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This study aims to research properties of Cu/SAC0307 mixed solder balls/Al joints with different bonding temperature under ultrasonic-assisted.

A new method that 1 mm Zn particles and Sn-0.3Ag-0.7 (SAC0307) with a particle size of 25–38 mm were mixed to fill the joint and successfully achieved micro-joining of Cu/Al under ultrasonic-assisted.

The results indicated that when the bonding temperature was 180°C, there was only one layer of CuZn₅ intermetallic compounds (IMCs) at the Cu interface. However, when the bonding temperature was 190°C, 200°C and 210°C, the Cu interface IMCs had two layers: for one layer, the IMCs near the Cu substrate were Cu₅Zn₈ and for another layer, the IMCs near the solder were CuZn₅. In addition, the thickness of the Cu interfacial IMCs increased with the bonding temperature. In particular, the thickness of IMCs at the Cu interface of the Cu/Al joints soldered at 210°C was 4.6 µm, which increased by 139.6% compared with that of the Cu/Al joints soldered at 180°C. However, there was no IMC layer at the Al interface, but there might be a Zn–Al solid solution layer. The shear strength of Cu/Al joints soldered at 180°C was only 15.01 MPa, but as the soldering temperature continued to increase, the shear strength of the Cu/Al joints increased rapidly. When the soldering temperature was 200°C, the shear strength of the Cu/Al joints reached the maximum of 38.07 MPa, which was 153.6% higher than that at 180°C. When the soldering temperature was 180°C, the fracture of Cu/Al joints was mainly on the Al side. However, when soldering temperature was 190°C, 200°C and 210°C, the fracture of Cu/Al joints was mainly broken in the Zn particles layer.

A new method that 1 mm Zn particles and Sn-0.3Ag-0.7 (SAC0307) with a particle size of 25–38 mm were mixed to fill the Cu/Al joint at 210°C.

This study aims to review the effect of copper percentage in Sn-based solder alloys (Sn-xCu, x = 0–5 Wt.%) on intermetallic compound (IMC) formation and growth after laser soldering.

This study reviews the interfacial reactions at the solder joint interface, solder joint morphology and the theory on characterizing the formation and growth of IMCs. In addition, the effects of alloying and strengthening mechanism, including wettability, melting and mechanical properties are discussed.

This paper presents a comprehensive overview of the composition of tin-copper (Sn-Cu) solders with a potential to enhance their microstructure, mechanical characteristics and wettability by varying the Cu percentage. The study found that the best Cu content in the Sn-xCu solder alloy was 0.6–0.7 Wt.%; this composition provided high shear strength, vibration fracture life value and ideal IMC thickness. A method of solder alloy preparation was also found through powder metallurgy and laser soldering to improve the solder joint reliability.

This study focuses on interfacial reactions at the solder joint interface, solder joint morphology, modelling simulation of joint strength and the theory on characterising the formation and growth of IMC.

The paper comprehensively summarises the useful findings of the Sn-Cu series. This information will be important for future trends in laser soldering on solder joint formation.

The purpose of this study was to examine the influence of adding a small amount of Ti to a Cu-based alloy, specifically the commercial Hyper Titanium Copper alloy (C1990 HP), which contains Cu-3.28 wt.% Ti, on its interfacial reaction with Sn-9.0 wt.% Zn (SnZn) solder, using the liquid/solid reaction couple technique.

The SnZn/C1990 HP couples were subjected to a reaction temperature of 240–270°C for a duration of 0.5–5 h. The resulting reaction couple was characterized using a scanning electron microscope, energy dispersive spectrometer, electron probe microanalyzer and X-ray diffractometer.

It was observed that the scallop-shaped CuZn5 and planar Cu5Zn8 phases were formed in almost all SnZn/C1990 HP couples. With increased reaction duration and temperature, the Cu-rich intermetallic compound (IMC)-Cu5Zn8 phase became a dominant IMC formed at the interface. The total thickness of the IMCs was increased with the increase in the reaction duration and temperature. The IMC growth obeyed the parabolic law, and the IMC growth mechanism was diffusion controlled. The activation energy of the SnZn/C1990 HP couple was 64.71 kJ/mol.

This article presents an analysis of the IMC thickness in each sample using ImageJ software, followed by kinetic analysis using Origin software at various reaction temperatures of SnZn/C1990 HP in liquid/solid couples. The study also includes detailed reports on the morphology, interface composition and X-ray diffraction analysis, as well as the activation energy. The findings can serve as a valuable reference for electronic packaging companies that utilize C1990 HP substrates.

This study aims to evaluate the effect of thermal aging temperature on the properties of Cu/Cu joints.

A new method that 1 um Zn-particles and Sn-0.3Ag-0.7Cu (SAC0307) with a particle size of 25–38 µm were mixed to fill the joint and successfully achieved the micro-joining of Cu/Cu under ultrasonic-assisted at low-temperature, and then the effect of thermal aging temperature on the properties of Cu/Cu joints was researched.

The composition of the intermetallic compounds (IMCs) on the upper and lower interfaces of Cu/SACZ/Cu joints remained unchanged, which was Cu₅Zn₈ in aging process, and the thickness of the IMCs on the upper and lower interfaces of the Cu/SACZ/Cu joints increased accordingly. Compared with the as-received joints, the thickness of the upper and lower interfaces IMCs of the soldering aged time for 24 h increased by 404.7% and 505.5% at 150ºC, respectively. The IMCs formation tendency and the IMCs growth rate of the lower interface are larger than those of the upper interface because the soldering seam near the IMCs at the upper and lower interfaces of the as-received joints were mostly white SAC0307 balls black Zn-particles, respectively. The growth activation energy of IMCs in the upper and lower interfaces is about 89.21 and 55.11 kJ/mol, respectively. Under the same aging time, with the increase of the aging temperature, the shear strength of Cu/SACZ/Cu joints did not change significantly at first before 150ºC. When the aging temperature reached 150ºC, the shear strength of the joints decreased significantly; the shear strength of the joints was the smallest at 150ºC for 24 h, which was 39.4% lower than that of the as-received joints because the oxidation degree of Zn particles in the joint with the increase of aging temperature and time.

Cu/Cu joints were successfully achieved under ultrasonic-assisted at low-temperature.

This study aims to research properties of Cu/SAC0307 mixed solder balls/Cu joints with different Zn-particles content at low-temperature under ultrasonic assisted.

A new method that 1µm Zn particles and Sn-0.3Ag-0.7 (SAC0307) with a particle size of 25–38 µm were mixed to fill the joint and successfully achieved micro-joining of Cu/Cu under ultrasonic-assisted at low temperature.

The results showed that with a continuous increase in the Zn-particle content, the interfacial intermetallic compounds (IMCs) of the upper and lower interfaces of joints gradually changed from scallop-shaped Cu₆Sn₅ to wavy-shaped Cu₅Zn₈. Moreover, the IMC thickness of the upper/lower interface of joints first decreased and then increased with increasing Zn-particle content. The shear strengths of joints increased with Zn-particle content, the shear strength of joints went to a maximum of 29.76 MPa when the Zn-particle content was 40%, an increase of 62.6% compared to joints without Zn particles. However, as the Zn-particle content continued to increase, the shear strengths of the joints decreased. Additionally, when the Zn content increased to 50%, because the oxidation degree of Zn particles increased, the joints were mainly broken among Zn particles.

A new method that 1µm Zn particles and Sn-0.3Ag-0.7 (SAC0307) with a particle size of 25–38 µm were mixed to fill the Cu/Cu joint at 180°C.

The purpose of this study is to provide quantitative information on the growth of Islamic finance literature. The study focused on publishing trends, countries producing research on Islamic finance, key authors, major contributing organizations, authorship patterns, keywords and articles with the highest citations.

Bibliometric analysis is applied to analyse the growth and publishing trends in Islamic finance literature. The Web of Science (WoS) database was used to extract bibliometric data covering the period 1939–2019 for Islamic finance literature.

The study finds that Islamic finance research has gained remarkable momentum in the literature. However, such growth is largely manifested in Malaysia because of a conducive atmosphere for this type of research. Interestingly, the study finds that the three most productive journals are located in the UK and Malaysia, while Professor M. Kabir Hassan from the University of New Orleans, the USA appears to head the list of authors with 23 publications on Islamic finance.

This study provides up-to-date literature on the current state of Islamic finance in the world; as a result, it supports the development of policies by the Islamic finance industry. The findings of the study also serve as a reference point for Islamic finance training and educational institutions.

Islamic finance is an emerging financial discipline; as such, there is a need for more awareness of this financial system in the world. Muslim-majority countries, especially Saudi Arabia, Turkey, Indonesia, the United Arab Emirates (UAE), Pakistan and Bahrain, have to include Islamic finance in their curriculum and establish research institutions and research journals. In addition, Arabic language journals should be indexed in WoS and/or Scopus to provide a high-quality publication platform. This study provides a more comprehensive bibliometric analysis on the growth of Islamic finance literature (1939–2019) in the WoS database; most of the prior studies have covered relatively few areas of focus and a lower range of years in some cases.

The purpose of this study is to analyze the factors affecting startup development and the entrepreneurship ecosystem's contribution to it.

A quantitative methodology is used for data collection from different startup owners working across Pakistan. It is a cross-sectional descriptive study, which investigates the causal effect of variables at a definite point in time. Non-probability convenient sampling was used for selecting available startups from the incubation centers. The sampling framework consists of the founders of the startups that have been previously incubated at any of the selected incubation centers.

Regression analysis results from 165 responses of entrepreneurs and incubation centers demonstrate that the most important factors affecting startup development were financial access, government support, marketing challenges, education, technology and managerial skills in order of occurrence. Entrepreneurship ecosystem also proved to have a very positive impact on the relationship of these factors with startup development.

In this paper, the factors that affect the development of startup are analyzed and recommendations are provided.

This research is comprehensive, as we have collected data from actual entrepreneurs and incubation centers to explain how entrepreneurs initiate their startup business by considering their managerial skills. As such, this study is unique in that the data comes from newly developed incubations centers in one of South Asia's fastest-growing economies.

In a modern business scenario, firms have implemented customer-centric approaches to enable customer relationship management (CRM) to trigger business excellence. Business strategies are modernizing business marketing operations that mainly focused on the retention of profitable customers. The purpose of this study is to empirically investigate the impact of marketing strategies (MS), information technology support (IT-S) and knowledge sharing (KS) in the effect of CRM in the pharmaceutical sector of Punjab, Pakistan.

Data were collected from the field force of national and international pharmaceuticals companies (N = 263) through a convenience sampling technique. Partial least squares structural equation modeling was used to examine data in SmartPLS 3.2.6.

The results indicated that IT-S and KS mediate the relationship between MS and CRM. More specifically, MS positively develops CRM through IT-S and KS.

This research contributes to the existing literature of pharmaceuticals by disclosing the field-force (medical representatives) specific role in developing CRM performance between pharmaceuticals firms and health-care physicians that are mainly based on knowledge advancement and influence these firms to adopt customer-centric business approaches to gain a competitive advantage to drive firm profitability.

Organizations are facing pressure to reduce costs of training and enhancing the role of self-development that is self-driven and contextual in nature as a means to supplement employee development. The purpose of this study is to investigate the influence of individual and situational factors on self-development as well as the moderating role of situational factors. Individual factors are referred to personal characteristics, i.e. learning goal orientation and proactive personality, while situational factors are environmental conditions, including job autonomy and empowering environment.

Data were gathered from 280 middle managers of the banking sector. Partial least squares structural equation modeling was conducted to validate the model.

The study findings revealed a significant direct relationship of individual (learning goal orientation and proactive personality) and situational (empowering environment and job autonomy) factors with self-development. The study also found only a significant moderating effect of empowering environment in relation to learning goal orientation and self-development, correspondingly job autonomy moderates the relationship of proactive personality and self-development.

The study concludes with offering some implication for organization to focus on self-development activities by providing an empowering environment and job autonomy to its employees, which will result to minimize the overall cost of training. Organizations should also identify the individual factors that lead to self-development like proactive personality and learning goal orientation.

This study gives new insight on the predictors of self-development and their interaction. This study may be a pioneer to empirically validate a theoretical model about the interaction of situational factors between individual factors and self-development. Furthermore, it contributes and advances our knowledge by demonstrating how individual and situational factors are influencing middle mangers’ self-development in workplace.

Marketing, e-marketing, strategy.

Suited for final-year undergraduate and graduate courses in marketing strategy, strategic sales management, e-marketing and internet businesses.

This case follows the evolution of Mech Technologies and Website Portals Division within the company. CEO of the company who was also heading the division was grappling an unprofitable venture. A dilemma of competitors offering free services while his portals were devoid of matching revenue stream added to his woes as he was strategizing a turnaround. Readers get an insightful review of the industry, key competitors as well as emerging challenges.

Developing marketing strategy for a small organization in an emerging market. Learning about evolution and challenges faced by internet businesses in developing economies.

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