticated data analytics and AI algorithms, the DF facilitates real-time data analysis, predictive maintenance, quality control and optimal resource allocation. In addition, the suggested DF ensures interoperability between diverse devices and systems by emphasizing standardized communication protocols and interfaces. The modular and adaptable architecture of the DF enables scalability and adaptation, allowing for rapid reaction to market conditions.

Based on the need of DF, this review presents a comprehensive approach to DF development using DTs, sensing devices, LAM and SM processes and provides current progress in this domain.

The purpose of this study is to propose a precise and standardized strategy for numerically simulating vehicle aerodynamics.

Error sources in computational fluid dynamics were analyzed. Additionally, controllable experiential and discretization errors, which significantly influence the calculated results, are expounded upon. Considering the airflow mechanism around a vehicle, the computational efficiency and accuracy of each solution strategy were compared and analyzed through numerous computational cases. Finally, the most suitable numerical strategy, including the turbulence model, simplified vehicle model, calculation domain, boundary conditions, grids and discretization scheme, was identified. Two simplified vehicle models were introduced, and relevant wind tunnel tests were performed to validate the selected strategy.

Errors in vehicle computational aerodynamics mainly stem from the unreasonable simplification of the vehicle model, calculation domain, definite solution conditions, grid strategy and discretization schemes. Using the proposed standardized numerical strategy, the simulated steady and transient aerodynamic characteristics agreed well with the experimental results.

Building upon the modified Low-Reynolds Number k-e model and Scale Adaptive Simulation model, to the best of the authors’ knowledge, a precise and standardized numerical simulation strategy for vehicle aerodynamics is proposed for the first time, which can be integrated into vehicle research and design.

This study aims to investigate the possible defects and their root causes in a soft-termination multilayered ceramic capacitor (MLCC) when subjected to a thermal reflow process.

Specimens of the capacitor assembly were subjected to JEDEC level 1 preconditioning (85 °C/85%RH/168 h) with 5× reflow at 270°C peak temperature. Then, they were inspected using a 2 µm scanning electron microscope to investigate the evidence of defects. The reliability test was also numerically simulated and analyzed using the extended finite element method implemented in ABAQUS.

Excellent agreements were observed between the SEM inspections and the simulation results. The findings showed evidence of discontinuities along the Cu and the Cu-epoxy layers and interfacial delamination crack at the Cu/Cu-epoxy interface. The possible root causes are thermal mismatch between the Cu and Cu-epoxy layers, moisture contamination and weak Cu/Cu-epoxy interface. The maximum crack length observed in the experimentally reflowed capacitor was measured as 75 µm, a 2.59% difference compared to the numerical prediction of 77.2 µm.

This work's contribution is expected to reduce the additional manufacturing cost and lead time in investigating reliability issues in MLCCs.

Despite the significant number of works on the reliability assessment of surface mount capacitors, work on crack growth in soft-termination MLCC is limited. Also, the combined experimental and numerical investigation of reflow-induced reliability issues in soft-termination MLCC is limited. These cited gaps are the novelties of this study.

This paper aims to present two Anand’s model parameter sets for the multilayer silver–tin (AgSn) transient liquid phase (TLP) foils.

The AgSn TLP test samples are manufactured using pre-defined optimized TLP bonding process parameters. Consequently, tensile and creep tests are conducted at various loading temperatures to generate stress–strain and creep data to accurately determine the elastic properties and two sets of Anand model creep coefficients. The resultant tensile- and creep-based constitutive models are subsequently used in extensive finite element simulations to precisely survey the mechanical response of the AgSn TLP bonds in power electronics due to different thermal loads.

The response of both models is thoroughly addressed in terms of stress–strain relationships, inelastic strain energy densities and equivalent plastic strains. The simulation results revealed that the testing conditions and parameters can significantly influence the values of the fitted Anand coefficients and consequently affect the resultant FEA-computed mechanical response of the TLP bonds. Therefore, this paper suggests that extreme care has to be taken when planning experiments for the estimation of creep parameters of the AgSn TLP joints.

In literature, there is no constitutive modeling data on the AgSn TLP bonds.

This study aims to propose an aerodynamic force decomposition which, for the first time, allows for thrust/drag bookkeeping in two-dimensional viscous and unsteady flows. Lamb vector-based far-field methods are used at the scope, and the paper starts with extending recent steady compressible formulas to the unsteady regime.

Exact vortical force formulas are derived considering inertial or non-inertial frames, viscous or inviscid flows, fixed or moving bodies. Numerical applications to a NACA0012 airfoil oscillating in pure plunging motion are illustrated, considering subsonic and transonic flow regimes. The total force accuracy and sensitivity to the control volume size is first analysed, then the axial force is decomposed and results are compared to the inviscid force (thrust) and to the steady force (drag).

Two total axial force decompositions in thrust and drag contributions are proposed, providing satisfactory results. An additional force decomposition is also formulated, which is independent of the arbitrary pole appearing in vortical formulas. Numerical inaccuracies encountered in inertial reference frames are eliminated, and the extended formulation also allows obtaining an accurate force prediction in presence of shock waves.

No thrust/drag bookkeeping methodology was actually available for oscillating airfoils in viscous and compressible flows.

This paper aims to investigate the moisture diffusion behavior in a system-in-package module systematically by moisture-thermalmechanical-coupled finite element modeling with different structure parameters under increasingly harsh environment.

A finite element model for a system-in-package module was built with moisture-thermal-mechanical-coupled effects to study the subsequences of hygrothermal conditions.

It was found in this paper that the moisture diffusion path was mainly dominated by hygrothermal conditions, though structure parameters can affect the moisture distribution. At lower temperatures (30°C~85°C), the direction of moisture diffusion was from the periphery to the center of the module, which was commonly found in simulations and literatures. However, at relatively higher temperatures (125°C~220°C), the diffusion was from printed circuit board (PCB) to EMC due to the concentration gradient from PCB to EMC across the EMC/PCB interface. It was also found that there exists a critical thickness for EMC and PCB during the moisture diffusion. When the thickness of EMC or PCB increased to a certain value, the diffusion of moisture reached a stable state, and the concentration on the die surface in the packaging module hardly changed. A quantified correlation between the moisture diffusion coefficient and the critical thickness was then proposed for structure parameter optimization in the design of system-in-package module.

The different moisture diffusion behaviors at low and high temperatures have seldom been reported before. This work can facilitate the understanding of moisture diffusion within a package and offer some methods about minimizing its effect by design optimization.

The aim of this study is to make a contribution towards reducing the deflections of silicon wafers. The deformation of silicon wafers used in the manufacture of electronic micro-components is one of the most common problems encountered by industrialists during manufacturing. Stack warping is typically produced during the process of depositing thin layers on a substrate. This is due to the thermal-mechanical stresses caused by the difference between the thermal expansion coefficients of the materials. Reducing wafer deformation is essential to increase reliability and improve quality. In this paper, the authors propose an approach based on minimal geometrical modifications to reduce the deformation of a silicon wafer coated with two thin layers. Numerical finite element models have been developed to evaluate the impact of geometrical modifications on warping amplitude. Finite element models have been validated compared with experimental models. The results obtained are encouraging and clearly show a considerable reduction in wafer deformation.

Reducing wafer deformation is essential to increase reliability and improve quality. In this paper, the authors propose an approach based on minimal geometrical modifications to reduce the deformation of a silicon wafer coated with two thin layers. Numerical finite element models have been developed to evaluate the impact of geometrical modifications on warping amplitude. Finite element models have been validated compared with experimental models.

The results obtained are encouraging and clearly show a considerable reduction in wafer deformation.

This paper describes the influence of geometric modification on wafer deformation. The work show also the cruciality of stress reduction in the purpose to obtain less wafer deformation.

To improve the speed and accuracy of turbine blade film cooling design process, the most advanced deep learning models were introduced into this study to investigate the most suitable define for prediction work. This paper aims to create a generative surrogate model that can be applied on multi-objective optimization problems.

The latest backbone in the field of computer vision (Swin-Transformer, 2021) was introduced and improved as the surrogate function for prediction of the multi-physics field distribution (film cooling effectiveness, pressure, density and velocity). The basic samples were generated by Latin hypercube sampling method and the numerical method adopt for the calculation was validated experimentally at first. The training and testing samples were calculated at experimental conditions. At last, the surrogate model predicted results were verified by experiment in a linear cascade.

The results indicated that comparing with the Multi-Scale Pix2Pix Model, the Swin-Transformer U-Net model presented higher accuracy and computing speed on the prediction of contour results. The computation time for each step of the Swin-Transformer U-Net model is one-third of the original model, especially in the case of multi-physics field prediction. The correlation index reached more than 99.2% and the first-order error was lower than 0.3% for multi-physics field. The predictions of the data-driven surrogate model are consistent with the predictions of the computational fluid dynamics results, and both are very close to the experimental results. The application of the Swin-Transformer model on enlarging the different structure samples will reduce the cost of numerical calculations as well as experiments.

The number of U-Net layers and sample scales has a proper relationship according to equation (8). Too many layers of U-Net will lead to unnecessary nonlinear variation, whereas too few layers will lead to insufficient feature extraction. In the case of Swin-Transformer U-Net model, incorrect number of U-Net layer will reduce the prediction accuracy. The multi-scale Pix2Pix model owns higher accuracy in predicting a single physical field, but the calculation speed is too slow. The Swin-Transformer model is fast in prediction and training (nearly three times faster than multi Pix2Pix model), but the predicted contours have more noise. The neural network predicted results and numerical calculations are consistent with the experimental distribution.

This paper creates a generative surrogate model that can be applied on multi-objective optimization problems. The generative adversarial networks using new backbone is chosen to adjust the output from single contour to multi-physics fields, which will generate more results simultaneously than traditional surrogate models and reduce the time-cost. And it is more applicable to multi-objective spatial optimization algorithms. The Swin-Transformer surrogate model is three times faster to computation speed than the Multi Pix2Pix model. In the prediction results of multi-physics fields, the prediction results of the Swin-Transformer model are more accurate.

This paper aims to investigates a novel design of a modular moving magnet linear oscillating actuator (MMM-LOA) with the capability of coupling modules, based on their application and space requirements.

Proposed design comprised of modules, and modules are separated by using nonmagnetic materials. Movable part of the proposed design of LOA is composed of permanent magnets (PMs) having axial magnetization direction and tubular structure. Stator of the proposed design is composed of one coil individually in a module. Dimensions of the design parameters are optimized through parametric analysis using COMSOL Multi Physics software. This design is analyzed up to three modules and their response in term of electromagnetic (EM) force and stroke are presented. Influence of adding modules is analyzed for both directions of direct current (DC) and alternating input loadings.

Proposed LOA shows linear increase in magnitude of EM force by adding modules. Motor constant of the investigated LOA is 264 N/A and EM force per PM mass is 452.389 N/kg, that shows significant improvement. Moreover, proposed LOA operates in feasible region of stroke for compressor application. Furthermore, this design uses axially magnetized PMs which are low cost and available in compact tubular structure.

Proposed LOA shows the influence of adding modules and its effect in term of EM force is analyzed for DC and alternating current (AC). Moreover, overall performance and structural topology is compared with state-of-the-art designs of LOA. Improvement with regard of motor constant and EM force per PM mass shows originality and scope of this paper.